JPS6314468Y2 - - Google Patents
Info
- Publication number
- JPS6314468Y2 JPS6314468Y2 JP1979076336U JP7633679U JPS6314468Y2 JP S6314468 Y2 JPS6314468 Y2 JP S6314468Y2 JP 1979076336 U JP1979076336 U JP 1979076336U JP 7633679 U JP7633679 U JP 7633679U JP S6314468 Y2 JPS6314468 Y2 JP S6314468Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- heat
- semiconductor
- heat sink
- flat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 39
- 210000000078 claw Anatomy 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 238000005219 brazing Methods 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910000906 Bronze Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
- H01L2224/331—Disposition
- H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/33181—On opposite sides of the body
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979076336U JPS6314468Y2 (enEXAMPLES) | 1979-06-05 | 1979-06-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979076336U JPS6314468Y2 (enEXAMPLES) | 1979-06-05 | 1979-06-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55176566U JPS55176566U (enEXAMPLES) | 1980-12-18 |
| JPS6314468Y2 true JPS6314468Y2 (enEXAMPLES) | 1988-04-22 |
Family
ID=29309837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1979076336U Expired JPS6314468Y2 (enEXAMPLES) | 1979-06-05 | 1979-06-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6314468Y2 (enEXAMPLES) |
-
1979
- 1979-06-05 JP JP1979076336U patent/JPS6314468Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55176566U (enEXAMPLES) | 1980-12-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5949137A (en) | Stiffener ring and heat spreader for use with flip chip packaging assemblies | |
| US5635427A (en) | Method for assembling a pressure contact semiconductor device in a flat package | |
| US6803667B2 (en) | Semiconductor device having a protective film | |
| JP5637156B2 (ja) | 半導体モジュール | |
| US3457472A (en) | Semiconductor devices adapted for pressure mounting | |
| US6160309A (en) | Press-fit semiconductor package | |
| JPH05304226A (ja) | 半導体装置の製造方法および製造装置 | |
| US3030558A (en) | Semiconductor diode assembly and housing therefor | |
| JPS6314468Y2 (enEXAMPLES) | ||
| JP4137840B2 (ja) | 電力用半導体装置 | |
| US3277957A (en) | Heat transfer apparatus for electronic component | |
| US7569927B2 (en) | RF power transistor package | |
| US3280383A (en) | Electronic semiconductor device | |
| JPH0625005Y2 (ja) | 圧接型半導体装置 | |
| JPS6012287Y2 (ja) | 半導体装置 | |
| JPS5925384B2 (ja) | 電子装置 | |
| JPS6218048Y2 (enEXAMPLES) | ||
| JP3292898B2 (ja) | 圧接型半導体装置 | |
| JPS626692Y2 (enEXAMPLES) | ||
| JPS6116687Y2 (enEXAMPLES) | ||
| JPS5952539B2 (ja) | 半導体装置のトランスフアモ−ルド装置 | |
| JPS5844750A (ja) | 半導体装置 | |
| JPS6028139B2 (ja) | 半導体装置 | |
| JPS5943737Y2 (ja) | 半導体装置 | |
| JP3198176B2 (ja) | 半導体装置 |