JPS59189834A - Appay type ultrasonic probe - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an array type ultrasound probe used in medical ultrasound diagnostic equipment and the like.

[Technical background of the invention]

This type of conventional array-type 11-sound probe has a configuration as shown in FIGS. 1 and 2.

That is, Fig. 1 shows the 0111 of the array type 11 sound wave probe.
FIG. 2 is a sectional view taken along the line (■-D) in FIG. 1.

In the figure, reference numeral I indicates a piezoelectric vibrator having a ground electrode 2 and a positive electrode 3. As shown in FIG. 2, this piezoelectric vibrator 1 is divided into multiple parts parallel to each other in the ultrasonic scanning direction (that is, the direction indicated by arrow a in the figure), and is bonded to the upper surface of the damping +* (as shown in the figure). Further, on the induced sound wave transmitting/receiving surface side of the piezoelectric vibrator 1, first and second sound l!P matching parts 5 and 6, which are multi-divided in the same manner as the piezoelectric vibrator 1, are laminated and fixed. An acoustic lens 7 is bonded to the upper surface side of the acoustic matching layer 6 shown in FIG.

Here, the ground electrode 2 and the positive 6. The pole 3 is made by gluing solder, silver, etc. with a ground side substrate electrode 9 printed in parallel on a ground l111I flexible substrate 8 and a positive side substrate electrode 11 printed in parallel on a positive side flexible substrate 10, respectively. Bonded with conductive adhesive.

The play-type ultrasound probe with such a configuration generates ultrasound by sending a drowsiness signal to one of the piezoelectric vibrators 1 arranged in an array as described above, and then sequentially sets a time difference. Then, the adjacent piezoelectric vibrators I generate ultrasonic waves.

The ultrasonic waves generated in this manner are emitted from the acoustic lens 7 toward the inside of the body, are reflected within the body, and are received by the acoustic lens 7 again. Incidentally, among the ultrasonic waves generated in the compression element 1, the modulus sound waves transmitted to the damping layer 4f1111 are reduced in the damping layer 4.

[“Problems” with instigation technology]

The conventional array type ultrasonic probe as described above has the following problems. That is, the conductive adhesive bonding the positive electrode 3 of the piezoelectric vibrator l and the positive substrate electrode 11 protrudes, and electrically conducts between the piezoelectric vibrators l provided in a play shape. There was a risk that I would let him. In this way, an ultrasonic probe in which the distance between the piezoelectric transducers is wide is able to perform precise scanning, so such an array-type ultrasonic probe should be discarded. This was having a negative impact on the above yield rate.

[Purpose of the invention]

The present invention has been made based on the above-mentioned circumstances, and its purpose is to eliminate the risk of electrical continuity between the piezoelectric vibrators provided in an array, and to connect the positive electrode of the piezoelectric vibrator to the positive electrode side. An object of the present invention is to provide an array type ultrasonic probe which is bonded to a substrate electrode in an electrically conductive state.

[Summary of the invention]

In order to achieve the above object, the present invention is characterized by the following configuration. That is, the present invention provides an array type ultrasonic probe whose basic components are a piezoelectric vibrator, an acoustic matching 4, an acoustic lens, and a damping I. The structure is such that an insulating resin adhesive is interposed between the electrodes in a pressure-cured state and bonded. In the present invention having such a configuration, the positive electrode of the piezoelectric vibrator and the positive side substrate electrode are bonded with an insulating resin adhesive.
Even if such adhesive protrudes and comes into contact with an adjacent piezoelectric transducer, the insulation state between the piezoelectric vibrators can be maintained, and the adhesive is applied between the positive electrode of the piezoelectric vibrator and the positive substrate electrode. Since the electrodes are interposed in an extremely thin layer, the electrodes are characterized by electrical continuity.

[Embodiments of the invention]

FIGS. 3 and 4 are diagrams showing first and second embodiments of the present invention.

In FIG. 3, reference numeral 101 denotes a piezoelectric vibrator made of PZTJ, which is provided in a play shape similar to that shown in FIG. 2 above. A ground electrode 102 is provided on the ultrasonic wave transmitting/receiving surface side of the piezoelectric vibrator 101', and a positive electrode 103 is provided on the side opposite to the ultrasonic wave transmitting/receiving surface. A first acoustic matching layer, Z Oa, is bonded on the ultrasonic transmitting/receiving surface of the piezoelectric vibrator III, and a second acoustic matching layer 106 is bonded on the first acoustic matching layer 104. has been done. These first and second acoustic matching layers 104 and 105 are also provided in an array as shown in FIG. 2 above.

Furthermore, a lens 116 is bonded to the second sound chamber 105.

On the other hand, the opposite side of the ultrasonic transmitting and receiving surface of piezoelectric vibrator 10 [1i1
A damping layer 107 is bonded to 1 through an insulating layer 106. The damping layer 107 is made of, for example, tungsten powder dispersed in an epoxy resin, etc., and by setting the amount of the tungsten powder dispersed to 90 to 95% of the total weight, the acoustic impedance can be adjusted to that of the piezoelectric vibrator. The ultrasonic transmitting/receiving surface is adjusted to be approximately equal to that of 101 and to be large. Such a damping layer r
07 has conductivity. Above insulation + i4 z o e
is made of crystallized glass and electrically insulates the piezoelectric vibrator 101 and the damping moss 1oy. The acoustic impedance of this insulator 106 is also adjusted to be approximately equal to that of the piezoelectric vibrator 101.

Further, in Fig. 7g2, reference numeral 10B is a ground side flexible board. On this ground side flexible cutting board 108, a plurality of ground 101j substrate electrodes 109 are printed and aligned at intervals approximately equal to the arrangement interval of the piezoelectric vibrators 101. This grounding plate electrode 109 is bonded to the grounding machine 102 of the piezoelectric vibrator 101 in an electrically conductive state. Furthermore, W, numeral 110 in Figure 2
are the correct and recommended side flexible boards. This positive electrode 1lII
j The piezoelectric vibrator 101 is mounted on the flexible basket plate 110.
A plurality of positive electrodes 111 are printed in alignment at intervals approximately equal to the arrangement interval. These positive side curtain plate electrodes 111 are connected to each of the five positive electrodes 103 of the plurality of piezoelectric vibrators 101 provided in the array.
The books are glued in correspondence. Such positive side substrate electrode 1
11 and the positive electrode 103 of the piezoelectric vibrator 101 are bonded using an insulating resin adhesive such as epoxy resin. That is, an insulating resin adhesive is interposed between the two electrodes 111 and 103 to connect them! Then, when the insulating resin adhesive begins to harden, a pressure of 10 Kf/(m"4'4 degrees or more is applied perpendicularly to the bonded surface). The 4th layer with resin adhesive is said to be extremely thin.

The array type ultrasonic probe having such a configuration includes a piezoelectric vibrator 10
Since the positive electrode 4I1103 of 1 and the positive side substrate' electrode 111 are bonded with an insulating resin adhesive, even if the adhesive protrudes and comes into contact with the adjacent piezoelectric vibrator 101, the phase gap between the piezoelectric vibrator 101 The insulation state of can be maintained. Also,
Since this adhesive is interposed between the electrodes 101 and 111 in an extremely thin layer, these electrodes 101°1.11 are electrically connected. Therefore, according to such an array type ultrasonic probe, there is no fear of electrical continuity between the piezoelectric vibrators 101, and accurate scanning can be performed.

Next, a second embodiment shown in FIG. 4 will be described. Note that the same parts as in FIG. 3 shown earlier are given the same reference numerals, and detailed explanations of those parts will be omitted.

That is, in the array type ultrasonic probe of this embodiment, the positive electrode side flexible substrate 201 is interposed in a layered manner between the piezoelectric vibrator 101 and the damping i compensation Z 07. piezoelectric vibrator 1
01 and the damping layer 107 are electrically insulated.

In this array type ultrasonic probe, the piezoelectric vibrator 101 (D positive electrode 54 and the positive electrode 103 and the positive electrode side substrate'WL pole 20
2 is bonded with an insulating resin adhesive, and this adhesive is cured under pressure, so that the same effects as in the first embodiment can be achieved. In addition, the arrayed ultrasonic contactor of this embodiment includes the positive electrode 103 of the piezoelectric vibrator 101 and the positive electrode side substrate g;
Although the bonding surface with the pole 202 is considerably wider than that in the first embodiment, this bonding surface can also be bonded to the entire surface with an insulating resin adhesive, and when bonding, the piezoelectric vibrator 101 Since high-temperature heat is not applied, high-level scanning can be performed.

Note that the present invention is not limited to the two embodiments described above. For example, the ground electrode 102 of the piezoelectric vibrator 101 and the ground side substrate electrode 109 may also be bonded by interposing an insulating resin adhesive in a pressure-cured state.

〔Effect of the invention〕

According to the present invention, since the positive electrode of the piezoelectric vibrator and the positive side substrate electrode are bonded with an insulating resin adhesive, even if the adhesive protrudes and comes into contact with an adjacent piezoelectric vibrator, the piezoelectric vibrators cannot be connected to each other. Since the adhesive is interposed between the positive electrode of the piezoelectric vibrator and the positive substrate electrode to form a thin layer, the insulation between these electrodes can be maintained. electrically conductive. Therefore, there is no risk of electrical continuity between the piezoelectric vibrators arranged in an array, and the array type in which the positive electrode of the piezoelectric vibrator and the positive electrode side substrate electrode are bonded in an electrically conductive state. Ultrasonic probes can be provided.

[Brief explanation of drawings]

FIG. 1 is an Intl sectional view showing a conventional example, FIG. 2 is a sectional view taken along the line ■-■ in FIG. 1, and FIGS. It is a front view. 101... Pressure vibrator, 102... Earthing city, pole, 1
03...Positive electrode, 104...First sound/sense matching V-
1105...Second musical alignment order, 106...e relative, 107...damping 4, xoB...ground plane flexible board, 109...ground IFl! l substrate tip,
110... Positive electrode side Arekin pull plate, III... Positive electrode side substrate electrode, 201... Positive electrode side flexible cutting board,
202... Positive electrode + nlI eight plate' pole. Applicant's representative Patent attorney Takehiko Suzue Figure 1 Figure 3 Figure 16 Figure 4 Commissioner of the Patent Office Kazuo Wakasugi 7 1. Indication of the case Patent application No. 1983-63323 2. Name of the invention Array-type super-Kayaha probe , Child 3, Relationship with the person making the amendment Patent applicant (Q'17) Olympus Optical Industry Co., Ltd. 5, Voluntary amendment 19

Claims (1)

[Claims] A piezoelectric vibrator having a positive electrode and a ground electrode, an acoustic matching layer bonded to the ultrasonic transmitting/receiving surface of the piezoelectric vibrator, an acoustic matching layer bonded to the acoustic matching layer, and the piezoelectric vibrator. Damping bonded to the opposite side of the ultrasonic transmitting and receiving surface! @
and the positive 11 pole of the piezoelectric vibrator, and the piezoelectric side 43 plate electrode bonded to the piezoelectric replica element 9b with an insulating (04) resin adhesive in a pressure-hardened state, and An array type eye sonic probe characterized in that a ground electrode of a field transducer and a ground side substrate electrode electrically connected and bonded are curved.