JPS6311678A - 無電解銅めつき法 - Google Patents
無電解銅めつき法Info
- Publication number
- JPS6311678A JPS6311678A JP15341186A JP15341186A JPS6311678A JP S6311678 A JPS6311678 A JP S6311678A JP 15341186 A JP15341186 A JP 15341186A JP 15341186 A JP15341186 A JP 15341186A JP S6311678 A JPS6311678 A JP S6311678A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- electroless copper
- copper plating
- plating solution
- resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims abstract description 89
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 34
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 34
- 239000010949 copper Substances 0.000 title claims abstract description 34
- 238000000034 method Methods 0.000 title claims description 15
- 239000004020 conductor Substances 0.000 claims abstract description 15
- 239000003638 chemical reducing agent Substances 0.000 claims abstract description 10
- 230000000694 effects Effects 0.000 claims abstract description 10
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910001431 copper ion Inorganic materials 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000008139 complexing agent Substances 0.000 claims abstract description 4
- 229940051841 polyoxyethylene ether Drugs 0.000 claims abstract description 3
- 229920000056 polyoxyethylene ether Polymers 0.000 claims abstract description 3
- 239000003002 pH adjusting agent Substances 0.000 claims abstract 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 6
- 125000003342 alkenyl group Chemical group 0.000 claims description 3
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- 125000004432 carbon atom Chemical group C* 0.000 claims description 3
- 238000007654 immersion Methods 0.000 claims description 3
- 239000003054 catalyst Substances 0.000 abstract description 6
- 230000008021 deposition Effects 0.000 abstract description 6
- 239000002245 particle Substances 0.000 abstract description 4
- ROFVEXUMMXZLPA-UHFFFAOYSA-N Bipyridyl Chemical group N1=CC=CC=C1C1=CC=CC=N1 ROFVEXUMMXZLPA-UHFFFAOYSA-N 0.000 abstract 1
- 239000012790 adhesive layer Substances 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 238000001556 precipitation Methods 0.000 description 6
- 238000007788 roughening Methods 0.000 description 5
- 239000010410 layer Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 239000002244 precipitate Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- -1 Polyoxyethylene Polymers 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15341186A JPS6311678A (ja) | 1986-06-30 | 1986-06-30 | 無電解銅めつき法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15341186A JPS6311678A (ja) | 1986-06-30 | 1986-06-30 | 無電解銅めつき法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6311678A true JPS6311678A (ja) | 1988-01-19 |
| JPH0434625B2 JPH0434625B2 (enrdf_load_stackoverflow) | 1992-06-08 |
Family
ID=15561902
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15341186A Granted JPS6311678A (ja) | 1986-06-30 | 1986-06-30 | 無電解銅めつき法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6311678A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6147059A (en) * | 1992-02-20 | 2000-11-14 | Hyal Pharmaceutical Corporation | Formulations containing hyaluronic acid |
| US6194392B1 (en) | 1989-09-21 | 2001-02-27 | Hyal Pharmaceutical Corporation | Treatment of conditions and disease |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5178744A (ja) * | 1974-12-30 | 1976-07-08 | Hitachi Ltd | Mudenkaidometsukieki |
| JPS58133365A (ja) * | 1982-02-01 | 1983-08-09 | Hitachi Chem Co Ltd | 無電解銅めつき液 |
-
1986
- 1986-06-30 JP JP15341186A patent/JPS6311678A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5178744A (ja) * | 1974-12-30 | 1976-07-08 | Hitachi Ltd | Mudenkaidometsukieki |
| JPS58133365A (ja) * | 1982-02-01 | 1983-08-09 | Hitachi Chem Co Ltd | 無電解銅めつき液 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6194392B1 (en) | 1989-09-21 | 2001-02-27 | Hyal Pharmaceutical Corporation | Treatment of conditions and disease |
| US6147059A (en) * | 1992-02-20 | 2000-11-14 | Hyal Pharmaceutical Corporation | Formulations containing hyaluronic acid |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0434625B2 (enrdf_load_stackoverflow) | 1992-06-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4725504A (en) | Metal coated laminate products made from textured polyimide film | |
| US6221440B1 (en) | Process for plating metal coating | |
| JP2643099B2 (ja) | 導電金属の基板への付着方法 | |
| US4832799A (en) | Process for coating at least one surface of a polyimide sheet with copper | |
| US4358479A (en) | Treatment of copper and use thereof | |
| EP0259754A2 (de) | Flexible Schaltungen | |
| EP0060805A1 (de) | Herstellverfahren für und nach diesem Verfahren hergestellte Leiterplatten | |
| JP3458050B2 (ja) | 印刷回路用銅箔 | |
| CN1248300A (zh) | 微多孔性铜覆膜及用于制备该铜覆膜的化学镀铜液 | |
| JPH10193505A (ja) | ２層フレキシブル基板の製造方法 | |
| EP0324189A2 (de) | Verfahren zur Herstellung von elektrischen Leiterplatten | |
| US4431685A (en) | Decreasing plated metal defects | |
| EP0163089B1 (en) | Process for activating a substrate for electroless deposition of a conductive metal | |
| EP0195332B1 (de) | Elektrische Leiterplatten | |
| JPS6311678A (ja) | 無電解銅めつき法 | |
| JP3276919B2 (ja) | 樹脂基材への高密着性めっき方法およびこれに用いる銅めっき液 | |
| JPH0472070A (ja) | 銅ポリイミド基板およびこれを用いたプリント配線板の製造方法 | |
| JP2915644B2 (ja) | プリント配線板の製造方法 | |
| JPH07235755A (ja) | プリント配線基板の製法 | |
| JP2648729B2 (ja) | 無電解銅めっき液および無電解銅めっき方法 | |
| JP2605423B2 (ja) | プリント配線板用接着剤 | |
| JPS61219196A (ja) | 電子回路用プリント基板 | |
| JP3474291B2 (ja) | ガラス又はセラミックス基板へのめっき層の形成方法 | |
| JPS6151990A (ja) | 表面を金属化した絶縁基板の製造方法 | |
| JPS5856386A (ja) | 印刷配線板の製造法 |