JPS5817358A - Ultrasonic probe - Google Patents

Ultrasonic probe

Info

Publication number
JPS5817358A
JPS5817358A JP11444281A JP11444281A JPS5817358A JP S5817358 A JPS5817358 A JP S5817358A JP 11444281 A JP11444281 A JP 11444281A JP 11444281 A JP11444281 A JP 11444281A JP S5817358 A JPS5817358 A JP S5817358A
Authority
JP
Japan
Prior art keywords
matching layer
adhesive
piezo
ultrasonic probe
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11444281A
Other languages
Japanese (ja)
Inventor
Hiroki Honda
本多 博樹
Shuji Suzuki
修次 鈴木
Mamoru Izumi
守 泉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP11444281A priority Critical patent/JPS5817358A/en
Publication of JPS5817358A publication Critical patent/JPS5817358A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22Details, e.g. general constructional or apparatus details
    • G01N29/28Details, e.g. general constructional or apparatus details providing acoustic coupling, e.g. water

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Transducers For Ultrasonic Waves (AREA)

Abstract

PURPOSE:To eliminate damage and peeling of machining layers by employing a soft adhesive for the bonding of a first matching layer with a piezo-electric vibrator in an ultrasonic probe having more than one sound maching layers. CONSTITUTION:A piezo-electric vibrator 23 in which silver electrodes 22 and 24 are mounted on the top and bottom surfaces thereof is bonded on a packing material 20, a first matching layer 26 with a thickness of lambda/4 bonded on the top surface thereof with a soft adhesive and a second matching layer 28 with a thickness of lambda/4 bonded on the surface thereof with an adhesive 27 to form an ultrasonic probe. An electric signal is inputted from signal drawing wires 30 and 31 while ultrasonic waves are radiated from the second matching layer in contact with an object 2 to be inspected. As the hardness of the adhesive lowers, the trailing time thereof reduces thereby indicating a better ultrasonic wave reflection characteristic. Where an adhesive is applied on the electrode surface of the piezo-electric vibrator and the surface of the first matching layer and hardened in an electric furnace or the like, the use of a soft adhesive allows ample absorption of difference in the thermal expansion coefficient of material between the piezo-electric vibrator and the first matching layer thereby making the matching layers hard to damage and peel.

Description

【発明の詳細な説明】 仁の発明は超音波探触子に係り、特に音響整合層を二層
以上有する超音波探触子に関する。
DETAILED DESCRIPTION OF THE INVENTION Jin's invention relates to an ultrasonic probe, and particularly to an ultrasonic probe having two or more acoustic matching layers.

従来、超音波探触子は圧電振動子より放射された超音波
が被検物(例えば人体勢)に有効に伝達されるように第
1図(a)K示されるごとく、圧電振動子3の超音波放
射面に音響整合層5を有する構造となってりた・この音
響整合層は、第1図(blK示されるように、2層構造
あるいは、七れ以上の構造を有するものもあるが、実用
上は1層ある1Fi2層構造のものが多く市販されてi
る。例えば人体に超音波を入射させ、その反射波によっ
て身体の情報を得る、−わゆる医用超音波探触子におi
″c蝶、圧電振動子の音響インピーダンスが32J X
 10’ kg/B”set人体の音響インピーダンス
が1.5 X lo@47@”@ecであるので2層整
合層構造の超音波探触子では、al l整合層の音響イ
ンピーダンスは、15.OX 10’JIl)/@’s
ec、第2整合層の音響インピーダンスは3.23 X
 xo”#i/♂sec  となる( l1if”  
  on 8&U Yoj8U−26,No6.Noy
、1979J、H,Gold pass〜393 参照
)。仁の結果、例えば第l整合層は、石英ガラス、亀2
整合層は、MMA樹脂が使用されてiる。この場合、圧
電振動子と第1整合層の接着には、青畳インピーダンス
の高−接着削會使用するのが一般的であるか、これらの
接着剤では、温度の変化による熱膨張の違−によって整
合層の破壊やはくりが生じやすく、超音波探触子製造歩
留り低下の一因となっていた。
Conventionally, an ultrasonic probe has a piezoelectric transducer 3, as shown in FIG. The structure has an acoustic matching layer 5 on the ultrasonic radiation surface.This acoustic matching layer may have a two-layer structure or a structure with seven or more layers, as shown in Figure 1 (blK). In practical use, there are many 1Fi two-layer structures on the market that have one layer.
Ru. For example, a so-called medical ultrasound probe is used to inject ultrasound into the human body and obtain information about the body from the reflected waves.
``c butterfly, the acoustic impedance of the piezoelectric vibrator is 32J
10'kg/B"set The acoustic impedance of the human body is 1.5 x lo@47"@ec, so in an ultrasound probe with a two-layer matching layer structure, the acoustic impedance of the al l matching layer is 15. OX 10'JIl)/@'s
ec, the acoustic impedance of the second matching layer is 3.23
xo”#i/♂sec (l1if”
on 8&U Yoj8U-26, No6. Noy
, 1979J, H, Gold pass~393). As a result, for example, the first matching layer is made of quartz glass, Kame 2
The matching layer is made of MMA resin. In this case, it is common to use a high-impedance bonding agent to bond the piezoelectric vibrator and the first matching layer, or these adhesives may be bonded due to differences in thermal expansion due to temperature changes. The matching layer is prone to breakage or peeling, which is one of the causes of a decline in the manufacturing yield of ultrasonic probes.

また、これらの接着剤は(1層度が尚<、Qが大きφた
め、振動子間Km着剤が混入し、近接する両側の振動子
へ振動が伝わって、不要な振動が生じたり、必要な面積
以上の部分より超音波が放出される等の悪影響が生じて
−た。
In addition, since these adhesives (1 layer degree is still <1 layer degree) and Q are large φ, Km adhesive between the transducers gets mixed in, and vibrations are transmitted to the adjacent transducers on both sides, causing unnecessary vibrations. Adverse effects such as ultrasonic waves being emitted from areas larger than the required area occurred.

この発明は、上記の点に鑑みて、なされたもので音響整
合層と圧電振動子の接着に軟質系接着剤によって接着さ
れた超音波探触子を提供することを目的とするものであ
る。この発明は、二層以上の音響整合層を有する超音波
探触子において第1整合層と圧電振動子との接着に軟質
系接着剤を使用し、整合層の破損やはぐり等をなりシ、
また、接着剤のはみだし等による音響的結合をなくし、
特性の実効な探触千金製造できるようにしたものである
The present invention has been made in view of the above points, and an object of the present invention is to provide an ultrasonic probe in which an acoustic matching layer and a piezoelectric vibrator are bonded together using a soft adhesive. This invention uses a soft adhesive to bond the first matching layer and the piezoelectric vibrator in an ultrasonic probe having two or more acoustic matching layers, thereby preventing damage or peeling off of the matching layer.
In addition, acoustic coupling due to adhesive protrusion etc. is eliminated,
This makes it possible to manufacture probes with effective characteristics.

以下、この発明を図面を参照して詳細に説明する。第2
図は、この発明の一実施例を示すものであシ、圧電振動
子23の上下面に銀電極22.24をつけたものをバッ
キング材20の上に接着し、その上面にλ/4の厚さを
有する第1整合層26を軟質接着剤25によって接着し
、その上面にλ/4厚さを有するJR2整合層28を接
着剤27によって接着した構造をもつ超音波探触子であ
る。電気信号は信号引き出し4930.31よ〕入力し
、超音波は被検査物29に接する#I2整合層よ)放射
される。第3図は@2図に示される圧電振動子と第1整
合層の接着に使用する接着剤の硬度と超音波反射波の尾
引き特性の関係を示す。同図に示されるように接着剤の
硬度が低下するに従い、尾引き時間が短かくなシ、長幼
な超音波反射特性を示すことがわかる。また圧電振動子
に第1整合層を接着する場合には、圧電振動子の電極面
と第1整合層の面に接着剤を塗布し、電気炉等に入れ硬
化させる場合、圧電撮動子と第1整合層の材料の熱膨張
率が異なっているため硬度の高い接着剤では、この熱膨
張率の違いを吸収できず、整合層の破損やはくシが生じ
やすいが、本発明の5ように軟質系接着剤を使用した場
合には、この熱膨張率の違いを充分に吸収でき、整合層
の破損やはく9ということが生じにくくなる。さらにこ
の超音波探触子がアレイ構造を有する場合には、この接
着剤が圧電振動子の間に浸入してしまった場合に、この
接着剤が硬質の場合には音響的伝搬体となってはたらき
、今、駆動しようとする振動子以外の隣接する振動子ま
でも駆動してしまう・しかし、本発明のようにこの接着
剤が軟質の場合は逆に振動を吸収し、隣接振動子との音
響的結合は与られない。
Hereinafter, the present invention will be explained in detail with reference to the drawings. Second
The figure shows an embodiment of the present invention, in which a piezoelectric vibrator 23 with silver electrodes 22 and 24 attached to the upper and lower surfaces is glued onto the backing material 20, and a λ/4 This ultrasonic probe has a structure in which a first matching layer 26 having a thickness is adhered with a soft adhesive 25, and a JR2 matching layer 28 having a thickness of λ/4 is adhered to the upper surface thereof with an adhesive 27. The electrical signal is inputted from the signal extraction 4930.31, and the ultrasonic wave is emitted from the #I2 matching layer in contact with the object to be inspected 29. FIG. 3 shows the relationship between the hardness of the adhesive used to bond the piezoelectric vibrator and the first matching layer shown in FIG. As shown in the same figure, it can be seen that as the hardness of the adhesive decreases, the trailing time does not become shorter and the ultrasonic reflection characteristics become longer. In addition, when bonding the first matching layer to the piezoelectric vibrator, apply adhesive to the electrode surface of the piezoelectric vibrator and the surface of the first matching layer, and place the adhesive in an electric furnace or the like to harden it. Since the materials of the first matching layer have different thermal expansion coefficients, a hard adhesive cannot absorb this difference in thermal expansion coefficient, and the matching layer is likely to break or flake. When such a soft adhesive is used, this difference in coefficient of thermal expansion can be sufficiently absorbed, and damage to the matching layer and flaking 9 are less likely to occur. Furthermore, when this ultrasonic probe has an array structure, if this adhesive penetrates between the piezoelectric transducers, if this adhesive is hard, it will become an acoustic propagator. However, if this adhesive is soft as in the present invention, it will absorb the vibrations and cause the vibrations to deteriorate. No acoustic coupling is provided.

以上説明したように本発明によれば整合層の破損やはく
9を防止することができ超音波探触子の性能及び信頼性
の向上管区ることができる。
As explained above, according to the present invention, damage to the matching layer and flaking 9 can be prevented, and the performance and reliability of the ultrasonic probe can be improved.

辣探触子のモデル化した断面構造図、纂2図は本発明の
一実施例を示す断面構造図、第3図は本発明による超音
波探触子の尾引き特性と接着剤の硬度との関係を示す図
である。
Figure 2 is a cross-sectional diagram showing an embodiment of the present invention, and Figure 3 is a cross-sectional diagram showing the tailing characteristics of the ultrasonic probe according to the present invention and the hardness of the adhesive. FIG.

20・・・バッキング材 22.24・・・銀電極 23・・・圧電振動子 26.28・・・音響整合層 25・・・軟質接着剤 27・・・接着剤 第1図 ジ3120...Backing material 22.24...Silver electrode 23...Piezoelectric vibrator 26.28...Acoustic matching layer 25... Soft adhesive 27...Adhesive Figure 1 Ji 31

Claims (1)

【特許請求の範囲】[Claims] 対向した上下面に電極管形成した圧電振動子の一方の面
がバッキング材に接着され、他方の面上に音響整合層が
二層以上構成された超音波探触子におiて、前記圧電振
動子が軟質接着剤金倉して前記多層音響整合層のうちの
最も圧電振動子に近い層に接着されてなる仁とを特徴と
する超音波探触子。
In an ultrasonic probe in which one surface of a piezoelectric vibrator having electrode tubes formed on opposing upper and lower surfaces is adhered to a backing material, and two or more acoustic matching layers are configured on the other surface, the piezoelectric An ultrasonic probe characterized in that a vibrator is bonded to a layer of the multilayer acoustic matching layer closest to the piezoelectric vibrator using a soft adhesive.
JP11444281A 1981-07-23 1981-07-23 Ultrasonic probe Pending JPS5817358A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11444281A JPS5817358A (en) 1981-07-23 1981-07-23 Ultrasonic probe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11444281A JPS5817358A (en) 1981-07-23 1981-07-23 Ultrasonic probe

Publications (1)

Publication Number Publication Date
JPS5817358A true JPS5817358A (en) 1983-02-01

Family

ID=14637833

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11444281A Pending JPS5817358A (en) 1981-07-23 1981-07-23 Ultrasonic probe

Country Status (1)

Country Link
JP (1) JPS5817358A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6084099A (en) * 1983-08-31 1985-05-13 エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン Supersonic transducer
JPS60113597A (en) * 1983-11-24 1985-06-20 Nec Corp Ultrasonic wave probe
JPS61176848A (en) * 1985-01-31 1986-08-08 Honda Keisuke Ultrasonic microscope
JPS61276500A (en) * 1985-05-31 1986-12-06 Nec Corp Ultrasonic probe and its manufacture
JPS61278299A (en) * 1985-06-04 1986-12-09 Nec Corp Ultrasonic probe and its manufacture
JPS61278298A (en) * 1985-06-04 1986-12-09 Nec Corp Ultrasonic probe and its manufacture
JPH0278792A (en) * 1988-09-14 1990-03-19 Hitachi Ltd Turbo type compressor
JPH03107758A (en) * 1989-09-21 1991-05-08 Terumo Corp Air bubble detection sensor
US5763262A (en) * 1986-09-18 1998-06-09 Quidel Corporation Immunodiagnostic device
KR19990045153A (en) * 1997-11-11 1999-06-25 이데이 노부유끼 Ultrasonic probe manufacturing method, ultrasonic probe and ultrasonic imaging device
JP2009213137A (en) * 2008-02-29 2009-09-17 General Electric Co <Ge> Apparatus and method for increasing sensitivity of ultrasound transducers

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52101090A (en) * 1976-02-19 1977-08-24 Matsushita Electric Ind Co Ltd Ultrasonic probe
JPS54131380A (en) * 1978-03-31 1979-10-12 Hitachi Medical Corp Dumbbell type ultrasonic wave detecting contacting piece
JPS5535654A (en) * 1978-09-06 1980-03-12 Tokyo Shibaura Electric Co Ultrasonic wave probe and its preparation

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52101090A (en) * 1976-02-19 1977-08-24 Matsushita Electric Ind Co Ltd Ultrasonic probe
JPS54131380A (en) * 1978-03-31 1979-10-12 Hitachi Medical Corp Dumbbell type ultrasonic wave detecting contacting piece
JPS5535654A (en) * 1978-09-06 1980-03-12 Tokyo Shibaura Electric Co Ultrasonic wave probe and its preparation

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6084099A (en) * 1983-08-31 1985-05-13 エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン Supersonic transducer
JPS60113597A (en) * 1983-11-24 1985-06-20 Nec Corp Ultrasonic wave probe
JPS61176848A (en) * 1985-01-31 1986-08-08 Honda Keisuke Ultrasonic microscope
JPS61276500A (en) * 1985-05-31 1986-12-06 Nec Corp Ultrasonic probe and its manufacture
JPS61278299A (en) * 1985-06-04 1986-12-09 Nec Corp Ultrasonic probe and its manufacture
JPS61278298A (en) * 1985-06-04 1986-12-09 Nec Corp Ultrasonic probe and its manufacture
US5763262A (en) * 1986-09-18 1998-06-09 Quidel Corporation Immunodiagnostic device
JPH0278792A (en) * 1988-09-14 1990-03-19 Hitachi Ltd Turbo type compressor
JPH03107758A (en) * 1989-09-21 1991-05-08 Terumo Corp Air bubble detection sensor
KR19990045153A (en) * 1997-11-11 1999-06-25 이데이 노부유끼 Ultrasonic probe manufacturing method, ultrasonic probe and ultrasonic imaging device
JP2009213137A (en) * 2008-02-29 2009-09-17 General Electric Co <Ge> Apparatus and method for increasing sensitivity of ultrasound transducers

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