JP2945978B2 - Array type ultrasonic probe - Google Patents
Array type ultrasonic probeInfo
- Publication number
- JP2945978B2 JP2945978B2 JP1312164A JP31216489A JP2945978B2 JP 2945978 B2 JP2945978 B2 JP 2945978B2 JP 1312164 A JP1312164 A JP 1312164A JP 31216489 A JP31216489 A JP 31216489A JP 2945978 B2 JP2945978 B2 JP 2945978B2
- Authority
- JP
- Japan
- Prior art keywords
- plate
- piezoelectric plate
- composite
- composite piezoelectric
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
Description
【発明の詳細な説明】 (産業上の利用分野) 本発明は配列型超音波探触子(以下、配列型探触子と
する)を利用分野とし、特に複合圧電板を使用した配列
型探触子に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to an array type ultrasonic probe (hereinafter, referred to as an array type probe), and particularly to an array type probe using a composite piezoelectric plate. About the tentacles.
(発明の背景) 配列型探触子は、例えば医用関係の超音波診断装置に
超音波の送受波部として有用される。近年では広帯域特
性を得るべく、圧電材に高分子樹脂を充填した複合圧電
板材の利用が注目を浴びている。(Background of the Invention) An array-type probe is useful as a transmitting and receiving unit of an ultrasonic wave in, for example, an ultrasonic diagnostic apparatus for medical use. In recent years, in order to obtain broadband characteristics, use of a composite piezoelectric plate material in which a piezoelectric material is filled with a polymer resin has attracted attention.
(従来技術) 第3図はこの種の複合圧電板を使用した配列型探触子
を説明する図である。(Prior Art) FIG. 3 is a view for explaining an array-type probe using a composite piezoelectric plate of this type.
複合圧電板1はチタン酸ジルコン酸鉛(通称PZT)等
の微小圧電片2と高分子樹脂3との複合材からなる。例
えば、平板状の図示しない圧電板を基台4上に固着した
後、縦横に切断して溝を設け、多数の微小圧電片2を形
成する。そして、各溝及びその外周に高分子樹脂3を充
填して微小圧電片3を結合する「第3図(a)」。The composite piezoelectric plate 1 is made of a composite material of a micro piezoelectric piece 2 such as lead zirconate titanate (commonly called PZT) and a polymer resin 3. For example, a flat piezoelectric plate (not shown) is fixed on the base 4 and then cut vertically and horizontally to form grooves, thereby forming a large number of micro piezoelectric pieces 2. Then, each groove and its outer periphery are filled with the polymer resin 3 and the micro piezoelectric pieces 3 are joined together (FIG. 3A).
次に、これを基台4から取り外して両主面に列状の対
向する電極5を形成する。そして、このような複合圧電
板1をバッキング材6上に取着し、電極対向部分をそれ
ぞれ振動部とする。但し、バッキング材6上にはフレキ
シブルプリント基板(以下フレキシブル基板とする)7
の一端側が固着されている。そして、一端側に露出した
各導電路8と各列状電極とを一致させて電気的・機械的
に接続する「第3図(b)」。あるいは、基台4から取
り外した後、両主面の全面に電極5を形成してバッキン
グ6材上に取着する。そして、電極上からバッキング材
6に達する切れ目9を設けて複合圧電板1とともにフレ
キシブル基板7の各導電路8となる共通線路を分割し
「第4図(a)」、配列型探触子を構成していた。Next, this is detached from the base 4 to form the rows of opposed electrodes 5 on both main surfaces. Then, such a composite piezoelectric plate 1 is mounted on the backing material 6, and the opposing portions of the electrodes are used as vibrating portions. However, a flexible printed board (hereinafter referred to as a flexible board) 7 is provided on the backing material 6.
Is fixed at one end. Then, the respective conductive paths 8 exposed at one end side and the respective row electrodes are aligned and electrically and mechanically connected as shown in FIG. 3 (b). Alternatively, after removing from the base 4, the electrodes 5 are formed on the entire surfaces of both main surfaces, and attached on the backing 6 material. Then, a cut 9 reaching the backing material 6 from above the electrode is provided to divide the common line to be each conductive path 8 of the flexible substrate 7 together with the composite piezoelectric plate 1 to divide the common line as shown in FIG. Was composed.
したがって、このようなものでは、複合圧電板1は高
分子樹脂の存在により、圧電板のみの場合より周波数特
性を広帯域とする。また、音響インピーダンスを小さく
するので、被検出体を例えば生体としたときにその差を
小さくし、音響整合層を一層のみにできるなどの特長を
有する。Therefore, in such a structure, the composite piezoelectric plate 1 has a wider frequency characteristic due to the presence of the polymer resin than the case where only the piezoelectric plate is used. Further, since the acoustic impedance is reduced, the difference is reduced when the object to be detected is, for example, a living body, and the acoustic matching layer can be formed as a single layer.
(従来技術の問題点) しかしながら、上記構成の配列型探触子では、列状の
電極5を形成して構成する場合は、フレキシブル基板7
の各導電路8と一致させてバッキング材上6に取着しな
ければならないので、その位置決めを困難として作業性
を低下させる。また、全面に電極5を形成して分割する
場合には、複合圧電板1の形成時を含めた切断工程が多
くて生産性に劣るの問題点があった。(Problems of the prior art) However, in the array-type probe having the above configuration, when the row-shaped electrodes 5 are formed and configured, the flexible substrate 7 is used.
Must be attached to the backing material 6 so as to coincide with the respective conductive paths 8, which makes positioning difficult and reduces workability. Further, when the electrode 5 is formed on the entire surface and divided, there is a problem in that the number of cutting steps including the time of forming the composite piezoelectric plate 1 is large and productivity is poor.
(発明の目的) 本発明は生産性及び特性を良好に維持した複合圧電板
使用の配列型探触子を提供することを目的とする。(Object of the Invention) An object of the present invention is to provide an array-type probe using a composite piezoelectric plate while maintaining good productivity and characteristics.
(解決手段) 本発明は、座標(x、y)のx方向に並べられた棒状
振動板の間に結合材を充填して複合圧電板を形成すると
ともに、該複合圧電板のx方向とフレキシブルプリント
基板の一端側に設けられた共通線路の延出方向とを一致
させ、前記複合圧電板をフレキシブル基板の一端側の接
続した導電板上に導電性接着剤により固着し、前記複合
圧電板と導電板と共通線路をy方向に切断して複数の棒
状複合板を形成し、該棒状結合板の表面に共通電極を設
けて構成したことを解決手段とする。以下、本発明の一
実施例を製造工程を示しながら説明する。According to the present invention, a composite piezoelectric plate is formed by filling a bonding material between bar-shaped diaphragms arranged in the x direction of coordinates (x, y), and the x direction of the composite piezoelectric plate and a flexible printed circuit board are formed. The composite piezoelectric plate is fixed on a conductive plate connected to one end of the flexible substrate with a conductive adhesive so that the extending direction of the common line provided on one end side of the composite piezoelectric plate is aligned with the conductive line. And a common line is cut in the y direction to form a plurality of rod-shaped composite plates, and a common electrode is provided on a surface of the rod-shaped composite plate. Hereinafter, an embodiment of the present invention will be described with reference to manufacturing steps.
(実施例) 第1図は本発明の一実施例を説明する超音波探触子の
工程図である。なお、前従来例図と同一部分には同番号
を付与してその説明は簡略する。(Embodiment) FIG. 1 is a process drawing of an ultrasonic probe for explaining an embodiment of the present invention. The same parts as those in the prior art are denoted by the same reference numerals, and description thereof will be simplified.
本実施例では、先ずPZTとした平板状の圧電板を基台
4上に固着し、x、y座標のx方向に切断して棒状振動
板10を形成する。なお、圧電板の両主面には予め電極5
が施されている。そして、棒状振動板10間及びその外周
に高分子樹脂3等の結合材を充填して複合圧電板11とす
る「第1図(a)」。In this embodiment, first, a plate-shaped piezoelectric plate made of PZT is fixed on the base 4 and cut in the x-direction of the x and y coordinates to form the rod-shaped diaphragm 10. Note that electrodes 5 are provided on both main surfaces of the piezoelectric plate in advance.
Is given. Then, a bonding material such as a polymer resin 3 is filled between the rod-shaped vibration plates 10 and the outer periphery thereof to form a composite piezoelectric plate 11 (FIG. 1A).
次に、複合圧電板11を導電板12上に導電性接着剤13を
用いて固着する。導電板12は例えば樹脂基板13に銅箔14
を覆って、あるいはメッキ処理等して形成される。そし
て、これをフレキシブル基板7の一端側が接続したバッ
キング材6上に固着する。但し、フレキシブル7の一端
側には共通線路17が形成されており、複合圧電板のx方
向と共通線路17の延出方向とを一致させる「第1図
(b)」。Next, the composite piezoelectric plate 11 is fixed on the conductive plate 12 using a conductive adhesive 13. The conductive plate 12 is, for example, a copper foil 14 on a resin substrate 13.
Or by plating or the like. Then, this is fixed on the backing material 6 to which one end of the flexible substrate 7 is connected. However, a common line 17 is formed on one end side of the flexible 7, and the extending direction of the common line 17 matches the x direction of the composite piezoelectric plate (FIG. 1 (b)).
次に、複合圧電板11と導電板12とを複合圧電板11上か
らバッキング材6に達する切れ目9を設けて複数の棒状
複合板16をy方向に形成する。このとき、フレキシブル
基板7の共通線路17は分断されて各棒状複合板16の電極
と個々に接続して各導電路8となる。そして、棒状複合
板の16表面に例えば導電性接着剤13を施して各圧電片の
電極5をy方向に共通接続した構成とする。なお、超音
波送受波面側には図示しない音響整合層や音響レンズ等
が取着される。Next, a plurality of bar-shaped composite plates 16 are formed in the y direction by providing a cut 9 between the composite piezoelectric plate 11 and the conductive plate 12 to reach the backing material 6 from above the composite piezoelectric plate 11. At this time, the common line 17 of the flexible substrate 7 is divided and individually connected to the electrodes of each bar-shaped composite plate 16 to form each conductive path 8. Then, for example, a conductive adhesive 13 is applied to the surface of the rod-shaped composite plate 16 to commonly connect the electrodes 5 of the respective piezoelectric pieces in the y direction. An acoustic matching layer, an acoustic lens, and the like (not shown) are attached to the ultrasonic wave transmitting / receiving surface side.
このようなものでは、導電板12とフレキシブル7の共
通線路17とを接続して分割するので、フレキシブル基板
7の各導電路5と棒状複合板16の電極を予め位置合わせ
する必要がない。また、x方向にのみ結合した複合圧電
板11をバッキング材上6に取着した後、y方向に切断す
ればよいので、従来例に比べてその切断工程を少なくで
きる。したがって、複合圧電材を使用した上で生産性を
向上できる。また、付随的に、複合圧電板11はフレキシ
ブル基板7の共通線路17に直接半田等により接続するこ
となく、導電板12に導電性接着剤により固着されるの
で、接合時における加熱及び加圧による特性劣化や破損
等を防止できる。また、棒状複合板16とバッキング材6
との間には導電材12が介在するので、例えば送受波面側
を生体等に押圧して当接させた場合、バッキング材6
(通常はゴム)の変形等による歪が棒状複合板16に伝達
することを防止して破損等を防止する。In such a structure, since the conductive plate 12 and the common line 17 of the flexible 7 are connected and divided, it is not necessary to align the conductive paths 5 of the flexible substrate 7 and the electrodes of the bar-shaped composite plate 16 in advance. Further, since the composite piezoelectric plate 11 bonded only in the x direction is attached to the backing material 6 and then cut in the y direction, the number of cutting steps can be reduced as compared with the conventional example. Therefore, productivity can be improved after using the composite piezoelectric material. In addition, since the composite piezoelectric plate 11 is fixed to the conductive plate 12 by a conductive adhesive without being directly connected to the common line 17 of the flexible substrate 7 by soldering or the like, the composite piezoelectric plate 11 is heated and pressed during bonding. Characteristic deterioration, breakage, etc. can be prevented. In addition, the rod-shaped composite plate 16 and the backing material 6
Since the conductive material 12 is interposed between the backing material and the backing material 6 when the transmitting / receiving surface is pressed against the living body or the like, for example,
Distortion due to deformation of (usually rubber) or the like is prevented from being transmitted to the rod-shaped composite plate 16 to prevent breakage or the like.
(他の事項) なお、上記実施例では、圧電板の両主面には予め電極
を形成してあるとしたが、圧電板の両主面には導電性接
着剤が施されるので、例えば分極処理をしたものであれ
ばその必要はない。また、導電板12は樹脂基板14に例え
ばメッキ処理を施したが、例えば金属等の導電体であれ
ばよい。また、複合圧電板11をy方向に切断する際、バ
ッキング材7上に達する切れ目9を設けてx方向にのみ
複合化した棒状複合板16を形成したが、例えば第2図に
示したように、切れ目9との間に導電材12に達する分割
溝18を設けて高分子樹脂3を充填し、更に棒状複合板16
をy方向をも複合化してもよい。この場合、複数の分割
溝18を設けてよいことは勿論で、x、y方向の分割度合
は音響インピーダンス、帯域特性とにより決定される。
また、切れ目9には高分子樹脂を充填してもよいもので
ある。また、複合圧電板11は圧電板をx、y方向に切断
して溝及びその外周に結合材を充填して形成したが、そ
の外周には結合材がなかったとしてもよい。また、導電
材12はバッキング材上に固着したが、直接図示しない保
持台に固着してもよい。(Other Matters) In the above embodiment, electrodes are formed on both main surfaces of the piezoelectric plate in advance. However, since a conductive adhesive is applied to both main surfaces of the piezoelectric plate, for example, This is not necessary as long as it has been subjected to polarization processing. Further, the conductive plate 12 is obtained by plating the resin substrate 14, for example, but may be any conductive material such as a metal. Further, when the composite piezoelectric plate 11 is cut in the y direction, a cut 9 reaching the backing material 7 is provided to form a rod-shaped composite plate 16 which is composited only in the x direction. For example, as shown in FIG. A groove 18 reaching the conductive material 12 is provided between the gap 9 and the conductive material 12 and the polymer resin 3 is filled.
May also be combined in the y direction. In this case, it goes without saying that a plurality of division grooves 18 may be provided, and the degree of division in the x and y directions is determined by the acoustic impedance and the band characteristics.
The cut 9 may be filled with a polymer resin. Further, the composite piezoelectric plate 11 is formed by cutting the piezoelectric plate in the x and y directions and filling the groove and its outer periphery with a binder, but the outer periphery may be free of the binder. Further, the conductive material 12 is fixed on the backing material, but may be fixed directly on a holding table (not shown).
(発明の効果) 本発明は、座標(x、y)のx方向に並べられた棒状
振動板の間に結合材を充填して複合圧電板を形成すると
ともに、該複合圧電板のx方向とフレキシブルプリント
基板の一端側に設けられた共通線路の延出方向とを一致
させ、前記複合圧電板をフレキシブル基板の一端側の接
続した導電板上に導電性接着剤により固着し、前記複合
圧電板と導電板と共通線路をy方向に切断して複数の棒
状複合板を形成し、該棒状結合板の表面に共通電極を設
けて構成したので、生産性及び特性を良好に維持した複
合圧電板使用の配列型探触子を提供でき、その実際上の
効果は大きい。(Effects of the Invention) The present invention forms a composite piezoelectric plate by filling a bonding material between rod-shaped diaphragms arranged in the x direction of coordinates (x, y), and forms a flexible print with the x direction of the composite piezoelectric plate. The extending direction of the common line provided on one end side of the substrate is matched, and the composite piezoelectric plate is fixed on a conductive plate connected to one end side of the flexible substrate with a conductive adhesive, and the composite piezoelectric plate is electrically conductive with the composite piezoelectric plate. The plate and the common line are cut in the y-direction to form a plurality of rod-shaped composite plates, and a common electrode is provided on the surface of the rod-shaped composite plate, so that a composite piezoelectric plate that maintains good productivity and characteristics can be used. An array type probe can be provided, and its practical effect is great.
第1図は本発明の一実施例を説明するための超音波探触
子の工程図で、同図(a)(b)は斜視図、同図(c)
は一部破断の正面図である。 第2図は本発明の他の実施例を説明する超音波探触子の
一部破断の正面図である。 第3図は従来例を説明するための超音波探触子の工程図
で、同図(a)は斜視図、同図(b)(c)は一部破断
の正面図である。1 (a) and 1 (b) are perspective views, and FIG. 1 (c) is a process diagram of an ultrasonic probe for explaining an embodiment of the present invention.
Is a partially broken front view. FIG. 2 is a partially cutaway front view of an ultrasonic probe illustrating another embodiment of the present invention. 3A and 3B are process diagrams of an ultrasonic probe for explaining a conventional example, wherein FIG. 3A is a perspective view, and FIGS. 3B and 3C are partially cutaway front views.
Claims (1)
振動板の間に結合材を充填して複合圧電板を形成すると
ともに、該複合圧電板のx方向とフレキシブルプリント
基板の一端側に設けられた共通線路の延出方向とを一致
させ、前記複合圧電板をフレキシブル基板の一端側の接
続した導電板上に導電性接着剤により固着し、前記複合
圧電板と導電板と共通線路をy方向に切断して複数の棒
状複合板を形成し、該棒状結合板の表面に共通電極を設
けて構成したことを特徴とする配列型超音波探触子。1. A composite piezoelectric plate is formed by filling a bonding material between bar-shaped diaphragms arranged in the x direction of coordinates (x, y), and the composite piezoelectric plate is formed in the x direction and one end of a flexible printed circuit board. The composite piezoelectric plate is fixed on a conductive plate connected to one end of a flexible substrate with a conductive adhesive, and the composite piezoelectric plate and the conductive plate are connected to the common line. Are cut in the y-direction to form a plurality of rod-shaped composite plates, and a common electrode is provided on the surface of the rod-shaped composite plate, thereby providing an array-type ultrasonic probe.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1312164A JP2945978B2 (en) | 1989-11-30 | 1989-11-30 | Array type ultrasonic probe |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1312164A JP2945978B2 (en) | 1989-11-30 | 1989-11-30 | Array type ultrasonic probe |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03172099A JPH03172099A (en) | 1991-07-25 |
JP2945978B2 true JP2945978B2 (en) | 1999-09-06 |
Family
ID=18026008
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1312164A Expired - Fee Related JP2945978B2 (en) | 1989-11-30 | 1989-11-30 | Array type ultrasonic probe |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2945978B2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3049672B2 (en) | 1991-12-26 | 2000-06-05 | キヤノン株式会社 | Image processing method and apparatus |
US6669644B2 (en) * | 2001-07-31 | 2003-12-30 | Koninklijke Philips Electronics N.V. | Micro-machined ultrasonic transducer (MUT) substrate that limits the lateral propagation of acoustic energy |
-
1989
- 1989-11-30 JP JP1312164A patent/JP2945978B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH03172099A (en) | 1991-07-25 |
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