JPS63137449A - 半導体ウエハマウンタ装置の製造方法 - Google Patents

半導体ウエハマウンタ装置の製造方法

Info

Publication number
JPS63137449A
JPS63137449A JP61284695A JP28469586A JPS63137449A JP S63137449 A JPS63137449 A JP S63137449A JP 61284695 A JP61284695 A JP 61284695A JP 28469586 A JP28469586 A JP 28469586A JP S63137449 A JPS63137449 A JP S63137449A
Authority
JP
Japan
Prior art keywords
tape
ultraviolet
semiconductor wafer
frame
wafer mounter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61284695A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0257344B2 (enExample
Inventor
Yutaka Yamada
豊 山田
Hisahiro Okamoto
九弘 岡本
Nobuo Iijima
宣夫 飯島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP61284695A priority Critical patent/JPS63137449A/ja
Publication of JPS63137449A publication Critical patent/JPS63137449A/ja
Publication of JPH0257344B2 publication Critical patent/JPH0257344B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP61284695A 1986-11-28 1986-11-28 半導体ウエハマウンタ装置の製造方法 Granted JPS63137449A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61284695A JPS63137449A (ja) 1986-11-28 1986-11-28 半導体ウエハマウンタ装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61284695A JPS63137449A (ja) 1986-11-28 1986-11-28 半導体ウエハマウンタ装置の製造方法

Publications (2)

Publication Number Publication Date
JPS63137449A true JPS63137449A (ja) 1988-06-09
JPH0257344B2 JPH0257344B2 (enExample) 1990-12-04

Family

ID=17681777

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61284695A Granted JPS63137449A (ja) 1986-11-28 1986-11-28 半導体ウエハマウンタ装置の製造方法

Country Status (1)

Country Link
JP (1) JPS63137449A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020026079A (ko) * 2000-09-30 2002-04-06 추후제출 박막부착장치
KR100365474B1 (ko) * 2001-01-13 2002-12-26 주식회사 다이나테크 접착 필름 절단 장치
WO2010026909A1 (ja) * 2008-09-04 2010-03-11 リンテック株式会社 マウント装置及びマウント方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020026079A (ko) * 2000-09-30 2002-04-06 추후제출 박막부착장치
KR100365474B1 (ko) * 2001-01-13 2002-12-26 주식회사 다이나테크 접착 필름 절단 장치
WO2010026909A1 (ja) * 2008-09-04 2010-03-11 リンテック株式会社 マウント装置及びマウント方法
JP2010062356A (ja) * 2008-09-04 2010-03-18 Lintec Corp マウント装置及びマウント方法
US8142595B2 (en) 2008-09-04 2012-03-27 Lintec Corporation Mounting apparatus and mounting method

Also Published As

Publication number Publication date
JPH0257344B2 (enExample) 1990-12-04

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Legal Events

Date Code Title Description
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