JPS63116497A - Manufacture of thick film wiring board - Google Patents
Manufacture of thick film wiring boardInfo
- Publication number
- JPS63116497A JPS63116497A JP26297986A JP26297986A JPS63116497A JP S63116497 A JPS63116497 A JP S63116497A JP 26297986 A JP26297986 A JP 26297986A JP 26297986 A JP26297986 A JP 26297986A JP S63116497 A JPS63116497 A JP S63116497A
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- insulating substrate
- wiring board
- wiring pattern
- resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000000758 substrate Substances 0.000 claims description 22
- 239000004020 conductor Substances 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 14
- 238000005530 etching Methods 0.000 claims description 12
- 229920002120 photoresistant polymer Polymers 0.000 claims description 12
- 238000007650 screen-printing Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005562 fading Methods 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、絶縁基板上に厚膜抵抗体と、この厚膜抵抗体
に接続される配線パターンとが少なくとも設けられてな
る混成集積回路等を構成する厚膜配線板の製造方法に関
する。[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to a hybrid integrated circuit, etc., in which at least a thick film resistor and a wiring pattern connected to the thick film resistor are provided on an insulating substrate. The present invention relates to a method of manufacturing a thick film wiring board that constitutes a thick film wiring board.
〈従来の技術〉
絶縁基板上に配線パターンを形成するには、スクリーン
印刷によって最初から配線パターンを得る方法と、スク
リーン印刷等によって厚膜導体を形成し、この厚膜導体
をエツチングすることにより配線パターンを得る方法と
が、一般的に用いられている。<Prior art> In order to form a wiring pattern on an insulating substrate, there are two methods: obtaining the wiring pattern from the beginning by screen printing, and forming a thick film conductor by screen printing etc. and etching the thick film conductor to form the wiring pattern. A method of obtaining a pattern is commonly used.
〈発明が解決しようとする問題点〉
ところが、スクリーン印刷によって最初から配線パター
ンを得る方法においては、たとえば１００μ以下の微細
な配線パターンを得ようとすると、ニジミやカスレ等に
よって均一な幅のパターンが得がたいという問題がある
。<Problems to be Solved by the Invention> However, in the method of obtaining a wiring pattern from the beginning by screen printing, when attempting to obtain a fine wiring pattern of, for example, 100 μm or less, a pattern with a uniform width may not be obtained due to bleeding or fading. The problem is that it is difficult to obtain.
また、エツチングにより配線パターンを得ろ方法におい
ては、微細な配線パターンを得ることはできるが、厚膜
抵抗体を先に形成しておく必要がある場合は、厚膜抵抗
体もエツチングされて特性が劣化するという問題がある
。In addition, with the method of obtaining a wiring pattern by etching, it is possible to obtain a fine wiring pattern, but if it is necessary to form a thick film resistor first, the thick film resistor is also etched and its characteristics are deteriorated. There is a problem with deterioration.
本発明は、微細な配線パターンを形成するために、エツ
チングにより得る方法において、先に厚膜抵抗体を形成
しておいてらエツチングの影響を受けることのない厚膜
配線板の製造方法を提供することを目的とする。The present invention provides a method for manufacturing a thick film wiring board that is not affected by etching after forming a thick film resistor in advance in a method for forming fine wiring patterns by etching. The purpose is to
〈問題点を解決するための手段〉
本発明は、このような目的を達成するために、次の（ａ
）〜（ｅ）の各工程を含んでなることを特徴とするもの
である。<Means for solving the problems> In order to achieve such an object, the present invention solves the following (a)
) to (e).
（ａ）絶縁基板上に厚膜抵抗体を形成する工程。(a) Step of forming a thick film resistor on an insulating substrate.
（ｂ）厚膜抵抗体の配線パターンの接続されない部分を
表面に露出するようにして、絶縁基板上に厚膜導体を形
成する工程。(b) A step of forming a thick film conductor on the insulating substrate so that the unconnected portions of the wiring pattern of the thick film resistor are exposed on the surface.
（Ｃ）厚膜抵抗体の表面に露出している部分と、厚膜導
体の配線パターンを形成する位置とにフォトレジスト膜
を形成する工程。(C) A step of forming a photoresist film on the exposed surface of the thick film resistor and at the position where the wiring pattern of the thick film conductor is to be formed.
（ｄ）絶縁基板をエツチング液に浸漬することにより、
フォトレジスト膜の設けられた部分以外の厚膜導体を除
去する工程。(d) By immersing the insulating substrate in an etching solution,
A process of removing thick film conductors other than the areas where the photoresist film is provided.
（ｅ）絶縁基板を剥離液に浸漬することにより、フォト
レジスト膜を除去する工程。(e) A step of removing the photoresist film by immersing the insulating substrate in a stripping solution.
〈作用〉
本発明の厚膜配線板の製造方法によれば、配線パターン
を得るために厚膜導体に設けるフォトレジスト膜を厚膜
抵抗体の露出している部分にも同時に形成するために、
不要な厚膜導体を除去するにあたってエツチング液に浸
漬しても、フォトレジスト膜の存在に上り厚膜抵抗体に
悪影響を与えることがない。<Function> According to the method for manufacturing a thick film wiring board of the present invention, in order to simultaneously form a photoresist film on the thick film conductor to obtain a wiring pattern on the exposed portion of the thick film resistor,
Even if the thick film conductor is immersed in an etching solution to remove the unnecessary thick film conductor, the thick film resistor will not be adversely affected by the presence of the photoresist film.
〈実施例〉
以下に、本発明の一実施例を図面を参照して詳細に説明
する。<Example> An example of the present invention will be described in detail below with reference to the drawings.
まず、第１図に示すように、アルミナ等の絶縁基板１を
阜備し、この絶縁基板１上に厚膜抵抗体２を形成する。First, as shown in FIG. 1, an insulating substrate 1 made of alumina or the like is provided, and a thick film resistor 2 is formed on this insulating substrate 1.
この厚膜抵抗体２は、たとえば酸化ルテニウム系の抵抗
ペーストをスクリーン印９１等により塗布し、大気中あ
るいは酸素雰囲気中で焼成することにより得るものであ
る。なお、図面では厚膜抵抗体２は１個しか示されてい
ないが、通常は複数個が同時に形成される。This thick film resistor 2 is obtained by applying, for example, a ruthenium oxide-based resistance paste using a screen mark 91 or the like and firing it in the air or an oxygen atmosphere. Although only one thick film resistor 2 is shown in the drawing, a plurality of thick film resistors 2 are usually formed at the same time.
次に、このようにして厚膜抵抗体２の形成された絶縁基
板Ｉ上に、第２図に示すように、基板のほぼ全面にわた
って厚膜導体３を形成する。この厚膜導体３は、たとえ
ば銅ペースト等の中性雰囲気中で焼成する必要のある導
電ペーストをスクリーン印刷等の手段により塗布し、窒
素ガス等の中性雰囲気中で焼成したものである。この場
合、厚膜導体３は、厚膜抵抗体２の両端部を除く中央部
分が表面に露出するように、窓部４を設けて形成される
。次に、第３図に示すように、厚膜導体３の形成された
絶縁基板１上の、窓部４に位置している厚膜抵抗体２の
表面に露出している部分と、厚膜導体３の配線パターン
を形成する位置とにフォトレノスト膜５を形成する。つ
いで、フォトレジスト膜５の形成された絶縁基板１を、
エツチング液中に浸漬する。このエツチング液としては
、厚膜導体３が銅で形成されている場合、塩化第二鉄溶
液や塩化第二銅溶液が用いられる。絶縁基板１をエツチ
ング液から引き上げると、第４図に示すように、フォト
レジスト膜５の形成された部分以外の不要な厚膜導体が
除去されたものとなる。そして、第・１図に示す状態の
絶縁基板ｌを剥離液に浸漬することにより、フォトレジ
スト膜５が除去され、第５図に示すように、厚膜抵抗体
２の両端に配線パターン６の接続された厚膜配線板が得
られる。Next, as shown in FIG. 2, on the insulating substrate I on which the thick film resistor 2 has been formed in this way, a thick film conductor 3 is formed over almost the entire surface of the substrate. This thick film conductor 3 is obtained by applying a conductive paste such as copper paste, which needs to be fired in a neutral atmosphere, by means such as screen printing, and then firing it in a neutral atmosphere such as nitrogen gas. In this case, the thick film conductor 3 is formed with a window 4 so that the central portion of the thick film resistor 2 excluding both ends is exposed to the surface. Next, as shown in FIG. A photorenost film 5 is formed at the position where the wiring pattern of the conductor 3 is to be formed. Next, the insulating substrate 1 on which the photoresist film 5 was formed was
Immerse in etching solution. As this etching solution, when the thick film conductor 3 is made of copper, a ferric chloride solution or a cupric chloride solution is used. When the insulating substrate 1 is lifted out of the etching solution, as shown in FIG. 4, unnecessary thick film conductors other than the portion where the photoresist film 5 is formed are removed. Then, by immersing the insulating substrate l in the state shown in FIG. 1 in a stripping solution, the photoresist film 5 is removed, and as shown in FIG. A connected thick film wiring board is obtained.
なお、上記の実施例においては、厚膜導体３を絶縁基板
Ｉのほぼ全面に形成しているが、たとえば第６図に示す
ように、厚膜抵抗体２の配線パターンの接続されない部
分を表面に露出するようにして、所要の部分のみに形成
するようにしてもよい。In the above embodiment, the thick film conductor 3 is formed on almost the entire surface of the insulating substrate I, but as shown in FIG. It may also be formed only in the required portions so that they are exposed.
〈発明の効果〉
本発明の厚膜配線板の製造方法は、以上の工程を含んで
なるものであるため、不要な厚膜導体をエツチング液に
より除去して微細な配線パターンを得るようにしても、
先に形成した厚膜抵抗体がエツチング液により悪影響を
受けることがなく、信頼性の高い厚膜配線板を得ること
ができる。<Effects of the Invention> Since the method for manufacturing a thick film wiring board of the present invention includes the above steps, unnecessary thick film conductors are removed using an etching solution to obtain a fine wiring pattern. too,
The previously formed thick film resistor is not adversely affected by the etching solution, and a highly reliable thick film wiring board can be obtained.
第１図〜第５図は、本発明の厚膜配線板の製造方法を説
明するための各工程における絶縁基板の要部を示す図、
第６図は他の実施例の絶縁基板の要部を示す図である。
ｌ・・・絶縁基板、２・・・厚膜抵抗体、３・・・厚膜
導体、４・・・窓部、５・・・フォトレジスト膜、６・
・・配線パターン。1 to 5 are diagrams showing main parts of an insulating substrate in each step for explaining the method for manufacturing a thick film wiring board of the present invention,
FIG. 6 is a diagram showing essential parts of an insulating substrate of another embodiment. l... Insulating substrate, 2... Thick film resistor, 3... Thick film conductor, 4... Window portion, 5... Photoresist film, 6...
・Wiring pattern.
Claims (1)
れる配線パターンとが少なくとも設けられてなる厚膜配
線板の製造方法であって、 次の各工程を含んでなることを特徴とする厚膜配線板の
製造方法。 （ａ）絶縁基板上に厚膜抵抗体を形成する工程。 （ｂ）厚膜抵抗体の配線パターンの接続されない部分を
表面に露出するようにして、絶縁基板上に厚膜導体を形
成する工程。 （ｃ）厚膜抵抗体の表面に露出している部分と、厚膜導
体の配線パターンを形成する位置とにフォトレジスト膜
を形成する工程。 （ｄ）絶縁基板をエッチング液に浸漬することにより、
フォトレジスト膜の設けられた部分以外の厚膜導体を除
去する工程。 （ｅ）絶縁基板を剥離液に浸漬することにより、フォト
レジスト膜を除去する工程。[Scope of Claims] A method for manufacturing a thick film wiring board comprising at least a thick film resistor and a wiring pattern connected to the thick film resistor provided on an insulating substrate, the method comprising: A method for manufacturing a thick film wiring board, comprising: (a) Step of forming a thick film resistor on an insulating substrate. (b) A step of forming a thick film conductor on the insulating substrate so that the unconnected portions of the wiring pattern of the thick film resistor are exposed on the surface. (c) A step of forming a photoresist film on the exposed surface of the thick film resistor and at the position where the wiring pattern of the thick film conductor is to be formed. (d) By immersing the insulating substrate in an etching solution,
A process of removing thick film conductors other than the areas where the photoresist film is provided. (e) A step of removing the photoresist film by immersing the insulating substrate in a stripping solution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26297986A JPS63116497A (en) | 1986-11-05 | 1986-11-05 | Manufacture of thick film wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26297986A JPS63116497A (en) | 1986-11-05 | 1986-11-05 | Manufacture of thick film wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63116497A true JPS63116497A (en) | 1988-05-20 |
Family
ID=17383204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26297986A Pending JPS63116497A (en) | 1986-11-05 | 1986-11-05 | Manufacture of thick film wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63116497A (en) |
-
1986
- 1986-11-05 JP JP26297986A patent/JPS63116497A/en active Pending
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