JPS6268400A - Manufacture of ultrasonic probe - Google Patents

Abstract

PURPOSE:To arrange two-dimensionally the vibrating element by bonding the tip of the lead wire group of the same height provided at respective lattice points of the supporting plate to the piezo-electric plate, flowing and hardening the acoustic packing material between the supporting plate and the piezo-electric plate and cutting the piezo-electric plate longitudinally and horizontally along the section of the lattice point of the supporting plate. CONSTITUTION:A lead wire 2 of the same height is provided at the lattice point of a supporting plate 1, and connected to the surface of a pizeo-electric plate 3 where the tip part is arranged and the electrode is applied to both surfaces. Next, a pillar-type packing material 4 is flown and hardened between the piezo-electric plate 3 and the supporting plate 1, and along the section between the lattice points provided with a lead wire group 2, the piezo-electric plate 3 is cut longitudinally and horizontally. Especially, when the lead wire group 2 is bonded to the piezo-electric plate 3 by the solder layer, the solder layer is also cut, and electrically, respective vibrating elements 5 are made independent. Thus, the supersonic probe to arrange two-dimensionally the vibrating element can be easily manufactured.

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a method of manufacturing an ultrasonic probe that transmits ultrasonic waves to a target object and receives the echo thereof, and in particular, The present invention relates to a method of manufacturing ultrahigh wave probes arranged in two dimensions.

[Advantages and problems with the technology of the invention] Conventionally, ultrasonic diagnostic equipment used particularly in the medical field has been known to drive each transducer at earlier timings at the periphery and later at the center in order to increase image resolution. Focus is applied to make the ultrasonic beam narrower. Furthermore, in order to further improve the resolution, the focal point of the electronic focus is changed to a point where ultrasonic echoes are received or transmitted. Ultrasonic beams are transmitted and received in a conical shape in order to suppress the generation of side lobes! I! It is said to be a thought. That is, it is desirable to optimally control a group of vibrating elements arranged in at least two dimensions to transmit and receive ultrasound beams in a quadrangular pyramidal manner. However, this type of device currently used in the clinical field uses an ultrasonic probe with a one-dimensional array of strip-shaped single radial elements, and electronically focuses in this direction. In the orthogonal direction, the focal point is fixed at a specific depth using an acoustic lens.

This is because it is difficult to manufacture a two-dimensionally arranged vibrating element group, especially to draw out the electrodes of the pendulum other than the peripheral portion, making it impossible to put it into practical use. Regarding the extraction of electrodes in conventional ultrasonic wave generators, see Japanese Patent Publication No. 551225.
A technique such as that disclosed in Japanese Patent No. 4 can be used. However, an ultrasonic probe equipped with a two-dimensional array of vibrating elements cannot be easily manufactured because it is impossible to connect the vibrating elements other than the peripheral parts.

[Object of the Invention] An object of the present invention is to easily manufacture an ultrasonic probe having a two-dimensional array of LA probes.

[Summary of the Invention] In order to achieve this invention, the present invention includes the steps of: bonding the tips of lead wire groups of the same height set up at each lattice point of a support plate to a piezoelectric plate; and the step of bonding the support plate and the piezoelectric plate. Pour acoustic packing material in between.
and a step of cutting the piezoelectric plate vertically and horizontally along the lattice points of the support plate to make it electrically independent.

[Embodiments of the invention] Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view showing a lead wire group 2 supported by a support plate 1 used in the same embodiment.

Lead wires 2 of the same height are erected at grid points on the support plate 1. Such a support plate 1 and lead wire group 2 may be created by, for example, making holes at the lattice points of the support plate 1, inserting the lead wires 2 from the back side, and trimming the tip surfaces.

Next, as shown in the perspective view of FIG. 2, it is erected on the support plate 1,
The tips of the lead wire group 2 whose tips are aligned are adhered to the surface of a piezoelectric plate 3 whose both sides are coated with electrodes. This adhesion may be performed, for example, by pouring solder on the lead wire group 2 while standing on the piezoelectric plate 3 to form a thin solder layer (not shown). Alternatively, the tip may be dipped into a conductive adhesive, placed on the piezoelectric plate 3, and bonded.

Next, as shown in the perspective view of FIG. 3, a cast packing material 4 is poured between the piezoelectric plate 3 and the support plate 1 and hardened. That is, in the state shown in FIG. 2, the side surface is wrapped and the cast packing material 4 is poured into it.

The cast packing material 4 may be made of, for example, epoxy resin mixed with a substance for matching acoustic impedance, such as zinc powder. Note that although the cast packing material 4 needs to be in close contact with the piezoelectric plate 3, it does not need to be in close contact with the support plate 1.

Next, as shown in the perspective view of FIG. 4, the piezoelectric plate 3 is cut vertically and horizontally along and between the lattice points where the lead wire groups 2 are set up. In particular, if the lead wire group 2 is bonded to the piezoelectric plate 3 by a solder layer, this solder layer is also cut so that each vibrating element 5 is electrically independent.

Furthermore, a matching layer with the same name may be provided on the upper surface of the vibrating element 5 to achieve alignment with the object to be inspected using a thin conductive adhesive layer. Furthermore, this conductive adhesive layer may be used as a common arm for each vibrating element.

In addition, since the vibrating elements are driven at the same timing with respect to the center in the direction perpendicular to the plane where the ultra-8 wave beam is scanned, a printed board with a pattern in which lead wires are connected symmetrically with respect to the center is used. Alternatively, the support plate 1 may be formed to reduce the number of connections between the lead wires 3 and the main body of the device.

Note that the present invention is not limited to the above embodiments,
It also includes various modifications without departing from the scope of the invention.

[Effects of the Invention] As described above, according to the present invention, an ultrasonic probe in which vibrating elements are arranged two-dimensionally can be easily manufactured.

[Brief explanation of drawings]

1 to 4 are perspective views of one embodiment of the present invention. 1... Support plate, 2... Lead wire group, 3... Piezoelectric plate 4... Casting packing material

Claims (1)

[Claims] A step of gluing the ends of a group of lead wires of the same height at each grid point of a support plate to a piezoelectric plate, and a step of pouring and hardening an acoustic packing material between the support plate and the piezoelectric plate. A method for manufacturing an ultrasonic probe, comprising the steps of: cutting the piezoelectric plate vertically and horizontally along the lattice points of the support plate to make it electrically independent.