JP2948610B2 - Ultrasonic probe manufacturing method - Google Patents
Ultrasonic probe manufacturing methodInfo
- Publication number
- JP2948610B2 JP2948610B2 JP2040801A JP4080190A JP2948610B2 JP 2948610 B2 JP2948610 B2 JP 2948610B2 JP 2040801 A JP2040801 A JP 2040801A JP 4080190 A JP4080190 A JP 4080190A JP 2948610 B2 JP2948610 B2 JP 2948610B2
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric
- circuit board
- printed circuit
- piezoelectric plate
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は超音波探触子（以下、配列型探触子とする）
を利用分野とし、特に複数の微小圧電片を二次元上に配
置した超音波探触子に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial application field) The present invention relates to an ultrasonic probe (hereinafter referred to as an array type probe).
In particular, the present invention relates to an ultrasonic probe in which a plurality of small piezoelectric pieces are two-dimensionally arranged.
（発明の背景） 超音波探触子は例えば医用関係の超音波診断装置に超
音波の送受波部として有用される。近年では、複数の微
小圧電片を二次元上に並べて電子走査するものがある。
例えば、ｘ、ｙ方向に、あるいは同心円上に走査して高
分解能としたものがある。(Background of the Invention) An ultrasonic probe is used, for example, as a transmitting / receiving part of an ultrasonic wave in a medical ultrasonic diagnostic apparatus. In recent years, there is a type in which a plurality of micro piezoelectric pieces are arranged two-dimensionally and electronically scanned.
For example, there is a method in which scanning is performed in the x and y directions or on concentric circles to achieve high resolution.
（従来技術） 第３図はこのような一従来例を説明する超音波探触子
の図である。(Prior Art) FIG. 3 is a diagram of an ultrasonic probe for explaining such a conventional example.
超音波探触子は、例えばジルコン酸チタン酸鉛からな
る複数の微小圧電片１を超音波の送受波源とする。但
し、両主面には図示しない電極が形成されている。通常
では、先ず、図示しない圧電板を作業板２上に固着し、
二次元上のｘ、ｙ方向に切断して複数の微小圧電片１に
分割する。そして、各溝間に充填材３を埋設して一体化
した（第３図）後、作業板２よりこれを取り外す。次
に、各微小圧電片１の一方の主面側から半田等により信
号導出入用のリード線４を引き出す（第４図）。また、
他方の主面側を共通接続して超音波の送受波面とする。
このようなものでは、一方の主面側から導出したリード
線４に駆動パルスを印加し、微小圧電片１をｘ、ｙ方向
に順次電子操作する。また、微小圧電片１を同心円上と
するようにリード線４を共通接続して電子走査する。The ultrasonic probe uses a plurality of micro piezoelectric pieces 1 made of, for example, lead zirconate titanate as ultrasonic wave transmission / reception sources. However, electrodes (not shown) are formed on both main surfaces. Normally, first, a piezoelectric plate (not shown) is fixed on the work plate 2,
It is cut into two or more micro piezoelectric pieces 1 by cutting in the x and y directions. After the filler 3 is embedded between the grooves and integrated (FIG. 3), the filler 3 is removed from the work plate 2. Next, a lead wire 4 for signal lead-in / out is drawn out from one main surface side of each micro piezoelectric piece 1 by soldering or the like (FIG. 4). Also,
The other main surface side is connected in common to form an ultrasonic wave transmitting / receiving surface.
In such a device, a driving pulse is applied to a lead wire 4 led out from one main surface side, and the micro piezoelectric piece 1 is electronically operated sequentially in the x and y directions. In addition, electronic scanning is performed by commonly connecting the lead wires 4 so that the micro piezoelectric pieces 1 are concentric.
（従来技術の問題点） しかしながら、上記構成の超音波探触子では、各微小
圧電片１の一方の主面にリード線４を個々に接続しなけ
ればならず、加えて各微小圧電片１自体及びその間の間
隔は非常に小さいので作業性が悪い。例えば半田付けす
るそばから近傍のリード線４を断線させたり、隣接する
微小圧電片１との間で絶縁不良を起こしたりする。ま
た、半田量によっては各微小圧電片１の特性を異ならせ
て信頼性を損ねる。更には、一方の主面側からリード線
４が導出するため、その部分に外力に対する図示しない
補強材をいれにくく耐衝撃性を低下させる等の問題点が
あった。(Problems of the prior art) However, in the ultrasonic probe having the above-described configuration, the lead wires 4 must be individually connected to one main surface of each of the small piezoelectric pieces 1. The workability is poor because the gap itself and the interval between them are very small. For example, the lead wire 4 in the vicinity is broken near the side where the soldering is performed, or insulation failure occurs with the adjacent minute piezoelectric piece 1. In addition, depending on the amount of solder, the characteristics of each micro piezoelectric piece 1 are made different, thereby impairing reliability. Furthermore, since the lead wire 4 is led out from the one main surface side, there is a problem that it is difficult to insert a reinforcing material (not shown) against external force in that portion, and the impact resistance is reduced.
（発明の目的） 本発明は、作業性を良好として信頼性に優れた超音波
探触子を提供することを目的とする。(Object of the Invention) It is an object of the present invention to provide an ultrasonic probe having good workability and excellent reliability.
（解決手段） 本発明は、複数の微小圧電片の一方の主面をプリント
基板の一面側上に固着するとともに、各微小圧電片の一
方の主面の電極を前記プリント基板に形成された電極孔
を通して該プリント基板の一面側から他面側に導出する
ことを基本とし、駆動方式に応じて前記プリント基板の
他面側に各微小圧電片の電極を任意に接続する導電路を
形成したことを解決手段とする。以下、本発明の一実施
例を説明する。(Solution) According to the present invention, one main surface of a plurality of micro piezoelectric pieces is fixed on one surface side of a printed circuit board, and an electrode on one main surface of each micro piezoelectric piece is formed on an electrode formed on the printed circuit board. Conducting a conductive path for arbitrarily connecting the electrodes of each micro piezoelectric piece on the other surface side of the printed circuit board according to the driving method based on drawing out from one surface side of the printed circuit board to the other surface side through the hole. Is the solution. Hereinafter, an embodiment of the present invention will be described.
（実施例） 第１図は本発明の一実施例を説明する超音波探触子の
図で、同図（ａ）は断面図、同図（ｂ）はプリント基板
の一部平面（一面側の）図、同図（ｃ）は同裏面（他面
側の）図である。なお、前従来例図と同一部分には同番
号を付与してその説明は簡略する。(Embodiment) FIG. 1 is a diagram of an ultrasonic probe for explaining an embodiment of the present invention, wherein FIG. 1 (a) is a cross-sectional view, and FIG. 1 (b) is a partial plane (one side) of a printed circuit board. FIG. 2C and FIG. 2C are diagrams of the back surface (on the other surface side). The same parts as those in the prior art are denoted by the same reference numerals, and description thereof will be simplified.
超音波探触子は前述したように両主面に図示しない電
極の形成された複数の微小圧電片１を二次元上のｘ、ｙ
方向に配置してなる。この実施例では、各微小圧電片１
をプリント基板５の一面側上に固着する。プリント基板
５は、一面に各微小圧電片１に対応した電極ランド６
を、三次元上のｘ、ｙ方向に形成している。各電極ラン
ド６はその中央に板面を貫通した電極孔（所謂スルーホ
ール）７が形成されている。すなわち、微小圧電片１の
一方の電極を電極孔７によりプリント基板５の一面側か
ら他面側に導出する。また、他面側の電極抗７からは導
電路８がそれぞれ延出して外周部の外部端子孔９に接続
する。As described above, the ultrasonic probe applies a plurality of micro piezoelectric pieces 1 having electrodes (not shown) formed on both main surfaces thereof in two dimensions x and y.
It is arranged in the direction. In this embodiment, each micro piezoelectric piece 1
Is fixed on one side of the printed circuit board 5. The printed circuit board 5 has electrode lands 6 on one surface corresponding to the respective micro piezoelectric pieces 1.
Are formed in the three-dimensional x and y directions. Each electrode land 6 has an electrode hole (a so-called through hole) 7 formed in the center thereof, penetrating the plate surface. That is, one electrode of the micro piezoelectric piece 1 is led out from one surface side of the printed circuit board 5 to the other surface side by the electrode hole 7. In addition, conductive paths 8 extend from the electrodes 7 on the other surface, and connect to the external terminal holes 9 on the outer peripheral portion.
具体的には、プリント基板５の一面側に全面的（外部
端子孔部分を除く）に図示しない金属箔を、他面側に各
導電路８を形成する。そして、スルーホール加工によ
り、電極孔７（及び外部端子孔９）を形成する。次に、
図示しない圧電板の一方の主面をプリント基板５の一面
（金属箔）上に導電性接着剤10aにより固着する。そし
て、圧電板を基板に達する切れ目を縦横に設けて金属箔
とともに切断し、複数の微小圧電片１と電極ランド６と
を同時に形成する。Specifically, a metal foil (not shown) is formed on the entire surface (except for the external terminal hole portion) on one surface side of the printed circuit board 5, and each conductive path 8 is formed on the other surface side. Then, the electrode holes 7 (and the external terminal holes 9) are formed by through-hole processing. next,
One main surface of a piezoelectric plate (not shown) is fixed on one surface (metal foil) of the printed circuit board 5 with a conductive adhesive 10a. Then, the piezoelectric plate is provided with cuts reaching the substrate vertically and horizontally and cut along with the metal foil to form a plurality of micro piezoelectric pieces 1 and electrode lands 6 at the same time.
各微小圧電片１間の溝にはエポキシ樹脂等の充填材３
を埋設する。そして、表面（他方の主面側）に例えば導
電性接着剤10bを施す。すなわち、各微小圧電片１の他
方の主面の電極を共通接続して超音波の送受波面とす
る。また、外部端子孔９には図示しない例えばコネクタ
又はフラットケーブルを接続した構成とする。そして、
外部端子孔９からの信号により、各微小圧電片１を前述
したように例えばｘ、ｙ方向に順次走査する。Fillers 3 such as epoxy resin are provided in the grooves between the micro piezoelectric pieces 1.
Buried. Then, for example, a conductive adhesive 10b is applied to the surface (the other main surface side). That is, the electrodes on the other main surface of each of the micro piezoelectric pieces 1 are commonly connected to each other to form an ultrasonic wave transmitting / receiving surface. The external terminal hole 9 is connected to a connector or a flat cable (not shown). And
According to the signal from the external terminal hole 9, each micro piezoelectric piece 1 is sequentially scanned, for example, in the x and y directions as described above.
このようなものでは、各微小圧電片１に個々に直接リ
ード線を接続することなく、外部端子孔９にコネクタ等
を接続すればよいので、作業性を向上できる。また、各
微小圧電片１はプリント基板５上に導電性接着剤10aの
厚みを結果的に均一にして固着されるので、各微小圧電
片１間における特性間にムラを生じない。そして、プリ
ント基板５が補強材として作用するので耐衝撃性を向上
する。更に、リード線を除去して構成したので、全体的
にコンパクトとし空間的利用度が高いものになる。In such a device, a connector or the like may be connected to the external terminal hole 9 without directly connecting a lead wire to each micro piezoelectric piece 1 individually, so that workability can be improved. In addition, since the micro piezoelectric pieces 1 are fixed on the printed circuit board 5 with the conductive adhesive 10a having a uniform thickness as a result, there is no unevenness in the characteristics between the micro piezoelectric pieces 1. And since the printed circuit board 5 acts as a reinforcing material, impact resistance is improved. Further, since the lead wire is removed, the overall structure is compact and the space utilization is high.
（他の実施例） 第２図は本発明の他の実施例を説明する超音波探触子
の図特にプリント基板の他面側の一部図である。なお、
前実施例図と同一部分には同番号を付与してその説明は
省略する。(Other Embodiment) FIG. 2 is a diagram of an ultrasonic probe for explaining another embodiment of the present invention, particularly a partial view of the other surface side of a printed circuit board. In addition,
The same parts as those in the previous embodiment are denoted by the same reference numerals, and description thereof will be omitted.
この実施例では、プリント基板５の他面側に、微小圧
電片１の一方の電極を略同心円状の環状に共通接続する
共通導電路11を形成し、外部端子孔９（abc）に延出す
る。なお、この例では最外周部分を基準電位路（所謂ダ
ミー端子11とする）とする。そして、外部端子孔９（ab
c）からの信号により同心円状の微小圧電片１を順次駆
動する。In this embodiment, a common conductive path 11 is formed on the other surface of the printed circuit board 5 to commonly connect one electrode of the micro piezoelectric piece 1 in a substantially concentric annular shape, and extends to the external terminal hole 9 (abc). I do. In this example, the outermost peripheral portion is a reference potential path (so-called dummy terminal 11). Then, the external terminal holes 9 (ab
The concentric micro piezoelectric pieces 1 are sequentially driven by the signal from c).
したがって、このようなものでは、前実施例同様に、
作業性の向上、各微小圧電片１間の特性の均一性、耐衝
撃性及びコンパクト化等の効果を奏する。そして、従来
例のようにリード線を相互に接続する必要もなく、外部
に導出するリード線自体の本数を少なくできるので、そ
の作業性を一段と高める効果を奏する。Therefore, in such a case, as in the previous embodiment,
Effects such as improvement in workability, uniformity of characteristics between the micro piezoelectric pieces 1, impact resistance, and downsizing are achieved. Further, unlike the conventional example, it is not necessary to connect the lead wires to each other, and the number of lead wires led out to the outside can be reduced, so that the workability is further enhanced.
（他の事項） なお、上記他の実施例では、共通導電路11を環状とし
たが、これに限らず駆動方式に従い任意に形成できるも
のである。例えば、ｘ、ｙ方向に共通接続してもよい。
また、その際、共通導電路が交差する場合はプリント基
板を多層構造として共通導電路の短絡を防止すればよ
い。(Other Matters) In the other embodiments described above, the common conductive path 11 is annular, but the present invention is not limited to this, and the common conductive path 11 can be arbitrarily formed according to a driving method. For example, a common connection may be made in the x and y directions.
Further, at this time, if the common conductive paths cross each other, the printed circuit board may have a multilayer structure to prevent short-circuiting of the common conductive paths.
また、上記実施例では、各微小圧電片１はｘ、ｙ方向
の二次元状に配置したが、必ずしもｘ、ｙ方向に整列す
る必要はなく必要に応じて配置できるものである。ま
た、微小圧電片１の両主面には電極が予め形成されてい
るとしたが、微小圧電片１の両主面には導電性接着剤が
塗布されるので、これを電極としてもよい。また、プリ
ント基板５には金属箔を設けてこれを圧電板と一緒に切
断して電極ランド６を形成したが、前述同様に導電性接
着剤接着剤を塗布するので金属箔の代わりにこれを用い
てもよい。また、電極孔７はスルーホール加工とした
が、これも同様に導電性接着剤の流入を理余うしてもよ
い。Further, in the above-described embodiment, the respective micro piezoelectric pieces 1 are arranged two-dimensionally in the x and y directions. However, they need not necessarily be arranged in the x and y directions and can be arranged as necessary. Although electrodes are formed on both main surfaces of the micro piezoelectric piece 1 in advance, a conductive adhesive is applied to both main surfaces of the micro piezoelectric piece 1, so that the electrodes may be used as the electrodes. Also, a metal foil was provided on the printed circuit board 5 and was cut together with the piezoelectric plate to form the electrode lands 6. However, since a conductive adhesive was applied in the same manner as described above, this was used instead of the metal foil. May be used. Although the electrode holes 7 are formed through holes, the flow of the conductive adhesive may be similarly reduced.
（発明の効果） 本発明は、複数の微小圧電片の一方の主面をプリント
基板の一面側上に固着するとともに、各微小圧電片の一
方の主面の電極を前記プリント基板に形成された孔を通
して該プリント基板の一面側から他面側に導出したの
で、作業性を良好として信頼性に優れた超音波探触子を
提供でき、その実際上の効果は顕著である。(Effects of the Invention) In the present invention, one main surface of a plurality of micro piezoelectric pieces is fixed on one surface side of a printed circuit board, and an electrode on one main surface of each micro piezoelectric piece is formed on the printed circuit board. Since the printed circuit board is led from one side to the other side through the holes, an ultrasonic probe with good workability and excellent reliability can be provided, and its practical effect is remarkable.
第１図は本発明の一実施例を示す図で、同図（ａ）は超
音波探触子の断面図、同図（ｂ）はプリント基板の一面
側の平面図、同図（ｃ）は同他面側の平面図である。 第２図は本発明の他の実施例を説明する特にプリント基
板の他面側の平面図である。 第３図及び第４図は従来例を説明する超音波探触子の図
である。1A and 1B are views showing an embodiment of the present invention, wherein FIG. 1A is a cross-sectional view of an ultrasonic probe, FIG. 1B is a plan view of one side of a printed circuit board, and FIG. Is a plan view of the other side. FIG. 2 is a plan view showing another embodiment of the present invention, particularly on the other side of the printed circuit board. 3 and 4 are views of an ultrasonic probe for explaining a conventional example.
Claims (4)
孔に接続する導電路を他面側に有したプリント基板と、
両主面に電極を有する圧電板とを具備し、前記プリント
基板の一面側に前記圧電板を固着して前記圧電板上から
前記プリント基板に達する切れ目を縦横に設けて切断
し、前記圧電板を複数の微少圧電片に分割するとととも
もに該微少圧電片の電極を前記電極孔により前記プリン
ト基板の他面側に導出したことを特徴とする超音波探触
子の製造方法。1. A printed circuit board having a conductive path on the other side connected to an electrode hole formed two-dimensionally and penetrating a plate surface,
A piezoelectric plate having electrodes on both main surfaces, the piezoelectric plate is fixed to one surface side of the printed board, cuts are provided vertically and horizontally from the piezoelectric plate to the printed board, and the piezoelectric plate is cut. Is divided into a plurality of minute piezoelectric pieces, and the electrodes of the minute piezoelectric pieces are led out to the other side of the printed board through the electrode holes.
孔に接続する導電路を他面側に有して前記電極孔に接続
する金属箔を一面側に有するプリント基板と、両主面に
電極を有する圧電板とを具備し、前記プリント基板の一
面側に前記圧電板を固着して前記圧電板上から前記プリ
ント基板に達する切れ目を縦横に設けて切断し、前記圧
電板を複数の微少圧電片に分割するとともに前記金属箔
を複数の電極ランドに分割し、前記微少圧電片の電極を
前記電極孔により前記プリント基板の他面側に導出した
ことを特徴とする超音波探触子の製造方法。2. A printed circuit board having a conductive path formed on the other side connected to an electrode hole formed two-dimensionally and penetrating the plate surface and having a metal foil on one side connected to the electrode hole. A piezoelectric plate having electrodes on the main surface, the piezoelectric plate is fixed to one surface side of the printed board, and cuts are provided vertically and horizontally from the piezoelectric plate to the printed board to cut the piezoelectric plate. An ultrasonic probe which divides the metal foil into a plurality of electrode lands, divides the metal foil into a plurality of electrode lands, and leads the electrodes of the minute piezoelectric pieces to the other surface of the printed circuit board through the electrode holes. Method of manufacturing a contact.
記プリント基板に導電性接着剤により固着されたことを
特徴とする超音波探触子の製造方法。3. The method according to claim 1, wherein the piezoelectric plate is fixed to the printed circuit board with a conductive adhesive.
孔に接続する導電路を他面側に有したプリント基板と、
両主面に電極を有する圧電板とを具備し、前記プリント
基板の一面側に前記圧電板を固着して前記圧電板上から
前記プリント基板に達する切れ目を縦横に設けて切断
し、前記圧電板を複数の微少圧電片に分割するとととも
もに該微少圧電片の電極を前記電極孔により前記プリン
ト基板の他面側に導出し、前記微少圧電片間の溝には充
填材を埋設して一面側の電極を導電性接着剤により共通
接続したことを特徴とする超音波探触子の製造方法。4. A printed circuit board having a conductive path on the other side connected to an electrode hole formed two-dimensionally and penetrating the plate surface,
A piezoelectric plate having electrodes on both main surfaces, the piezoelectric plate is fixed to one surface side of the printed board, cuts are provided vertically and horizontally from the piezoelectric plate to the printed board, and the piezoelectric plate is cut. Is divided into a plurality of small piezoelectric pieces, and the electrodes of the small piezoelectric pieces are led out to the other surface side of the printed circuit board by the electrode holes, and a filler is embedded in a groove between the small piezoelectric pieces. A method for manufacturing an ultrasonic probe, wherein electrodes on one side are commonly connected by a conductive adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2040801A JP2948610B2 (en) | 1990-02-21 | 1990-02-21 | Ultrasonic probe manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2040801A JP2948610B2 (en) | 1990-02-21 | 1990-02-21 | Ultrasonic probe manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03243099A JPH03243099A (en) | 1991-10-30 |
| JP2948610B2 true JP2948610B2 (en) | 1999-09-13 |
Family
ID=12590737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2040801A Expired - Fee Related JP2948610B2 (en) | 1990-02-21 | 1990-02-21 | Ultrasonic probe manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2948610B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5572785A (en) * | 1994-07-27 | 1996-11-12 | Eastman Kodak Company | Apparatus and method for automated assembly of precision components |
| US8288918B2 (en) * | 2008-12-24 | 2012-10-16 | Ngk Insulators, Ltd. | Composite substrate and manufacturing method thereof |
-
1990
- 1990-02-21 JP JP2040801A patent/JP2948610B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03243099A (en) | 1991-10-30 |
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