JPS63146698A - Manufacture of two-dimension array transducer - Google Patents
Manufacture of two-dimension array transducerInfo
- Publication number
- JPS63146698A JPS63146698A JP61293897A JP29389786A JPS63146698A JP S63146698 A JPS63146698 A JP S63146698A JP 61293897 A JP61293897 A JP 61293897A JP 29389786 A JP29389786 A JP 29389786A JP S63146698 A JPS63146698 A JP S63146698A
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric plate
- dicing
- conductor
- backing material
- elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000004020 conductor Substances 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 7
- 230000008878 coupling Effects 0.000 abstract description 7
- 238000010168 coupling process Methods 0.000 abstract description 7
- 238000005859 coupling reaction Methods 0.000 abstract description 7
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract description 4
- 238000012856 packing Methods 0.000 abstract 3
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 238000003491 array Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 230000035606 childbirth Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は角柱状エレメントが碁盤目状に配列される２次
元アレイトランスデユーサの製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for manufacturing a two-dimensional array transducer in which prismatic elements are arranged in a grid pattern.
（従来の技術）
従来から、角柱状エレメントが基盤口状に配列される２
次元アレイ］・ランスデューサの製造する方法が）ト々
知られている。例えば、ＩＥＥＥ Ｔ）ＩＡＮＳ−ＡＣ
丁１ＯＮＳ ＯＮ ５ＯＮＩＣ３ＡＮＤ ＵＬＴ
ＲＡＳＯＮ［Ｃ３，ＶＯＬ、５Ｕ−１９゜ＮＯ，４，０
ＣＴＯＢ［Ｉｔ １９７２にその一例が開示されている
。(Prior art) Conventionally, 2
Methods for manufacturing dimensional arrays and transducers are well known. For example, IEEE T)IANS-AC
1ONS ON 5ONIC3AND ULT
RASON [C3, VOL, 5U-19°NO, 4,0
An example is disclosed in CTOB [It 1972.
上記開示によれば、２次元アレイトランスデユー１月ま
第２図（ａ）乃至（ｅ）に示す工程で作られる。According to the above disclosure, a two-dimensional array transducer is manufactured by the steps shown in FIGS. 2(a) to 2(e).
即ち、
（１）薄い圧電板１の一方の面を碁盤目状にダイシング
する（切込み、Ｇｉ厚さ方向の約９３ｘ）。これにより
１５％目状に配列された角柱状ニレメン１〜２が構成さ
れる（第２図（ａ））。That is, (1) One side of the thin piezoelectric plate 1 is diced in a checkerboard pattern (cutting depth: about 93x in Gi thickness direction). As a result, prismatic elmmen 1 and 2 arranged in a 15% grid pattern are formed (FIG. 2(a)).
（２）ダイシングしない側から角柱状エレメント２のコ
ーナにｄ通穴３を設ける（第２図（ｂ））。(2) A d through hole 3 is provided at the corner of the prismatic element 2 from the non-dicing side (FIG. 2(b)).
（３）バッキング材４（圧電板１に対向する面が導体膜
で被覆されている）に支持される絶縁被覆された導線５
をｄ通穴３に挿通し、バッキング材４を圧電板３に接合
して一体化する（第２図（Ｃ））。(3) Insulated conductor 5 supported by backing material 4 (the surface facing piezoelectric plate 1 is covered with a conductor film)
is inserted into the through hole 3, and the backing material 4 is joined to the piezoelectric plate 3 to integrate it (FIG. 2(C)).
（４）角柱状エレメント２側に導かれた導線５を各エレ
メント２の頭に半田付けする（第２図（ｄ）及び（ｅ）
。（ｄ１図では１０Ｘ１０個の角柱状エレメントが半田
付【）されており、（ｅ）図はそのミド田４ｊ（）部の
拡大図である）。半田付けされるエレメントの頭が個別
電（銅となり、ダイシングされないｆ′Ｊ：、電体１の
面に接合される導体膜が共通電極となる。(4) Solder the conductive wire 5 led to the prismatic element 2 side to the head of each element 2 (Fig. 2 (d) and (e))
. (In figure d1, 10×10 prismatic elements are soldered ( ), and figure (e) is an enlarged view of the middle field 4j ( )). The head of the element to be soldered becomes an individual electrode (copper f'J: which is not diced), and the conductive film bonded to the surface of the electric body 1 becomes a common electrode.
ところで、上記の方法による２次元アレイトランスデユ
ーサにＪ３いて、各エレメントは完全に切離されていな
いので、各ニレメン１〜間に音響的結合が存在する。こ
のような結合があると音響特性が低下づる。従って、音
響特性上から言えば２次元アレイトランスデユーサの各
エレメントは完全に切離されていた方が望ましい。By the way, in the two-dimensional array transducer J3 according to the above method, since each element is not completely separated, acoustic coupling exists between each element 1. If such a coupling exists, the acoustic characteristics will deteriorate. Therefore, from the viewpoint of acoustic characteristics, it is desirable that each element of the two-dimensional array transducer be completely separated.
（発明が解決しようとする問題点）
しかし、従来の′Ｉ！Ａ造方法にあっては、圧電板を完
全にダイシング、即ち上記工程（１）における切込みを
１００ｘにすると、各エレメントがばらばらにむるため
、Ｊｔ通ｔｔｉ極の引出し線の接続処理がガしくなる（
アース電極の引出し方が難しくなる）。(Problem to be solved by the invention) However, the conventional 'I! In the A manufacturing method, if the piezoelectric plate is completely diced, that is, the cut in step (1) above is made 100x, each element will be separated, making it difficult to connect the lead wires of the Jt through tti poles. (
(This makes it difficult to pull out the ground electrode.)
又、従来の製造方法にお（）る個別電極の引出し方法は
、各電極位置に対応さして圧電板に設ける貫通穴に引出
し線を挿通して行うようになっているため、その作業は
非常に煩わしいと言う問題がある。即ち、従来の製造方
法は、音響特性の敗色が難しい上に、お産に適していな
いと言える。In addition, the method of drawing out individual electrodes in the conventional manufacturing method (2) involves inserting lead wires into through holes provided in the piezoelectric plate corresponding to each electrode position, so the work is extremely time-consuming. There is a problem that is bothersome. In other words, it can be said that the conventional manufacturing method is difficult to deteriorate the acoustic characteristics and is not suitable for childbirth.
本発明は、かかる点に鑑みてなされたｂのであり、その
目的は、音響的結合が少ない２次元アレイトランスデユ
ーサを量産ザる製造方法を実現するにある。The present invention has been made in view of the above, and an object thereof is to realize a manufacturing method for mass producing two-dimensional array transducers with less acoustic coupling.
（問題点を解決するための手段）
上記目的を達成する本発明の２次元アレイ１〜ランスデ
ユーサの製造方法は、Ｚ方向に厚みをイｉし、両面が導
体化された圧電板をバッキング材に接着し、最初にＸ方
向に所定のピッチで、少なくともバッキング材との間に
導体部を残して圧゛電板をダイシングし、次にＸ方向に
所定のピッチで完全に圧電板をダイシングしてｔｆｆｆ
３目状に配列される角柱状ニレメン１〜を作り、これら
角柱状エレメントの番頭に１工５〕用導線を接続し、隣
合う角柱状ニレメン１〜間で形成される溝に設置して外
部に引出すと共に、バッキング材調の導体部を共通にし
てグラウンド用引出し線に接続するようになっている。(Means for Solving the Problems) A method of manufacturing a two-dimensional array 1 to a lance ducer according to the present invention that achieves the above object uses a piezoelectric plate having a thickness in the Z direction and conductive on both sides as a backing material. The piezoelectric plate is first diced at a predetermined pitch in the X direction, leaving at least a conductor part between it and the backing material, and then the piezoelectric plate is completely diced at a predetermined pitch in the X direction. tffff
Make the prismatic elements 1~ arranged in a 3-way pattern, connect the conductor wires for 1 work 5] to the numbers of these prismatic elements, install them in the grooves formed between the adjacent prismatic elements 1~, and connect them to the outside. At the same time, the backing material-like conductor part is connected to the ground lead wire.
（実施例） 以下、本発明について図面を参照して詳細に説明する。(Example) Hereinafter, the present invention will be explained in detail with reference to the drawings.
第１図は本発明の一実施例による！！ｌ造方法の工程の
説明図である。以下、（８１図から（ｅ）図に至る■稈
を説明する。尚、以下の説明において、圧電板の厚み方
向が２方向に、又、圧電板の而がＸ−ｙ面となっている
。FIG. 1 is according to one embodiment of the present invention! ! FIG. 1 is an explanatory diagram of the steps of the manufacturing method. The culm from Figure 81 to Figure (e) will be explained below. In the following explanation, the thickness direction of the piezoelectric plate is in two directions, and the thickness direction of the piezoelectric plate is in the X-y plane. .
（１）ＰＨ等の圧電板１１をバッキング材１２上に導電
性接を剤等で接着する。圧電板１１の両面は極めて薄い
膜１１ 及び１１ｂで被覆されている（両面が導体化さ
れている）（第１図（ａ））。(1) A piezoelectric plate 11 such as PH is bonded onto a backing material 12 using a conductive adhesive or the like. Both sides of the piezoelectric plate 11 are covered with extremely thin films 11 and 11b (both sides are made conductive) (FIG. 1(a)).
（２）圧電４ｊｉ１１を非接着側から少なくともバッキ
ング材１２との間に躾（６体部） ｂを残し、かつ、
Ｘ方向に所定のピップをちってダイシングする（第１図
（ｂ））。ダイシングの深さは膜１１、のみを残すのが
理想的であるが、圧電板を僅かに残すようにしてもよい
。(2) Leave a portion (6 body parts) b between the piezoelectric 4ji11 and at least the backing material 12 from the non-adhesive side, and
Dicing is performed by hitting a predetermined number of pips in the X direction (Fig. 1(b)). Ideally, the depth of dicing is such that only the film 11 is left, but it is also possible to leave a small amount of the piezoelectric plate.
（３）圧電板１１を非接着側からＸ方向に所定のピップ
をもって完全にダイシングする（第１図（１１））。(3) Completely dice the piezoelectric plate 11 from the non-adhesive side in the X direction with a predetermined pip (FIG. 1 (11)).
バッキング材１２上に■盤目状に配列される角柱状エレ
メント１３が作られる。Prismatic elements 13 arranged in a grid pattern are made on the backing material 12.
（４）角柱状ニレメン１−１３の番頭（導体部）１１ａ
に信号用導線１４を接続し、隣合う角柱状３９７２８間
で形成される溝１５に設置して外部に引出すく第１図（
ｄ）及び（Ｃ））。引出された信号用導線１４をクープ
ル１６に接続する。(4) Number head (conductor part) 11a of prismatic Niremen 1-13
Connect the signal conductor 14 to the 39728, install it in the groove 15 formed between the adjacent prismatic shapes 39728, and pull it out to the outside.
d) and (C)). The signal conductor 14 drawn out is connected to the couple 16.
（５）Ｘ方向に配列されるバッキング材調の導体部１１
ｂを共通にしてグラウンド用引出し線１７（共通アース
）に接続する（第１図（ｄ）及び（ｅ））、。(5) Conductor portions 11 made of backing material arranged in the X direction
b in common and connected to the ground lead wire 17 (common ground) (FIG. 1(d) and (e)).
グラウンド用引出し′ｆＡ１７はフレキシブルボードで
構成され、接続は導電性エポキシ等の￥Ｊ雷付性接着剤
よって行われる。The ground drawer 'fA17 is made of a flexible board, and the connection is made with a high-strength adhesive such as conductive epoxy.
」−記の各工程によって作られる２次元アレイ１〜ラン
スデユーりにおいて、角柱状エレメント１３は、Ｘ方向
ピッチが導体部のみを残すダイシングにより、又、Ｘ方
向ピッチが完全なダイシングによって形成される。＋３
？ｌｌＪ目状をなしてバッキング材１２Ｆに構成され
る（Ｘ方向ピップはときには僅かに圧電板を残している
こともあるが）。この構成により、角柱状エレメント１
３間にお【′Ｉる音響的結合が小さくなる。又、共通電
極とグラウンドとの接続はバッキング月例の導体部列を
共通にして行われる。更に、個別゛電極と引出し線との
接続は角暑］状」−レメント１３によって形成される溝
に収納する引出し線を立もあげて行われる。In the two-dimensional arrays 1 to 2D produced by the steps described in ``-'', the prismatic elements 13 are formed by dicing with a pitch in the X direction that leaves only the conductor portion, or by dicing with a pitch in the X direction that is complete. +3
? It is formed in the backing material 12F in the shape of llJ (although sometimes a small amount of the piezoelectric plate remains in the X direction pip). With this configuration, the prismatic element 1
The acoustic coupling between ['I] becomes smaller. Further, the connection between the common electrode and the ground is performed by using a common backing conductor row. Further, the connection between the individual electrodes and the lead wires is made by raising the lead wires housed in the grooves formed by the square elements 13.
（梵明の効果）
以ト説明の通り、本発明の２次元アレイトランスデユー
サの製造方法よれば、バッキング材をベースにしてｉ４
Ｗ！ｆＡ［ｌ状に配列される角柱状ニレメン］・群の中
で、■盤の一方の方向を示す溝に沿って配列される角柱
状エレメント列は少なくとも導体部を残すダイシングに
よって構成され、他の方向を示す溝に沿って配列される
角柱状ニレメン］−列はバッキング月に達りるダイシン
グによって構成されるため、角柱状ニレメン１−同土間
の３２Ｊ的結合が小さくなる。又、共通電極（バッキン
グ相開のノリ体部）とグラウンドとの接続を筒単に行う
ことができる。又、個別電帰の引出し線を角柱状エレメ
ント間で形成される溝に設置するため、個別電（参の配
線処理は貫通穴を挿通する作業に比べて簡単になる。従
って、本発明の製造方法によれば音響的結合を小さくし
た２次元アレイトランスデ１−サを過度することができ
る。(Effect of Brahma) As explained below, according to the method of manufacturing a two-dimensional array transducer of the present invention, i4
W! fA [prismatic elements arranged in an l-shape] - Among the groups, the prismatic element rows arranged along the grooves indicating one direction of the board are constructed by dicing that leaves at least a conductor part, and the other Since the prismatic elmmen arranged along the groove indicating the direction]-row is formed by dicing that reaches the backing moon, the 32J-like connection between the prismatic elmmen 1 and the doma becomes small. Further, the connection between the common electrode (backing phase open glue body part) and the ground can be easily made. Furthermore, since the lead wires of the individual electric wires are installed in the grooves formed between the prismatic elements, the wiring process for the individual electric wires is simpler than the work of inserting the through holes. The method allows for a two-dimensional array transducer with reduced acoustic coupling.
第１図（ａ）乃至（ｅ）は本発明の一実施例によるの製
造工程の説明図、第２図（ａ）乃至（Ｃ）は従来の２次
元アレイトランスデユーサの製造［程の説明図である。
１１・・・圧電体、１１ａ及び１１．・・・導体部、１
２・・バッキング材、１３・・・角柱状エレメント、１
４・・・引出し線（信号用導線）、１５・・・溝、１６
・・・ケーブル、１７・・・引出し線。FIGS. 1(a) to (e) are explanatory diagrams of the manufacturing process according to an embodiment of the present invention, and FIGS. 2(a) to (C) are illustrations of the manufacturing process of a conventional two-dimensional array transducer. It is a diagram. 11... Piezoelectric body, 11a and 11. ...Conductor part, 1
2... Backing material, 13... Prismatic element, 1
4... Lead wire (signal conductor), 15... Groove, 16
...Cable, 17...Leader line.
Claims (1)
ッキング材に接着する第１工程と、少なくともバッキン
グ材との間に導体部を残し、かつ、ｘ方向に所定のピッ
チをもって圧電板をダイシングする第２工程と、ｙ方向
に所定のピッチをもつて完全に圧電板をダイシングする
第３工程と、第２及び第３工程によって形成される碁盤
目状の角柱状エレメントの各頭に信号用導線を接続し、
該信号用導線を隣合う角柱状エレメント間で形成される
溝に設置して外部に引出す第４工程と、第３工程によっ
てｙ方向に所定のピッチで形成されるバッキング材側の
導体部列を共通にしてグラウンド用引出し線に接続する
第５工程を備えることを特徴とする２次元アレイトラン
スデューサの製造方法。A first step of bonding a piezoelectric plate having a thickness in the Z direction and conductive on both sides to a backing material, and bonding the piezoelectric plate with a predetermined pitch in the x direction while leaving at least a conductor part between the backing material and the piezoelectric plate. a second step of dicing the piezoelectric plate, a third step of dicing the piezoelectric plate completely with a predetermined pitch in the y direction, and a second step of dicing the piezoelectric plate completely at a predetermined pitch in the y direction; Connect the signal conductor,
A fourth step in which the signal conducting wire is installed in a groove formed between adjacent prismatic elements and drawn out to the outside, and a third step in which conductor portion rows on the backing material side are formed at a predetermined pitch in the y direction. A method for manufacturing a two-dimensional array transducer, comprising a fifth step of connecting to a common ground lead line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61293897A JPS63146698A (en) | 1986-12-10 | 1986-12-10 | Manufacture of two-dimension array transducer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61293897A JPS63146698A (en) | 1986-12-10 | 1986-12-10 | Manufacture of two-dimension array transducer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63146698A true JPS63146698A (en) | 1988-06-18 |
| JPH041560B2 JPH041560B2 (en) | 1992-01-13 |
Family
ID=17800568
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61293897A Granted JPS63146698A (en) | 1986-12-10 | 1986-12-10 | Manufacture of two-dimension array transducer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63146698A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013500607A (en) * | 2009-07-27 | 2013-01-07 | シーティーエス・コーポレーション | Capsule-type ceramic element and manufacturing method thereof |
-
1986
- 1986-12-10 JP JP61293897A patent/JPS63146698A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013500607A (en) * | 2009-07-27 | 2013-01-07 | シーティーエス・コーポレーション | Capsule-type ceramic element and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH041560B2 (en) | 1992-01-13 |
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