JPS63112475A - Method of joining ceramic to metal - Google Patents

Method of joining ceramic to metal

Info

Publication number
JPS63112475A
JPS63112475A JP25772886A JP25772886A JPS63112475A JP S63112475 A JPS63112475 A JP S63112475A JP 25772886 A JP25772886 A JP 25772886A JP 25772886 A JP25772886 A JP 25772886A JP S63112475 A JPS63112475 A JP S63112475A
Authority
JP
Japan
Prior art keywords
ceramics
metal
heating
ceramic
mixed powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP25772886A
Other languages
Japanese (ja)
Inventor
錦田 俊一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Sumitomo Metal Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Industries Ltd filed Critical Sumitomo Metal Industries Ltd
Priority to JP25772886A priority Critical patent/JPS63112475A/en
Publication of JPS63112475A publication Critical patent/JPS63112475A/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 産業上の利用分野 この発明は耐熱・耐摩耗・耐食性等の性能を有するセラ
ミックスと金属の接合法に係り、より詳しくはセラミッ
クスの表面をメタライジング処理して金属とセラミック
スとを接合する方法に関する。
[Detailed Description of the Invention] Industrial Application Field This invention relates to a method for joining ceramics and metals that have properties such as heat resistance, wear resistance, and corrosion resistance. It relates to a method of joining.

従来技術とその問題点 セラミックスと金属の接合法は高温高圧下で行なう固相
接合法から溶射等によるコーティング法まで各種の方法
がおり、それぞれに特徴を有している。例えば、最も広
く用いられている方法として、セラミックス、金属より
融点の低いインサート材を用いるろう付は法がある。こ
の方法は、液体金属あるいはガラス等の酸化物をろうと
してセラミックスと金属の間にインサートして用いる方
法でおり、素材間の接触が液体(ろう)がぬれることに
より保持されるため、非常に良好な気密性を有する接合
を達成する。しかしながら、セラミックスは一般の金属
ろう付は用ろうに対して、本質的にぬれが悪い。そのた
めに、セラミックス表面をメタライジング処理をすると
か、T1等の活性金属をろうに添加してろうのぬれを容
易にする等の方法がとられている。
Prior art and its problems There are various methods for joining ceramics and metals, ranging from solid-phase bonding performed under high temperature and pressure to coating methods such as thermal spraying, and each method has its own characteristics. For example, one of the most widely used methods is brazing using an insert material that has a lower melting point than ceramics or metals. This method uses a liquid metal or an oxide such as glass as a wax which is inserted between the ceramic and the metal, and the contact between the materials is maintained by wetting with the liquid (wax), so it is very effective. Achieves an airtight joint. However, ceramics inherently have poor wettability with the solder used in general metal brazing. To this end, methods such as metallizing the ceramic surface or adding active metals such as T1 to the solder to facilitate wetting of the solder have been taken.

セラミックス表面をメタライジングする方法として、本
出願人は先に、セラミックスの表面にNiとTicの混
合粉末を塗布して焼結層を形成させる方法を提案した(
特願昭8O−285827)。しかしこの方法では加熱
温度を1200℃以上の温度にする必要がめった。これ
はNi+TjCの共晶温度が1285℃であるため、セ
ラミックス表面での反応が1200℃以下では生じない
ためであった。加熱温度が高いとそれだけエネルギーコ
ストも高くっため製造コストがかさみ好ましくない。
As a method for metallizing the surface of ceramics, the applicant previously proposed a method in which a mixed powder of Ni and Tic is applied to the surface of ceramics to form a sintered layer (
Patent application Sho 8O-285827). However, in this method, it was rarely necessary to raise the heating temperature to 1200° C. or higher. This is because the eutectic temperature of Ni+TjC is 1285°C, so no reaction occurs on the ceramic surface below 1200°C. The higher the heating temperature, the higher the energy cost, which increases the manufacturing cost, which is not preferable.

発明の目的 この発明は従来の前記メタライジング処理における加熱
温度を下げるためになされたものであり、Ni + T
L Cの混合粉末より低い加熱温度でメタライジング処
理できる方法を提案せんとするものである。
Purpose of the Invention The present invention was made in order to lower the heating temperature in the conventional metallizing treatment.
The purpose is to propose a method that can perform metallizing treatment at a lower heating temperature than that of LC mixed powder.

発明の構成 この発明に係るセラミックスと金属の接合方法は、セラ
ミックスの表面をNi75〜99%とTLBz1〜25
%からなる混合粉末にてメタライジング処理することを
特徴とするものでおる。
Composition of the Invention The method for joining ceramics and metal according to the present invention includes coating the surface of the ceramic with Ni75 to 99% and TLBz1 to 25%.
It is characterized by metallizing treatment using a mixed powder consisting of %.

Ni  TLE12系はT、82が2〜3モル%の組成
で1180℃に共晶点を持つので、Ni  Ticに比
べて100℃近く共晶点が下がることになる。この発明
はかかる事実を利用したもので、予めセラミックスの表
面にNiとTL’B2の混合粉末を薄く塗布し、これを
Ni、TLの酸化を防ぐために非酸化性雰囲気中で加熱
することにより、セラミックス表面に密着性の良好なN
i + Ti B 2の焼結層を生成させ、しかる後金
属材料に直接圧接するかまたは適当なインサート材を介
在させてろう付けすることにより、金属とセラミックス
の接合する方法でおる。
Since the Ni TLE12 system has a eutectic point at 1180° C. with a composition of 2 to 3 mol % of T and 82, the eutectic point is lowered by nearly 100° C. compared to Ni Tic. This invention takes advantage of this fact, and by applying a thin layer of mixed powder of Ni and TL'B2 on the surface of ceramics in advance and heating it in a non-oxidizing atmosphere to prevent oxidation of Ni and TL, N with good adhesion to ceramic surfaces
This is a method of joining metal and ceramic by forming a sintered layer of i + Ti B 2 and then directly press-bonding it to the metal material or brazing it with a suitable insert material.

ここで、メタライジング処理剤として、NiとTi B
 2を用いたのは以下に示す理由による。
Here, Ni and TiB are used as metallizing treatment agents.
2 was used for the following reasons.

NiとTL2の混合粉末の場合は、加熱によりTLB 
2がNi中に固溶し、固溶したTL、Bがセラミックス
と反応し、例えばZr 02の場合Zr 02が分解し
、ZrはBと一部結合しZr B 2を生成し、OはT
L02等の酸化物を作って安定化するからである。
In the case of a mixed powder of Ni and TL2, TLB is formed by heating.
2 is solid dissolved in Ni, and the solid dissolved TL and B react with ceramics. For example, in the case of Zr 02, Zr 02 decomposes, Zr partially combines with B to generate Zr B 2, and O becomes T.
This is because oxides such as L02 are created and stabilized.

NiとTL B 2の組成はそれぞれ75〜99%、1
〜25%が有効である。TL B 2が1%未満ではN
iへの固溶が少なく、従ってセラミックスとの反応が遅
くなり1〜2hr程度の加熱でも均一な皮膜が生成せず
、他方25%を超える場合にも皮膜中にTL B 2相
が多く存在し、特にセラミックスの近傍に偏析すること
によりセラミックスとの接合強度が低下すると考えられ
るためである。
The compositions of Ni and TL B2 are 75-99% and 1, respectively.
~25% are effective. N if TL B 2 is less than 1%
The solid solution in i is small, so the reaction with ceramics is slow and a uniform film cannot be formed even after heating for about 1 to 2 hours. This is because it is thought that the bonding strength with the ceramics decreases due to segregation particularly in the vicinity of the ceramics.

なお、NiとTL B 2の混合粉末の加熱温度は11
00℃以上が必要である。1100℃未満ではNi中へ
のTL B 2の固溶が少ないため、セラミックスとの
反応が十分達し得ないためである。
In addition, the heating temperature of the mixed powder of Ni and TL B 2 is 11
00°C or higher is required. This is because if the temperature is lower than 1100° C., the solid solution of TL B 2 in Ni is small, so that the reaction with ceramics cannot be achieved sufficiently.

実施例1 市販の99%M203(201TIm幅X20mm長×
1mm厚)の片面にNi+2%TL B 2の混合粉末
を加熱後約20加になるように塗布し、しかる後10′
″3 Torrの真空中で1100℃x 3層m r 
n加熱した。加熱後、普通11g1(201r+m幅X
20mm長X10+nm厚)と市販銀ろうを用い、0.
2mm厚の伍板をインサートして温度750℃でろう付
けした。
Example 1 Commercially available 99% M203 (201TIm width x 20mm length x
After heating, apply a mixed powder of Ni + 2% TL B 2 to one side of the 1mm thick) to a thickness of about 20%, and then 10'
``1100℃ x 3 layers m r in a vacuum of 3 Torr
n Heated. After heating, normally 11g1 (201r+m width
20mm length x 10+nm thickness) and commercially available silver solder.
A 2 mm thick plate was inserted and brazed at a temperature of 750°C.

得られた試料を接合面に垂直に中心より切断し鏡面研摩
して顕微鏡で観察した結果、接合界面やN2O3にクラ
ックの発生は認められなかった。
The obtained sample was cut from the center perpendicular to the joint surface, polished to a mirror surface, and observed under a microscope. As a result, no cracks were observed at the joint interface or at the N2O3.

実 施 例2 市販の7.rO2(3%Y2O3を含む)セラミックス
にNi+5%TL B 2を塗布し、実施例1と同様に
加熱し、5US30.iに直接ろう付けした結果、やは
り剥離やクラックの発生は認められなかった。
Example 2 Commercially available 7. Ni+5% TL B 2 was applied to rO2 (containing 3% Y2O3) ceramics, heated in the same manner as in Example 1, and 5US30. As a result of directly brazing to i, no peeling or cracking was observed.

実 施 例3 実施例1と同様のAl2203にNi+5%TL B 
2を塗布し、A7雰囲気中で1300’Cx10m1n
加熱後、0.3mm厚の伍板をインサート材として5U
S304にろう付けした。この場合も剥離やクラックの
発生は認められなかった。
Example 3 Ni + 5% TL B on Al2203 similar to Example 1
2 and 1300'C x 10m1n in A7 atmosphere.
After heating, 5U of 0.3mm thick Go plate was used as insert material.
Brazed to S304. In this case as well, no peeling or cracking was observed.

実 施 例4 Zr02にNi+25%TLB2を塗布し、1200’
CX60m1n  N2雰囲気中で加熱し、しかる後厚
さ0.2mmのへ板をインサート材として普通鋼とろう
付けした結果、メタライジング層中にはTj 82粒子
が分散していたが、”1r02との界面は良好に接合し
ていた。また、7.rO2中にはクラックの発生は認め
られなかった。
Example 4 Ni + 25% TLB2 was applied to Zr02, and 1200'
CX60m1n was heated in a N2 atmosphere, and then a 0.2 mm thick plate was used as an insert material and brazed with ordinary steel. As a result, Tj 82 particles were dispersed in the metallizing layer, but it was different from "1r02". The interface was well bonded. Also, no cracks were observed in 7.rO2.

比較例1 M2O3にNi+ 0.5%TL B 2を塗布し13
00’CX 30m1n真空中で加熱した。得られた試
料の断面を光学顕微鏡で観察した結果、Ni + TL
 82層はポーラスでM2O3との界面はほとんど接合
が認められなかった。
Comparative Example 1 Ni+ 0.5%TL B2 was applied to M2O3 and 13
00'CX 30ml heated in vacuum. As a result of observing the cross section of the obtained sample with an optical microscope, it was found that Ni + TL
Layer 82 was porous and almost no bonding was observed at the interface with M2O3.

比較例2 1ro2にNシ+3%TL B 2を塗布し1000℃
X1hrN2中で加熱し、得られた試料の断面を光学顕
微鏡で観察した結果、焼結中1”fとTL B 2の反
応が生じておらず、”1rotとの接合も認められなか
った。
Comparative example 2 Nshi + 3% TL B 2 was applied to 1ro2 and heated to 1000℃
As a result of heating the sample in X1hrN2 and observing the cross section of the obtained sample with an optical microscope, no reaction occurred between 1"f and TL B 2 during sintering, and no bonding with "1rot was observed.

発明の詳細 な説明したごとく、この発明はセラミックス用メタライ
ジング処理剤としてNi +TL B 2混合粉末を用
いることにより、1100〜1200’C程度の加熱で
メタライジング層を形成することが十分可能となり、低
温で安定・確実に金属と接合することができ、接合強度
良好な金属・セラミックスの複合材料を安価に提供し得
る効果を奏する。
As described in detail, this invention uses Ni + TL B 2 mixed powder as a metallizing treatment agent for ceramics, which makes it possible to form a metallized layer by heating at about 1100 to 1200'C. It is possible to stably and reliably join metals at low temperatures, and has the effect of providing a metal-ceramic composite material with good bonding strength at a low cost.

Claims (1)

【特許請求の範囲】[Claims] セラッミックスの表面をメタライジング処理し、金属と
セラミックスとを接合する方法において、セラミックス
の表面をNi75〜99%とTiB_21〜25%から
なる混合粉末にてメタライジング処理することを特徴と
するセラミックスと金属の接合方法。
A method of metallizing the surface of ceramics and joining metal and ceramics, characterized in that the surface of the ceramics is metallized with a mixed powder consisting of 75-99% Ni and 21-25% TiB. joining method.
JP25772886A 1986-10-29 1986-10-29 Method of joining ceramic to metal Pending JPS63112475A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25772886A JPS63112475A (en) 1986-10-29 1986-10-29 Method of joining ceramic to metal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25772886A JPS63112475A (en) 1986-10-29 1986-10-29 Method of joining ceramic to metal

Publications (1)

Publication Number Publication Date
JPS63112475A true JPS63112475A (en) 1988-05-17

Family

ID=17310267

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25772886A Pending JPS63112475A (en) 1986-10-29 1986-10-29 Method of joining ceramic to metal

Country Status (1)

Country Link
JP (1) JPS63112475A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0319258A (en) * 1989-06-15 1991-01-28 Nec Corp Manufacture of aluminum nitride ceramic substrate
CN103556002A (en) * 2013-11-22 2014-02-05 中山市华工材料表面科技有限公司 High performance Ni-based alloy-TiB2 nanopowder as well as preparation method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0319258A (en) * 1989-06-15 1991-01-28 Nec Corp Manufacture of aluminum nitride ceramic substrate
CN103556002A (en) * 2013-11-22 2014-02-05 中山市华工材料表面科技有限公司 High performance Ni-based alloy-TiB2 nanopowder as well as preparation method thereof

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