JPH0983109A - Method for forming thick-film conductor wiring - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve such problems as short-circuiting, disconnection, and waving of the wires due to the dripping of thick-film conductor paste by forming a thick-film conductor wire using photosensitive resin. SOLUTION: A photosensitive resin layer 2 is formed on a ceramic substrate 1 by screen printing, UV is applied through a mask, and a groove part 3 is formed at a wiring part. A conductor paste 5 is subjected to screen printing at the obtained groove part 3. Then, remaining photosensitive resin is eliminated by baking, thus obtaining a fine and accurate thick-film conductor wire 7.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a thick film conductor wiring, and to form a finer and more accurate thick film conductor wiring using a photosensitive resin.

[0002]

2. Description of the Related Art Conventional thick film conductor wiring has been formed by screen printing a conductor paste. Especially,
When forming fine wiring with a narrow pitch, a high-viscosity paste was used and a special screen for high-viscosity was used.

[0003]

However, in the above-mentioned conventional method, even when a high-viscosity conductor paste is used,
When forming fine wiring, there is still a problem of short circuit due to sag. In addition, there is a problem that the high-viscosity conductor paste easily causes disconnection and the screen mesh causes the wiring to be corrugated.

[0004]

In order to solve the above-mentioned problems, a method of forming a thick film conductor wiring according to the present invention comprises forming a photosensitive resin layer on a ceramic substrate and then forming a portion where the conductor wiring is formed. The groove portion is removed to form a groove portion, the thick film conductor paste is embedded in the obtained groove portion, and then the remaining photosensitive resin layer is removed together with firing of the thick film conductor paste.

[0005]

According to the above method, since the thick film conductor paste is baked in the groove formed in the photosensitive resin in a state of being buried, the conductor paste is not sagged, the wire is broken, and the wiring is not corrugated.

[0006]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a process of forming a thick film conductor wiring in one embodiment of the present invention.

As shown in FIG. 1A, a photosensitive resin layer 2 is formed on a ceramic substrate 1 by screen printing,
After drying at 80 ° C. for 30 minutes in a box-type drying oven, UV is irradiated through a mask, and drying is performed at 80 ° C. for 10 minutes in a box-type drying oven. The photosensitive resin used is prepared by adding a photoinitiator to a photosensitive vehicle and kneading.

Then, as shown in FIG. 1B, the substrate is dipped in a developing solution, developed, washed with water, and dried at 80 ° C. for 10 minutes in a box-type drying oven to form a wiring pattern. The groove 3 is formed in the.

As shown in the sectional view of FIG. 1C, the obtained groove 3 is screen-printed by using a printing squeegee 4 and a printing screen 6, and a conductor paste 5 is printed. The thick film conductor paste used was prepared by adding glass frit and an organic vehicle to Cu powder and kneading.

The substrate 1 shown in FIG. 1D is dried in a box-type drying oven at 100 ° C. for 10 minutes. Then, in a nitrogen atmosphere, the photosensitive resin 2 is baked at 900 ° C. for 15 minutes in a belt baking furnace doped with oxygen concentration of 20 ppm.
At the same time, it is possible to obtain a fine and highly accurate thick film conductor wiring 7.

[0011]

As described above, according to the present invention, problems such as short circuit due to sagging of conductive paste, disconnection of wiring due to use of high-viscosity paste, and corrugation of wiring due to screen mesh are all solved. Therefore, a fine and highly accurate thick film conductor wiring can be obtained.

[Brief description of drawings]

FIG. 1 is a process diagram showing a method for forming thick film conductor wiring in an embodiment of the present invention.

[Explanation of symbols]

 1 Ceramic Substrate 2 Photosensitive Resin Layer 3 Groove 4 Squeegee for Printing 5 Conductor Paste 6 Printing Screen 7 Conductor Embedded in Groove

Claims (1)

[Claims] 1. A photosensitive resin layer is formed on a ceramic substrate, a portion where conductor wiring is formed is removed to form a groove portion, and a thick film conductor paste is embedded in the obtained groove portion.
A method for forming a thick film conductor wiring, wherein the remaining photosensitive resin layer is removed together with the baking of the thick film conductor paste.