JPS63140541A - 厚膜多層混成集積回路 - Google Patents

厚膜多層混成集積回路

Info

Publication number
JPS63140541A
JPS63140541A JP28712786A JP28712786A JPS63140541A JP S63140541 A JPS63140541 A JP S63140541A JP 28712786 A JP28712786 A JP 28712786A JP 28712786 A JP28712786 A JP 28712786A JP S63140541 A JPS63140541 A JP S63140541A
Authority
JP
Japan
Prior art keywords
conductor
layer
insulating plate
thick film
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP28712786A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0571177B2 (enrdf_load_stackoverflow
Inventor
Megumi Sakamaki
坂巻　恵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP28712786A priority Critical patent/JPS63140541A/ja
Publication of JPS63140541A publication Critical patent/JPS63140541A/ja
Publication of JPH0571177B2 publication Critical patent/JPH0571177B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Landscapes

  • Wire Bonding (AREA)
JP28712786A 1986-12-02 1986-12-02 厚膜多層混成集積回路 Granted JPS63140541A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28712786A JPS63140541A (ja) 1986-12-02 1986-12-02 厚膜多層混成集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28712786A JPS63140541A (ja) 1986-12-02 1986-12-02 厚膜多層混成集積回路

Publications (2)

Publication Number Publication Date
JPS63140541A true JPS63140541A (ja) 1988-06-13
JPH0571177B2 JPH0571177B2 (enrdf_load_stackoverflow) 1993-10-06

Family

ID=17713420

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28712786A Granted JPS63140541A (ja) 1986-12-02 1986-12-02 厚膜多層混成集積回路

Country Status (1)

Country Link
JP (1) JPS63140541A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH0571177B2 (enrdf_load_stackoverflow) 1993-10-06

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