JPS61118099A - Ultrasonic wave probe - Google Patents
Ultrasonic wave probeInfo
- Publication number
- JPS61118099A JPS61118099A JP23846984A JP23846984A JPS61118099A JP S61118099 A JPS61118099 A JP S61118099A JP 23846984 A JP23846984 A JP 23846984A JP 23846984 A JP23846984 A JP 23846984A JP S61118099 A JPS61118099 A JP S61118099A
- Authority
- JP
- Japan
- Prior art keywords
- vibrator
- plate
- flat plate
- ultrasonic
- ultrasonic wave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000523 sample Substances 0.000 title claims description 21
- 239000000463 material Substances 0.000 claims abstract description 18
- 230000035945 sensitivity Effects 0.000 abstract description 8
- 239000004020 conductor Substances 0.000 abstract description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract description 3
- 238000012856 packing Methods 0.000 abstract 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002604 ultrasonography Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
- G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
- G01H11/08—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means using piezoelectric devices
Abstract
Description
【発明の詳細な説明】
[発明の技術分野]
本発明は複数の超音波@動子を備えた超音波プローブに
関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an ultrasound probe equipped with a plurality of ultrasound @ movers.
[発明の技術的背景とその問題点1
従来の超音波プローブは第3図に示すように、直方体状
のバッキング材3上に信号用M KA 7 aを介して
ブロック状の超音波振動子1を固定し、接地電極7bを
介して第1整合層4及び第2整合層5を配設し、信号用
電極78に一部が接触するフレキシブル電極板2を形成
し、接地電極7bに導電性接着剤6を介してアース板8
に接続してなる。[Technical background of the invention and its problems 1 As shown in FIG. 3, the conventional ultrasonic probe has a block-shaped ultrasonic transducer 1 mounted on a rectangular parallelepiped-shaped backing material 3 via a signal MKA 7a. is fixed, a first matching layer 4 and a second matching layer 5 are arranged via the ground electrode 7b, a flexible electrode plate 2 is formed that partially contacts the signal electrode 78, and a conductive layer is provided on the ground electrode 7b. Ground plate 8 via adhesive 6
It becomes connected to.
バッキング材3は振動子背面に放射される超音波を吸収
する目的で配置されている。The backing material 3 is arranged for the purpose of absorbing ultrasonic waves radiated to the back surface of the vibrator.
しかし、バッキング材と振動子との間には接着剤しか介
入していないため、振動子背面に超音波が放射されるの
を完全に防止することはできず、このため、感度の低下
及び狭帯域化を招いていた。However, since there is only adhesive between the backing material and the transducer, it is not possible to completely prevent ultrasonic waves from being emitted to the back of the transducer, resulting in decreased sensitivity and narrow This led to band-wideization.
そこで、第4図に示すように、振動子1とバッキング材
3との間に平板9を介在させ、平板9上にリード線11
を配置してTi極と接続して外部に引出しを行う構造に
し、このように平板9を介在させることによって@動子
背面に放射される超音波を反則ぜて高感度化、広帯域化
を図っているものが近業され【いる。尚、接地1i極7
bは接地用リードね10に11続している。Therefore, as shown in FIG. 4, a flat plate 9 is interposed between the vibrator 1 and the backing material 3, and a lead wire 11 is placed on the flat plate 9.
By placing the flat plate 9 in this way, the ultrasonic waves radiated to the rear surface of the actuator are reflected, increasing the sensitivity and widening the band. Those who are currently employed are currently employed. In addition, grounding 1i pole 7
11 is connected to the grounding lead 10.
しかしながら、このような構造であると、平板9、[に
形成される引出し用電極と振動子電極との位置決めが困
難であること、振動子と電極との接触面積が小さく断線
し易いこと、電極にリード線を接続するための手間がか
かる等の問題があった。However, with such a structure, it is difficult to position the extraction electrode formed on the flat plate 9 and the vibrator electrode, the contact area between the vibrator and the electrode is small, and the electrode is easily disconnected. There were problems such as the hassle of connecting the lead wires.
[発明の目的]
本発明は、前記問題点に鑑みてなされた物であり、製造
が容易であり、信頼性の高い、高感度又は広帯域の超音
波プローブを提供することを目的としている。[Object of the Invention] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a highly sensitive or broadband ultrasonic probe that is easy to manufacture and highly reliable.
[発明の概要]
前記目的を達成するために本発明は、複数のブロック状
出音波@肋子が平板を介して直方体状のバッキング材上
に固定されてなる超音波プローブにおいて、前記平板は
少なくとも振動子との接触面が可撓性を有する導電性材
料から成り、前記振動子の電極に接続されると共に、先
端がバッキング材壁面方向に延在形成されていることを
特徴とするものである。[Summary of the Invention] To achieve the above object, the present invention provides an ultrasonic probe in which a plurality of block-shaped output sound waves @ ribs are fixed on a rectangular parallelepiped backing material via a flat plate, wherein the flat plate has at least The contact surface with the vibrator is made of a flexible conductive material, is connected to the electrode of the vibrator, and has a tip extending in the direction of the wall surface of the backing material. .
し発明の実施例]
第1図に示すのは、本発明の超音波プローブの構造であ
る。超音波振動子とバッキング材の間には導電性のある
平板12があり、超音波振動子1とは導電性の接着剤6
で接着されている。この平板12の厚みは、高感度化又
は広帯域化というそれぞれの目的によって定められてお
り例えば波長の1/4となるようにされ、平板はフレキ
シブルな構造となっており、この結果電極と一体的にな
っている。これらはそれぞれ方形状の板状体として積層
されるものであるが、その後、ダイサーによって、平板
までカッティングし、複数のアレイ状(ブロック状)の
振動子群を形成する。このように平板とフレキシブルな
電極が一体となっているために製造しやすく、又、振動
子とN極との接触面積が大きいために信頼性もよい超音
波プローブができる。尚、平板12の先端は外方に延在
し延在部分に絶縁被覆13が形成される。Embodiments of the Invention] FIG. 1 shows the structure of an ultrasonic probe of the present invention. There is a conductive flat plate 12 between the ultrasonic vibrator and the backing material, and the ultrasonic vibrator 1 is connected to a conductive adhesive 6.
It is glued with. The thickness of this flat plate 12 is determined depending on the purpose of increasing sensitivity or widening the band, and is made to be, for example, 1/4 of the wavelength, and the flat plate has a flexible structure, so that it can be integrated with the electrode. It has become. Each of these is laminated as a rectangular plate-like body, but is then cut into a flat plate using a dicer to form a plurality of array-shaped (block-shaped) vibrator groups. Since the flat plate and the flexible electrode are integrated in this way, the ultrasonic probe is easy to manufacture and has high reliability because the contact area between the vibrator and the north pole is large. Note that the tip of the flat plate 12 extends outward, and an insulating coating 13 is formed on the extended portion.
第2図に示すのは、平板12が基板12aとその表面に
形成されたフレキシブルな導電性の層12bから構成さ
れてなるらのであり、このη電性層12bの厚みは超音
波の波長より十分小さい厚みになっており、フレキシブ
ルな電極と一体化されたのと同等になっており、その先
端が外部に延在して絶縁被覆されているものであり、第
1図の実施例と同様な効果がある。As shown in FIG. 2, a flat plate 12 is composed of a substrate 12a and a flexible conductive layer 12b formed on its surface, and the thickness of this η conductive layer 12b is greater than the wavelength of the ultrasonic wave. It has a sufficiently small thickness and is equivalent to being integrated with a flexible electrode, and its tip extends outward and is covered with insulation, similar to the embodiment shown in Figure 1. It has a great effect.
第5図に示ずのは、第2図の本発明のプローブにおいて
、12aのバッキング材と超音波振動子の間に介在する
平板の基板の厚みを波長の1/4にして、その音響イン
ピーダンスを変化させた時の第3図に示した従来プロー
ブとの感度差をシミュレーションによって求めたもので
ある。この時その他の条件としては、12bのフレキシ
ブルな6 r7g3性のある層としては、I’3インピ
ーダンス45 (X106kg/m23 )とし、ソ(
7) 厚ミハ波mの3/100とした。What is not shown in FIG. 5 is the acoustic impedance of the probe of the present invention shown in FIG. The difference in sensitivity with respect to the conventional probe shown in FIG. 3 was determined by simulation when the probe was changed. Other conditions at this time are that the flexible 6r7g3 layer of 12b has an I'3 impedance of 45 (X106kg/m23), and a
7) The thickness was set to 3/100 of Mihana m.
よってグラフよりわかるように従来より高感度でIS
m性の高いプローブを作るためには12aの基板の合音
インピーダンスとしては7(X106klJ/l 2
S )以下で厚みが波長の1/4のものを用い、又、1
2bの導電性のある層としては例えば銅のようなものを
用いた平板を使用すればよい。Therefore, as you can see from the graph, the IS has higher sensitivity than before.
In order to make a probe with high m-characteristics, the combined sound impedance of the 12a board should be 7 (X106klJ/l 2
S) below, the thickness is 1/4 of the wavelength, and
As the conductive layer 2b, a flat plate made of, for example, copper may be used.
又、背面のバッキング材と出音1振動子の間の平板を何
層かにして形成することも可能であり、それによって、
より高感度又は広帯域の超音波プローブを作ることがで
きる。It is also possible to form a flat plate between the backing material on the back and the first sound emitting vibrator in several layers, thereby
More sensitive or broadband ultrasound probes can be made.
[発明の効果]
以上詳述した本発明によれば、高感度、広帯域化が図れ
、振動子とN極との接触面積が大きく、しかも電極引出
しや位置決めに手間のかからない超音波プローブを提供
することができる。[Effects of the Invention] According to the present invention described in detail above, it is possible to provide an ultrasonic probe that has high sensitivity and a wide band, has a large contact area between the transducer and the north pole, and does not require time and effort for electrode extraction and positioning. be able to.
第1図は本発明の超音波プローブの断面図、第2図は本
発明の他の実施例たる超音波プローブの断面図、第3図
は従来の超音波プローブの断面図、第4図は背面に平板
のバッキング唐を入れた超音波プローブの従来例の断面
図及び第5図は感度差を示す特性図である。
1・・・・・・超音波撮動子、
2・・・・・・フレキシブルな電極、
3・・・・・・バッキング材、 4・・・・・・第1整
合層、5・・・・・・第2整合層、 6・・・・・・導
電性接着剤、7・・・・・・超音波撮動子の電極、 8
・・・・・・アース板、9・・・・・・バッキング材と
、超音波撮動子の間に介在する平板、 10.11・・
・・・・リード、12・・・・・・バッキング材と、超
音波@動子の間に介在する導電性のある平板、 13・
・・・・・絶縁体。
代理人 弁理士 則 近 憲 佑(ほか1名)第2図
」二コ
ト
−rFIG. 1 is a cross-sectional view of an ultrasonic probe according to the present invention, FIG. 2 is a cross-sectional view of an ultrasonic probe according to another embodiment of the present invention, FIG. 3 is a cross-sectional view of a conventional ultrasonic probe, and FIG. A sectional view of a conventional example of an ultrasonic probe having a flat backing plate on the back side and FIG. 5 are characteristic diagrams showing sensitivity differences. DESCRIPTION OF SYMBOLS 1... Ultrasonic sensor, 2... Flexible electrode, 3... Backing material, 4... First matching layer, 5... ... second matching layer, 6 ... conductive adhesive, 7 ... electrode of ultrasonic sensor, 8
...Earth plate, 9...Flat plate interposed between the backing material and the ultrasonic sensor, 10.11...
... Lead, 12 ... Conductive flat plate interposed between the backing material and the ultrasonic @ mover, 13.
·····Insulator. Agent Patent Attorney Noriyuki Chika (and 1 other person) Figure 2” Nikoto-r
Claims (3)
方体状のバッキング材上に固定されてなる超音波プロー
ブにおいて、前記平板は少なくとも振動子との接触面が
可撓性を有する導電性材料から成り、前記振動子の電極
に接続されると共に、先端がバッキング材壁面方向に延
在形成されていることを特徴とする超音波プローブ。(1) In an ultrasonic probe in which a plurality of block-shaped ultrasonic transducers are fixed on a rectangular parallelepiped backing material via a flat plate, the flat plate is conductive and has flexibility at least on the contact surface with the transducers. An ultrasonic probe made of a material, connected to an electrode of the vibrator, and having a tip extending in the direction of the wall surface of the backing material.
いることを特徴とする特許請求の範囲第1項記載の超音
波プローブ。(2) The ultrasonic probe according to claim 1, wherein the thickness of the flat plate is an integral multiple of 1/4 of the wavelength.
ものであることを特徴とする特許請求の範囲第1項又は
第2項記載の超音波プローブ。(3) The ultrasonic probe according to claim 1 or 2, wherein the flat plate is a flexible member with a conductive layer formed on the flat surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23846984A JPS61118099A (en) | 1984-11-14 | 1984-11-14 | Ultrasonic wave probe |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23846984A JPS61118099A (en) | 1984-11-14 | 1984-11-14 | Ultrasonic wave probe |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61118099A true JPS61118099A (en) | 1986-06-05 |
JPH0553120B2 JPH0553120B2 (en) | 1993-08-09 |
Family
ID=17030694
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23846984A Granted JPS61118099A (en) | 1984-11-14 | 1984-11-14 | Ultrasonic wave probe |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61118099A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011152303A (en) * | 2010-01-28 | 2011-08-11 | Toshiba Corp | Ultrasonic transducer, ultrasonic probe and method for manufacturing ultrasonic transducer |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59189834A (en) * | 1983-04-11 | 1984-10-27 | オリンパス光学工業株式会社 | Appay type ultrasonic probe |
-
1984
- 1984-11-14 JP JP23846984A patent/JPS61118099A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59189834A (en) * | 1983-04-11 | 1984-10-27 | オリンパス光学工業株式会社 | Appay type ultrasonic probe |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011152303A (en) * | 2010-01-28 | 2011-08-11 | Toshiba Corp | Ultrasonic transducer, ultrasonic probe and method for manufacturing ultrasonic transducer |
US8604671B2 (en) | 2010-01-28 | 2013-12-10 | Kabushiki Kaisha Toshiba | Ultrasound transducer, ultrasound probe, and a method for manufacturing ultrasound transducers |
Also Published As
Publication number | Publication date |
---|---|
JPH0553120B2 (en) | 1993-08-09 |
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