JPH01136500A - Ultrasonic wave probe - Google Patents
Ultrasonic wave probeInfo
- Publication number
- JPH01136500A JPH01136500A JP62294342A JP29434287A JPH01136500A JP H01136500 A JPH01136500 A JP H01136500A JP 62294342 A JP62294342 A JP 62294342A JP 29434287 A JP29434287 A JP 29434287A JP H01136500 A JPH01136500 A JP H01136500A
- Authority
- JP
- Japan
- Prior art keywords
- flexible substrate
- flexible
- guide path
- piezoelectric
- pieces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000523 sample Substances 0.000 title claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 42
- 239000000463 material Substances 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 230000002035 prolonged effect Effects 0.000 abstract 2
- 230000005284 excitation Effects 0.000 description 14
- 238000010586 diagram Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 238000003745 diagnosis Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
Landscapes
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は複数の圧電片を配列した超音波探触子を利用分
野とし、待にフレキシブル基板を使用した各圧電片から
の電極導出方法に関する。Detailed Description of the Invention (Industrial Field of Application) The field of the present invention is an ultrasonic probe in which a plurality of piezoelectric pieces are arranged, and firstly relates to a method for deriving electrodes from each piezoelectric piece using a flexible substrate. .
（発明の背景）
超音波探触子は、医用、鉱工業及び水産業等の各分野で
、超音波診断、探傷及び探査装置の送受波源と１７で利
用されろ。例えば、超音波診断装置では生体令被検出体
とし、複数個の圧電片を並べて駆￥ｊ１するセクタ方式
用やリニア方式用の配列形の超音波探触子が有用される
。近年では、これらの超音波探触子を体腔内に直接挿入
１７て高精度の診断を行うものもあり、小型でしかも高
密度実装の超音波探触子が望まれている。(Background of the Invention) Ultrasonic probes are used as transmitting/receiving sources for ultrasonic diagnosis, flaw detection, and exploration equipment in various fields such as medicine, mining, and fisheries. For example, in an ultrasonic diagnostic apparatus, an array type ultrasonic probe for a sector method or a linear method in which a plurality of piezoelectric pieces are arranged and driven is used as a biological body to be detected. In recent years, some of these ultrasonic probes are directly inserted 17 into body cavities to perform highly accurate diagnosis, and there is a desire for ultrasonic probes that are small and can be mounted with high density.
（従来技術）
第４図は超音波探触子の一従来例を説明する図で、同図
（ａ）は超音波探触子の正面図、同図（ｈ）は同平面図
、同図（ｎ）は圧電片の図である。(Prior art) Fig. 4 is a diagram explaining a conventional example of an ultrasonic probe, in which Fig. 4 (a) is a front view of the ultrasonic probe, Fig. 4 (h) is a plan view, and (n) is a diagram of a piezoelectric piece.
超音波探触子は、基台１に固着されたバッキング材２上
に矩形状の複数の圧電片３を幅方向に配列してなる。圧
電片３は例えばジルコン酸チタン酸鉛（以下ＰＺＴとす
る）からなり、両主面に励振電極４を形成する。バッキ
ング材２に固着した一方の主面の一端側からはそれぞれ
独立した＋Ｊ −ド線５ｉｅ、他方の主面の他端側から
は例えば共通接続したリード線６を導出する。なお、通
常では他方の主面側に図示しない音＃ｎ整合署や音！レ
ンズを形成する。そして、圧電片３を順次リニア駆動し
て疾患部等を診断するようにしている。一般には、圧電
片３の厚みＬに対して幅Ｗを小さくしく一般には厚みの
Ｏ，［’ｉ以下）、副振動を除去して検出精度を高める
ようにしている。例えば超音ｄソ周波数を４ Ｍ Ｈｙ
、とすると、圧電片３の幅Ｗは約０．２５ｍｍ、その間
隔ｄは０．０５ｍｍ程度に設δトして製造されろ。The ultrasonic probe includes a plurality of rectangular piezoelectric pieces 3 arranged in the width direction on a backing material 2 fixed to a base 1. The piezoelectric piece 3 is made of, for example, lead zirconate titanate (hereinafter referred to as PZT), and has excitation electrodes 4 formed on both main surfaces. From one end of one main surface fixed to the backing material 2, independent +J- wires 5ie are led out, and from the other end of the other main surface, for example, commonly connected lead wires 6 are led out. Note that there is normally a sound #n matching station and sound! which are not shown on the other main surface side. Form a lens. Then, the piezoelectric pieces 3 are sequentially linearly driven to diagnose a diseased area or the like. In general, the width W is made smaller than the thickness L of the piezoelectric piece 3, generally less than the thickness O, ['i, and sub-vibrations are removed to improve detection accuracy. For example, the ultrasonic d-so frequency is 4 M Hy
, the width W of the piezoelectric piece 3 is about 0.25 mm, and the interval d is set to about 0.05 mm.
（従来技術の欠点）
しかしながら、上記構成の超音波探触子では、バッキン
グ材２に圧電片３を取着した後、励振電極４からリード
線５を一本づつ取出す作業は困難を極めその効率を低下
させる欠点があった。このため、例えば導電路が印刷さ
れたフレキシブル基板を利用して励振電極を外部に導出
することが行オ）れていた。すなわち、第５図に示した
ように、７レキンブル基板７「同図（ｎ）Ｊの共通線路
部８に圧電板９の一端側を接続してバッキング材２に取
着するとともにフレキシブル基板７ｔｅ折り曲げ「同図
（ｂｌＪ、導電路１０間の圧電板９と共３ａ線路部８と
を一体的に切断分割ｚ７「同図（Ｃ）」、励振ｆｌＴｈ
４％独立して外部に導出する方法である。しかし、例え
ば円筒状のケースに収納して生体の体腔内に直接挿入す
るようなもの等フレキシブル基板の長さが大きい場合に
は、圧電板の切断分割時等の作業圧を低下させる問題が
あった。(Disadvantages of the prior art) However, in the ultrasonic probe having the above configuration, it is extremely difficult to take out the lead wires 5 one by one from the excitation electrode 4 after attaching the piezoelectric piece 3 to the backing material 2, and the process is not efficient. It had the disadvantage of lowering the For this reason, excitation electrodes have been led out to the outside by using, for example, a flexible substrate on which conductive paths are printed. That is, as shown in FIG. 5, one end side of the piezoelectric plate 9 is connected to the common line portion 8 of 7 flexible substrate 7" (n) J in the same figure and attached to the backing material 2, and the flexible substrate 7te is bent. "Same figure (blJ, piezoelectric plate 9 between conductive path 10 and line 3a line section 8 are integrally cut and divided z7"same figure (C)", excitation flTh
This is a method of independently extracting 4% to the outside. However, if the length of the flexible substrate is large, such as one that is housed in a cylindrical case and inserted directly into the body cavity of a living body, there is a problem of lowering the working pressure when cutting and dividing the piezoelectric plate. Ta.
（発明の目的）
本発明は、作業性を良好にして各圧電片の励振ｆ！極を
外部に導出する超音波探触子を提供することを目的とす
る。(Object of the Invention) The present invention improves workability and excite f! of each piezoelectric piece! An object of the present invention is to provide an ultrasonic probe that leads out a pole to the outside.
（解決手段）
本発明は、複数の圧電片の一方の主面の励振電極と第１
のフレキシブル基板の導電路とを接続し、前記第１のフ
レキシブル基板の導電路に第２のフレキシブル基板の導
電路を接続して励振ｔ１ｉ極を外部に導出したことを゛
解決手段とする。以下、本発明の一実施例を説明する。(Solution Means) The present invention provides an excitation electrode on one main surface of a plurality of piezoelectric pieces and a first
The conductive path of the first flexible substrate is connected to the conductive path of the second flexible substrate, and the excitation t1i pole is led out to the outside. An embodiment of the present invention will be described below.
（実施例）
第１図、第２図及び第３図は本発明の一実施例を説明す
る超音波探触子の図で、第１図（ａ）は超音波探触子の
分解正面図、同図（ｂ）は第１のフレキシブル基板の一
部拡大断面図、同図（ｃ）は第２の７Ｌ−キンプル基板
の一部拡大断面図、第２図は第２の７レキシブル基板の
裏面図、第３図（よ第２の７１／キンプル基板の積層一
部所面図である。なお、前実施例図と同一部分には同番
号を付すして説明する。(Example) Fig. 1, Fig. 2, and Fig. 3 are diagrams of an ultrasonic probe to explain an embodiment of the present invention, and Fig. 1(a) is an exploded front view of the ultrasonic probe. , Figure (b) is a partially enlarged sectional view of the first flexible board, Figure (c) is a partially enlarged sectional view of the second 7L-Kinple board, and Figure 2 is a partially enlarged sectional view of the second 7L-Kinple board. FIG. 3 is a partial view of the laminated structure of the second 71/Kinple board. Note that the same parts as in the previous embodiment drawings are given the same numbers and will be described.
超音波探触子は、前述したようにＰＺＴからなる矩形状
の圧電片３に励振１ｆｉ極４を形成し、その複数個を例
えばＸ個をバッキング材２上に配列してなる。各圧電片
３のバッキング材２に取着した一方の主面の一端側には
第１のフレキシブル基板２０を設ける。As described above, the ultrasonic probe is formed by forming excitation 1fi poles 4 on a rectangular piezoelectric piece 3 made of PZT, and arranging a plurality of the excitation poles 4, for example, X pieces, on the backing material 2. A first flexible substrate 20 is provided at one end of one main surface of each piezoelectric piece 3 attached to the backing material 2 .
第１のフレキシブル基板２０はＸ本の導電路２１を一面
側に印刷形成して両面を絶縁した例えばポリイミド系＋
＠１ｌ１２１ａの′ＷＩ層体からなる。なお、外周には
シールド用導電路２１ｂが形成される。The first flexible substrate 20 is made of, for example, a polyimide +
It consists of 'WI layer body of @1l121a. Note that a shield conductive path 21b is formed on the outer periphery.
各導１？３２１の一端は各圧電片３の励振電極４とそれ
ぞれ接続する。例えば前述したように、図示しない圧電
板にフレキシブル基板２０を接続してバッキング材２に
取着したのち、各圧電片３に分割するとともに励振電極
４と導電路２１とを個々に接続する。各導電路２１の延
出端は端子領域２２を露出して縦横列に配置される。例
丸ば縦列にｎ個（図では４個）、横列にｍ個配置される
（（１１＋／ ｍ Ｘ ｎ ＝ ｘ ）。なお、端子領
域２２には例えば半田メツキ２２１）が施される１゛第
１（ｈ）」。One end of each conductor 1?321 is connected to the excitation electrode 4 of each piezoelectric piece 3, respectively. For example, as described above, after the flexible substrate 20 is connected to a piezoelectric plate (not shown) and attached to the backing material 2, it is divided into each piezoelectric piece 3, and the excitation electrode 4 and the conductive path 21 are individually connected. The extending ends of each conductive path 21 are arranged in rows and columns with terminal areas 22 exposed. For example, n circles (4 in the figure) are arranged in a vertical column, and m circles are arranged in a horizontal column ((11+/m 1st (h)”.
そ１７て、複数の第２のフレキシブル基板２３を第１の
フレキシブル基板２０に接続する。Then, the plurality of second flexible substrates 23 are connected to the first flexible substrate 20.
第２のフレキシブル基板２３は一端側の一側向に接続部
２４を突出し、細長い板面を持つｙ本（図では１２本）
の導電路２５を形成された前述同様の積層体からなる。The second flexible substrate 23 has y pieces (12 pieces in the figure) of connecting parts 24 protruding from one end side and having elongated plate surfaces.
The conductive path 25 is formed of the same laminated body as described above.
接続部２４に延出した導電路２５の先端は一面側から孔
２６を通して他面側に延出し、露出した外周に半田メツ
キ２２ｂを施し端子孔領域２７を形成する「第１図（Ｃ
）」。The tip of the conductive path 25 extending to the connecting portion 24 extends from one side to the other side through the hole 26, and solder plating 22b is applied to the exposed outer periphery to form a terminal hole area 27.
)”.
なお、端子孔領域２７は縦列をｍ個、横列を例えば３個
として縦横に設けられる。そして、他面側には端子孔領
域２７と絶縁した金属膜２８を形成する（第２図）。そ
して、第２のフレキシブル基板２３の端子孔領域２７を
−ブロックとし、第１の７レキシブル基板２０の相当す
るブロック毎の端子領域２２とを接続する。すなわち、
第２のフレキンプル基板のの孔２６から第１の７レキシ
ブル基板の端子領域２２に半田を流入して接続する。Note that the terminal hole regions 27 are provided vertically and horizontally, with m vertical columns and, for example, three horizontal columns. Then, a metal film 28 insulated from the terminal hole region 27 is formed on the other side (FIG. 2). Then, the terminal hole area 27 of the second flexible substrate 23 is set as a - block, and the terminal area 22 of each corresponding block of the first seven flexible substrates 20 is connected. That is,
Solder is flowed into the terminal area 22 of the first flexible board from the hole 26 of the second flexible board for connection.
そｊ７て、例えば前述した基台１の底面側に第１及び第
２のフレキシブル基板２０．２３を折曲し、第２のフレ
キシブル基板２３の延出部２９を重ね合わせて外部に導
出しく第３図）た構成とする。Then, for example, the first and second flexible substrates 20 and 23 are bent on the bottom side of the base 1 described above, and the extending portion 29 of the second flexible substrate 23 is overlapped with the first flexible substrate 20 and the second flexible substrate 20 is brought out to the outside. Figure 3).
なお、第２のフレキシブル基板２３の金属膜２８は図示
しない孔を設けてそれぞれ接続し、史（ζ第１の７レキ
シブル基板２０のシールド用導電路２１１１に接続して
アース電位に設置される。Note that the metal film 28 of the second flexible substrate 23 is connected to each other by providing holes (not shown), and is connected to the shield conductive path 2111 of the first seven flexible substrates 20 and set at ground potential.
従って、このような構成の超音波探触子では、第１のフ
レキシブル基板２０を圧電板に固着して複数の圧電片３
に分割することにより、前実施例同様に励振ｆｒｉ極４
と導電路２１とを接続できる。Therefore, in the ultrasonic probe having such a configuration, the first flexible substrate 20 is fixed to the piezoelectric plate and the plurality of piezoelectric pieces 3
By dividing the excitation fri pole into 4 as in the previous embodiment,
and the conductive path 21 can be connected.
そして、第２のフレキシブル基板２３を第１の７１、−
キシプル基板２０に接続すればフレキシブル基板の長さ
を大きくでき、例えば円筒状のケースに収納して生体の
体腔内に直接挿入するような導電路の長い超音波探触子
でもその製造を容易にして小型化を達成できる。ちなみ
に、例えば同軸多芯ケーブルを１００本（即ち圧電片を
１００個）として導出する場合にはその断面積を約７０
ｍｍ”とするが、第２の７レキシブル基板を重ねろと２
０ｍｎｔ″ですむ。そして、この実施例では第２の７】
、・キシプル基板２３の延出部を重ね合オ〕せて導出し
たので、金ｖ５膜２８が導電路２５を両面側から阿って
充分なシールドを施し、各第２のゴリノト基板２３の１
／１！のポ磁誘導による雑音“等の悪影！′′！を防止
できる。Then, the second flexible substrate 23 is connected to the first 71, -
By connecting to the flexible substrate 20, the length of the flexible substrate can be increased, making it easier to manufacture ultrasonic probes with long conductive paths, such as those housed in a cylindrical case and inserted directly into the body cavity of a living body. miniaturization can be achieved. By the way, for example, when deriving 100 coaxial multicore cables (that is, 100 piezoelectric pieces), the cross-sectional area is approximately 70.
mm”, but if you overlap the second 7 flexible board, 2
0mnt'' is sufficient. In this embodiment, the second 7]
, Since the extending portions of the xypul substrates 23 are overlapped and led out, the gold V5 film 28 covers the conductive paths 25 from both sides to provide sufficient shielding, and one of the second golino substrates 23 is
/1! It is possible to prevent negative effects such as noise caused by magnetic induction.
（他の事項）
なお、上記実施例では、圧電片３をγ爪上のバッキング
材上に並べて説明したが、例えば曲面上に配列ｊ７たも
のであっても適用できろ。また、圧電片は単一として説
明したが、例えば１９数のニレメンＪ・にして共通接続
したものでもよい。、↓た第２の７レキシブル基板２３
の外周に金属１１Ｆ：！、全形成してシールド効果をた
かめろようにしてもよく、本発明の趣旨を逸脱しない範
囲内で適宜変更できろ、。(Other Matters) In the above embodiment, the piezoelectric pieces 3 are arranged on the backing material on the γ claw, but the piezoelectric pieces 3 may also be arranged on a curved surface. Furthermore, although the piezoelectric piece is described as being single, it may be made up of, for example, 19 pieces connected in common. , ↓Second 7 flexible board 23
Metal 11F:! However, the shielding effect may be enhanced by forming the entire structure, and changes may be made as appropriate without departing from the spirit of the present invention.
（発明の効果）
本発明は、複数の圧電片の一方の主面の励振電極と第１
の７レキシゴル基板の導ｒｉ路とを接続し、ｎｉＩ記￥
Ｓ１の７レキシブル基板の導電路に第２の７トキシブル
基板の導電路を接続して励振電極を外部に導出１７たの
で、作業性を良好にして導出路の長い超音波探触子を提
供できる。(Effects of the Invention) The present invention provides an excitation electrode on one main surface of a plurality of piezoelectric pieces and a first
Connect the 7 lexigol board's RI path, and write the niI
Since the conductive path of the second 7 flexible substrate is connected to the conductive path of the S1 7 flexible substrate and the excitation electrode is led out to the outside, it is possible to improve workability and provide an ultrasonic probe with a long lead-out path. .
第１図（ａ ） （ｂ ） （ｃ ）は本発明の一
実施例ηｆ説明する超音波探触子の図、第２図は第２の
７１７キシブル基板の他面側の図、第３図は第２の７Ｌ
キレプル基板を重ね合わせた断面図である。
第４図（ａ ） （ｂ ） （ｃ ）及び第５図（
ｎ）（ｈ）（ｎ）は従来例を説明する超音波探触子の図
である。
１ 基台、２・・バッキング材、３・・圧電片、４励振
電極、５．６・ リード線、７．２０．２３７レキシブ
ル基板、８ 共′ｉ！１線路、９・・・圧電片、１（）
、２１．２５ 導電路、２１ｂ シール１：用導電
路、２２ 端子領域、２４ 接続部、２ｂ孔、２７ 端
子孔領域、２８ 金属膜、２（］ 斯出部。
第４１！Ｉ
罵５！！ｌFigures 1 (a), (b), and (c) are diagrams of an ultrasonic probe for explaining one embodiment of the present invention, Figure 2 is a diagram of the other side of the second 717 flexible substrate, and Figure 3. is the second 7L
FIG. 3 is a cross-sectional view of the Kirepuru substrates stacked one on top of the other. Figure 4 (a) (b) (c) and Figure 5 (
n)(h)(n) are diagrams of an ultrasonic probe illustrating a conventional example. 1. Base, 2. Backing material, 3. Piezoelectric piece, 4 Excitation electrode, 5.6. Lead wire, 7.20.237 Flexible substrate, 8 Both'i! 1 line, 9... piezoelectric piece, 1 ()
, 21.25 Conductive path, 21b Seal 1: Conductive path, 22 Terminal area, 24 Connection area, 2b hole, 27 Terminal hole area, 28 Metal film, 2(] Extrusion part. 41st! I Abuse 5!! l
Claims (1)
の一方の主面を取着して列設するバッキング材と、前記
圧電片の一方の主面の電極と接続する導電路の形成され
た第１のフレキシブル基板と、前記第１のフレキシブル
基板の導電路と接続する第２のフレキシブル基板とから
なることを特徴とする超音波探触子。A plurality of piezoelectric pieces having electrodes formed on both main surfaces, a backing material attached to one main surface of the piezoelectric pieces and arranged in a row, and a conductive path connected to the electrode on one main surface of the piezoelectric pieces. What is claimed is: 1. An ultrasonic probe comprising: a first flexible substrate on which is formed; and a second flexible substrate connected to a conductive path of the first flexible substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62294342A JP2517331B2 (en) | 1987-11-21 | 1987-11-21 | Ultrasonic probe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62294342A JP2517331B2 (en) | 1987-11-21 | 1987-11-21 | Ultrasonic probe |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01136500A true JPH01136500A (en) | 1989-05-29 |
| JP2517331B2 JP2517331B2 (en) | 1996-07-24 |
Family
ID=17806461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62294342A Expired - Fee Related JP2517331B2 (en) | 1987-11-21 | 1987-11-21 | Ultrasonic probe |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2517331B2 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02123214U (en) * | 1989-03-22 | 1990-10-09 | ||
| JPH02252442A (en) * | 1989-03-27 | 1990-10-11 | Tokyo Keiki Co Ltd | Ultrasonic probe |
| US5685311A (en) * | 1994-10-20 | 1997-11-11 | Olympus Optical Company, Ltd. | Image display system |
| JP2005349104A (en) * | 2004-06-14 | 2005-12-22 | Matsushita Electric Ind Co Ltd | Ultrasonic probe and ultrasonic diagnostic apparatus |
| WO2007145182A1 (en) * | 2006-06-12 | 2007-12-21 | Olympus Medical Systems Corp. | Ultrasonic probe and ultrasonic endoscope with ultrasonic probe |
| JP2009105762A (en) * | 2007-10-24 | 2009-05-14 | Aloka Co Ltd | Annular array vibrator |
| WO2019031465A1 (en) * | 2017-08-08 | 2019-02-14 | オリンパス株式会社 | Ultrasonic endoscope |
| JP2019528959A (en) * | 2016-09-29 | 2019-10-17 | コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． | Flexible imaging assembly for intraluminal imaging and related devices, systems and methods |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6741637B2 (en) | 2017-09-20 | 2020-08-19 | オリンパス株式会社 | Ultrasound endoscope |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61294997A (en) * | 1985-06-21 | 1986-12-25 | Toshiba Corp | Macromolecule piezoelectric type ultrasonic probe |
-
1987
- 1987-11-21 JP JP62294342A patent/JP2517331B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61294997A (en) * | 1985-06-21 | 1986-12-25 | Toshiba Corp | Macromolecule piezoelectric type ultrasonic probe |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02123214U (en) * | 1989-03-22 | 1990-10-09 | ||
| JPH02252442A (en) * | 1989-03-27 | 1990-10-11 | Tokyo Keiki Co Ltd | Ultrasonic probe |
| US5685311A (en) * | 1994-10-20 | 1997-11-11 | Olympus Optical Company, Ltd. | Image display system |
| JP2005349104A (en) * | 2004-06-14 | 2005-12-22 | Matsushita Electric Ind Co Ltd | Ultrasonic probe and ultrasonic diagnostic apparatus |
| WO2007145182A1 (en) * | 2006-06-12 | 2007-12-21 | Olympus Medical Systems Corp. | Ultrasonic probe and ultrasonic endoscope with ultrasonic probe |
| JP2007330351A (en) * | 2006-06-12 | 2007-12-27 | Olympus Medical Systems Corp | Ultrasonic probe and ultrasonic endoscope having ultrasonic probe |
| EP2027818A1 (en) * | 2006-06-12 | 2009-02-25 | Olympus Medical Systems Corp. | Ultrasonic probe and ultrasonic endoscope with ultrasonic probe |
| EP2027818A4 (en) * | 2006-06-12 | 2010-03-03 | Olympus Medical Systems Corp | Ultrasonic probe and ultrasonic endoscope with ultrasonic probe |
| JP2009105762A (en) * | 2007-10-24 | 2009-05-14 | Aloka Co Ltd | Annular array vibrator |
| JP2019528959A (en) * | 2016-09-29 | 2019-10-17 | コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． | Flexible imaging assembly for intraluminal imaging and related devices, systems and methods |
| WO2019031465A1 (en) * | 2017-08-08 | 2019-02-14 | オリンパス株式会社 | Ultrasonic endoscope |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2517331B2 (en) | 1996-07-24 |
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