JPS63123563A - 表面実装用の多端子チツプ部品をプリント配線基板に半田付けする方法および半田鏝 - Google Patents
表面実装用の多端子チツプ部品をプリント配線基板に半田付けする方法および半田鏝Info
- Publication number
- JPS63123563A JPS63123563A JP26827386A JP26827386A JPS63123563A JP S63123563 A JPS63123563 A JP S63123563A JP 26827386 A JP26827386 A JP 26827386A JP 26827386 A JP26827386 A JP 26827386A JP S63123563 A JPS63123563 A JP S63123563A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- soldering
- soldering iron
- printed wiring
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 title claims abstract description 88
- 238000005476 soldering Methods 0.000 title claims abstract description 82
- 229910052742 iron Inorganic materials 0.000 title claims abstract description 44
- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000004806 packaging method and process Methods 0.000 title 1
- 238000010438 heat treatment Methods 0.000 claims abstract description 37
- 230000007246 mechanism Effects 0.000 claims abstract description 26
- 229910000679 solder Inorganic materials 0.000 claims description 27
- 208000031872 Body Remains Diseases 0.000 claims 1
- 244000126211 Hericium coralloides Species 0.000 abstract description 3
- 238000001179 sorption measurement Methods 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000006071 cream Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 235000000396 iron Nutrition 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000010977 jade Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000010152 pollination Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26827386A JPS63123563A (ja) | 1986-11-11 | 1986-11-11 | 表面実装用の多端子チツプ部品をプリント配線基板に半田付けする方法および半田鏝 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26827386A JPS63123563A (ja) | 1986-11-11 | 1986-11-11 | 表面実装用の多端子チツプ部品をプリント配線基板に半田付けする方法および半田鏝 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63123563A true JPS63123563A (ja) | 1988-05-27 |
| JPH0218947B2 JPH0218947B2 (enExample) | 1990-04-27 |
Family
ID=17456270
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26827386A Granted JPS63123563A (ja) | 1986-11-11 | 1986-11-11 | 表面実装用の多端子チツプ部品をプリント配線基板に半田付けする方法および半田鏝 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63123563A (enExample) |
-
1986
- 1986-11-11 JP JP26827386A patent/JPS63123563A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0218947B2 (enExample) | 1990-04-27 |
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