JPS63145365U - - Google Patents
Info
- Publication number
- JPS63145365U JPS63145365U JP3820287U JP3820287U JPS63145365U JP S63145365 U JPS63145365 U JP S63145365U JP 3820287 U JP3820287 U JP 3820287U JP 3820287 U JP3820287 U JP 3820287U JP S63145365 U JPS63145365 U JP S63145365U
- Authority
- JP
- Japan
- Prior art keywords
- conductor pattern
- holes
- circuit board
- printed circuit
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図はチユーナなどに装備される本考案のプ
リント基板の実施例を示す一部平面図、第２図は
第１図のプリント基板に形成されているランド部
の拡大平面図、第３図は第２図のランド部に電子
部品の端子を半田付けした状態を示す正面図、第
４図は他の実施例に係るプリント基板の一部平面
図、第５図は従来のプリント基板の一部平面図、
第６図は第５図のプリント基板に形成されている
ランド部の拡大図、第７図は第６図のランド部に
電子部品の端子を半田付けした状態を示す正面図
である。
１１……プリント基板、１２ａ，１２ｂ，１２
ｄ……ランド部、１２ｃ……ランド部の切欠き部
、１３ａ，１３ｂ，１３ｄ……ランド部に穿設さ
れている穴、１４……導体パターン、１５……電
子部品の端子、１６……半田。
Fig. 1 is a partial plan view showing an embodiment of the printed circuit board of the present invention that is installed in a tuner, etc., Fig. 2 is an enlarged plan view of a land portion formed on the printed circuit board of Fig. 1, and Fig. 3 2 is a front view showing a state in which terminals of electronic components are soldered to the land portions, FIG. 4 is a partial plan view of a printed circuit board according to another embodiment, and FIG. 5 is a diagram of a conventional printed circuit board. Part plan view,
FIG. 6 is an enlarged view of the land portion formed on the printed circuit board of FIG. 5, and FIG. 7 is a front view showing a state in which terminals of electronic components are soldered to the land portion of FIG. 6. 11...Printed circuit board, 12a, 12b, 12
d... Land portion, 12c... Notch portion of land portion, 13a, 13b, 13d... Hole drilled in land portion, 14... Conductor pattern, 15... Terminal of electronic component, 16... solder.
Claims (1)
挿通する複数の穴が穿設され且つ、各穴の周囲に
位置している半田付け用のランド部と、ランド部
の間を通過する導体パターンとが形成されている
プリント基板において、導体パターンの通過部に
隣接している穴が他の穴よりも小さい径に形成さ
れていることを特徴とするプリント基板。 A conductor pattern in which a plurality of holes are drilled through which a plurality of terminals provided on one electronic component are inserted, and a land portion for soldering is located around each hole, and a conductor pattern passes between the land portions. What is claimed is: 1. A printed circuit board in which a hole adjacent to a passage portion of a conductor pattern is formed to have a smaller diameter than other holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3820287U JPS63145365U (en) | 1987-03-16 | 1987-03-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3820287U JPS63145365U (en) | 1987-03-16 | 1987-03-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63145365U true JPS63145365U (en) | 1988-09-26 |
Family
ID=30850228
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3820287U Pending JPS63145365U (en) | 1987-03-16 | 1987-03-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63145365U (en) |
-
1987
- 1987-03-16 JP JP3820287U patent/JPS63145365U/ja active Pending
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