JPH08169778A - Brazing filler alloy for joining alumina ceramics to aluminum alloy and joined body - Google Patents

Brazing filler alloy for joining alumina ceramics to aluminum alloy and joined body

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Publication number
JPH08169778A
JPH08169778A JP33239594A JP33239594A JPH08169778A JP H08169778 A JPH08169778 A JP H08169778A JP 33239594 A JP33239594 A JP 33239594A JP 33239594 A JP33239594 A JP 33239594A JP H08169778 A JPH08169778 A JP H08169778A
Authority
JP
Japan
Prior art keywords
alloy
aluminum alloy
brazing
alumina
joined body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP33239594A
Other languages
Japanese (ja)
Other versions
JP3977875B2 (en
Inventor
Shinji Saito
慎二 斉藤
Takashi Kayamoto
隆司 茅本
Junichi Miyahara
淳一 宮原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NHK Spring Co Ltd
Original Assignee
NHK Spring Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NHK Spring Co Ltd filed Critical NHK Spring Co Ltd
Priority to JP33239594A priority Critical patent/JP3977875B2/en
Publication of JPH08169778A publication Critical patent/JPH08169778A/en
Application granted granted Critical
Publication of JP3977875B2 publication Critical patent/JP3977875B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

PURPOSE: To metallically join alumina ceramics to an Al alloy without carrying out any pretreatment and to attain joining with high strength, high stability, high heat resistance and high heat conductivity. CONSTITUTION: This brazing filler alloy consists of 5-45wt.% Ge, 5-15wt.% Si, 2-10wt.% Mg and the balance Al. This joined body is obtd. using this alloy.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明はアルミナ系セラミックス
とアルミニウム合金とのろう付に用いられるろう合金及
びアルミナ系セラミックス−アルミニウム合金の接合体
に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a brazing alloy used for brazing alumina ceramics and aluminum alloys and a joined body of alumina ceramics-aluminum alloy.

【0002】[0002]

【従来の技術とその問題点】従来、本発明の対象となっ
ているアルミナ系セラミックスとアルミニウム合金との
接合技術に関しては、以下のような近接する技術が知ら
れている。
2. Description of the Related Art Conventionally, the following closely related techniques are known as a technique for joining the alumina-based ceramic and the aluminum alloy, which is the object of the present invention.

【0003】まず、アルミナ系セラミックスと金属とを
接合する技術としては、下記の示すように(1)活性金
属ろうによるろう付、及び(2)メタライズ法が知られ
ている。
First, as a technique for joining an alumina-based ceramic and a metal, as shown below, (1) brazing with an active metal braze and (2) a metallizing method are known.

【0004】(1)の活性金属ろうによるろう付は、セ
ラミックスと化学的に反応するTi、Zrなどの金属
(活性金属)を含有するろう(活性金属ろう)によりセ
ラミックスと金属とをろう付する方法である。この方法
で用いられる活性金属ろうの基本はAg−Cuろうであ
り、ろう付温度は800〜1000℃である。
In the brazing with the active metal brazing (1), the ceramic and the metal are brazed with a brazing metal (active metal brazing) containing a metal (active metal) such as Ti and Zr which chemically reacts with the ceramic. Is the way. The basis of the active metal braze used in this method is Ag-Cu braze, the brazing temperature is 800-1000 ° C.

【0005】(2)のメタライズ法は、接合しようとす
るセラミックス表面にMo、Wなどの高融点金属を含む
表面層(メタライズ層)を設け、さらに表面層をNiな
どの金属でメッキした後、メッキ層と相手金属部材とを
ろう付する方法である。
In the metallizing method (2), a surface layer (metallizing layer) containing a refractory metal such as Mo or W is provided on the surfaces of the ceramics to be joined, and the surface layer is plated with a metal such as Ni. This is a method of brazing the plated layer and the mating metal member.

【0006】一方、アルミニウム合金を他種の材料と接
合するのに有効な方法としては、(3)接着剤を用いて
接合する方法しか知られていない。
On the other hand, the only effective method for joining the aluminum alloy to other materials is (3) a method of joining using an adhesive.

【0007】[0007]

【発明が解決しようとする課題】しかし、以下に示すよ
うに、上述した従来技術のどの方法でもアルミナ系セラ
ミックスとアルミニウム合金とを接合するには不適当で
ある。
However, as described below, none of the above-mentioned conventional methods is suitable for joining the alumina-based ceramic and the aluminum alloy.

【0008】(1)の方法はアルミニウム合金とセラミ
ックスとの接合に適用することができない。これは、こ
の方法による処理温度がアルミニウム合金の融点(一般
的に600℃以下)よりも高いことから、接合しようと
するアルミニウム合金部材自体が溶融してしまうためで
ある。
The method (1) cannot be applied to the joining of aluminum alloy and ceramics. This is because the treatment temperature of this method is higher than the melting point of aluminum alloy (generally 600 ° C. or lower), and the aluminum alloy members to be joined are melted.

【0009】(2)の方法では、セラミックス表面にメ
タライズ層及びメッキ層を設けた状態で、アルミニウム
合金用のろうを用いればろう付が可能である。しかし、
ろう付の前にメタライズ処理及びメッキ処理という2段
階の前処理が必要となるので生産性が悪い。
In the method (2), brazing can be performed by using a brazing material for aluminum alloy with the metallized layer and the plated layer provided on the ceramic surface. But,
Productivity is poor because a two-step pretreatment of metallizing treatment and plating treatment is required before brazing.

【0010】(3)のように接着剤を用いる方法では、
高強度、高安定性、高耐熱性、高熱伝導性の接合を得る
ことができない。
In the method using an adhesive as in (3),
High strength, high stability, high heat resistance, and high thermal conductivity cannot be obtained.

【0011】本発明は上記問題点を解決するためになさ
れたものであり、アルミナ系セラミックスとアルミニウ
ム合金とをなんらの前処理なしに金属的に接合すること
ができ、高強度、高安定性、高耐熱性、高熱伝導性の接
合を得ることを目的とする。
The present invention has been made in order to solve the above problems, and alumina-based ceramics and aluminum alloys can be metallically joined without any pretreatment, and high strength, high stability, The purpose is to obtain a joint having high heat resistance and high thermal conductivity.

【0012】[0012]

【課題を解決するための手段】本発明の接合用ろう合金
は、アルミナ系セラミックスとアルミニウム合金との接
合に用いられるろう合金であって、5〜45wt%のG
e、5〜15wt%のSi、2〜10wt%のMg、残
部Alからなることを特徴とするものである。
A brazing alloy for joining according to the present invention is a brazing alloy used for joining an alumina-based ceramic and an aluminum alloy, and contains 5 to 45 wt% of G.
e, 5 to 15 wt% of Si, 2 to 10 wt% of Mg, and the balance Al.

【0013】また、本発明の接合体は、アルミナ系セラ
ミックスとアルミニウム合金とをろう合金により接合し
た接合体であって、前記ろう合金が、5〜45wt%の
Ge、5〜15wt%のSi、2〜10wt%のMg、
残部Alからなることを特徴とするものである。
The joined body of the present invention is a joined body in which an alumina-based ceramic and an aluminum alloy are joined by a brazing alloy, and the brazing alloy is 5 to 45 wt% Ge, 5 to 15 wt% Si, 2-10 wt% Mg,
The balance is made of Al.

【0014】本発明において、アルミナ系セラミックス
とはアルミナ、アルミナを含有するガラス、アルミナを
含有するセラミック−ガラス複合材を含み、特に限定さ
れない。また、アルミニウム合金に関してもその構成成
分及び組成は特に限定されない。本発明の接合体は様々
な分野で利用され、その用途は特に限定されない。
In the present invention, the alumina ceramics include alumina, glass containing alumina, and ceramic-glass composite material containing alumina, and are not particularly limited. Further, the constituents and compositions of the aluminum alloy are not particularly limited. The joined body of the present invention is used in various fields, and its use is not particularly limited.

【0015】本発明において、ろう合金の組成を上記の
ように限定した理由を説明する。
In the present invention, the reason why the composition of the brazing alloy is limited as described above will be explained.

【0016】Mgはアルミナ系セラミックスと反応し、
良好な接合を形成する作用を有するとともに、アルミニ
ウム表面の酸化膜を還元分解してろうによる濡れを良好
にする作用を有する。Mgが10wt%を超えると雰囲
気中の酸素による酸化が激しくなり、ろう付性が悪化し
て接合部にボイドなどの欠陥が発生する。Mgが2wt
%未満ではアルミナ系セラミックスとの反応、及びアル
ミニウム合金表面の酸化物の分解とも不十分となり、上
記の効果が得られない。
Mg reacts with alumina ceramics,
It has the function of forming a good bond and also has the function of reducing and decomposing the oxide film on the aluminum surface to improve the wetting by the wax. When Mg exceeds 10 wt%, oxidation by oxygen in the atmosphere becomes severe, the brazing property deteriorates, and defects such as voids occur at the joint. Mg is 2 wt
If it is less than%, the reaction with the alumina-based ceramics and the decomposition of the oxide on the surface of the aluminum alloy are insufficient, and the above effects cannot be obtained.

【0017】Ge及びSiはろうの融点を降下させる作
用を有する。ただし、GeとSiとの合計が10wt%
未満ではろうの融点を600℃以下に降下させることが
できず、接合しようとするアルミニウム合金の融点以上
又は融点近くの温度でろう付する必要が生じるため、接
合が不可能になったり、アルミニウム合金の劣化を招
く。Siの含有量が15wt%を超えた場合にもろうの
融点が上昇するため、上記と同様の問題が生じる。Ge
の含有量が45wt%を超えると、ろう自体が脆化して
実用的でなくなるとともに、ろう付後の接合部にも脆化
が起こるために接合強度が低下する。
Ge and Si have the function of lowering the melting point of the wax. However, the total of Ge and Si is 10 wt%
If the melting point is lower than 600 ° C, the melting point of the brazing alloy cannot be lowered to 600 ° C or lower, and it becomes necessary to perform brazing at a temperature equal to or higher than or near the melting point of the aluminum alloy to be bonded, so that the bonding becomes impossible or the aluminum alloy Cause deterioration. Even when the Si content exceeds 15 wt%, the melting point of the wax rises, so that the same problem as described above occurs. Ge
If the content of Al exceeds 45 wt%, the brazing material itself becomes brittle and impractical, and the bridging also occurs in the joint after brazing, and the joint strength decreases.

【0018】[0018]

【作用】本発明のろう合金は融点がアルミニウム合金の
融点よりも低いので、アルミナ系セラミックスとアルミ
ニウム合金とを直接接合することができる。このろう付
に際しては、アルミナ系セラミックスにメタライズ処
理、化学研磨、メッキなどの前処理を施す必要がなく、
アルミニウム合金表面の酸化物を除去するためにフラッ
クスを用いる必要もないので、生産性が向上する。ま
た、本発明のろう合金を用いて得られる接合体は金属ろ
うにより接合されているため、接着剤を用いて接合され
たものと比較して、強度が高く、熱伝導性・耐熱性・気
密性にも優れている。
The melting point of the brazing alloy of the present invention is lower than that of the aluminum alloy, so that the alumina ceramics and the aluminum alloy can be directly bonded. At the time of this brazing, it is not necessary to subject the alumina-based ceramics to pretreatments such as metallizing treatment, chemical polishing, and plating.
Since it is not necessary to use a flux to remove the oxide on the surface of the aluminum alloy, the productivity is improved. In addition, since the joined body obtained by using the brazing alloy of the present invention is joined by a metal braze, it has higher strength, thermal conductivity, heat resistance, and airtightness than those joined by using an adhesive. It is also excellent in sex.

【0019】[0019]

【実施例】以下、本発明の実施例を説明する。Embodiments of the present invention will be described below.

【0020】実施例1〜5及び比較例1〜5 25wt%Ge、12wt%Si、6wt%Mg、残部
Alからなるろう合金を調製した。このろう合金を用
い、アルミナセラミックスとA1050アルミニウム合
金とを、温度550℃、5×10-4torrの真空中で
ろう付した。
Examples 1 to 5 and Comparative Examples 1 to 5 A brazing alloy composed of 25 wt% Ge, 12 wt% Si, 6 wt% Mg, and the balance Al was prepared. Using this brazing alloy, alumina ceramics and A1050 aluminum alloy were brazed in vacuum at a temperature of 550 ° C. and 5 × 10 −4 torr.

【0021】得られたアルミナセラミックス−アルミニ
ウム合金の接合体の接合界面の金属組織を示す電子顕微
鏡写真を図1及び図2に示す。なお、図2は図1の拡大
写真である。これらの図に示されるように接合界面には
ボイドなどの欠陥は見られない。また得られた接合体に
ついて、接合面に平行にせん断荷重をかけたところ、ア
ルミナ部材が破断するまで接合面の破断は起こらなかっ
た。
1 and 2 are electron micrographs showing the metal structure of the joint interface of the obtained alumina ceramics-aluminum alloy joint. Note that FIG. 2 is an enlarged photograph of FIG. As shown in these figures, no defects such as voids are found at the bonding interface. When a shear load was applied parallel to the joint surface of the obtained joint body, the joint surface did not fracture until the alumina member fractured.

【0022】上記と同様に表1に示す種々の組成のろう
合金を調製して、ろう付によりアルミナセラミックス−
アルミニウム合金の接合体を作製し、そのろう付性能を
調べた結果を表1に併記する。
Similar to the above, braze alloys having various compositions shown in Table 1 were prepared and brazed to the alumina ceramics-
Table 1 also shows the results of preparing aluminum alloy joints and examining the brazing performance thereof.

【0023】[0023]

【表1】 実施例6 30wt%Ge、10wt%Si、5wt%Mg、残部
Alからなるろう合金を調製した。図3に示すように、
このろう合金を用い、アルミナパイプ1とA6061ア
ルミニウム合金製の円盤2とをろう付して真空機器用絶
縁フランジを作製した。
[Table 1] Example 6 A brazing alloy composed of 30 wt% Ge, 10 wt% Si, 5 wt% Mg, and the balance Al was prepared. As shown in FIG.
Using this braze alloy, an alumina pipe 1 and a disc 2 made of A6061 aluminum alloy were brazed to produce an insulating flange for vacuum equipment.

【0024】この真空機器用絶縁フランジは、絶縁部材
がセラミックスであるため電気絶縁性が良好である。ま
た、締結部がアルミニウム合金であるため十分な機械的
信頼性を有する。更に、接合部の気密性が高いため、内
部を高真空にしてもリークが起こらない。
This insulating flange for vacuum equipment has good electrical insulation because the insulating member is made of ceramics. Further, since the fastening portion is made of aluminum alloy, it has sufficient mechanical reliability. Further, since the airtightness of the joint portion is high, no leak occurs even if the inside is highly vacuumed.

【0025】実施例7 25wt%Ge、8wt%Si、3wt%Mg、残部A
lからなるろう合金を調製した。図4に示すように、こ
のろう合金を用い、アルミナ基板11上にA1050ア
ルミニウム合金製のブロック12をろう付して電子素子
用ヒートシンクを作製した。
Example 7 25 wt% Ge, 8 wt% Si, 3 wt% Mg, balance A
A braze alloy consisting of 1 was prepared. As shown in FIG. 4, using this brazing alloy, a block 12 made of A1050 aluminum alloy was brazed onto an alumina substrate 11 to manufacture a heat sink for electronic devices.

【0026】このヒートシンクは、接合部がアルミニウ
ムを主体とする金属質であるため、熱伝導性に優れてい
る。
This heat sink is excellent in heat conductivity because the joint portion is made of a metal mainly composed of aluminum.

【0027】[0027]

【発明の効果】以上詳述したように本発明の接合用ろう
合金を用いればアルミナ系セラミックスとアルミニウム
合金とを直接に高い生産性で接合することができる。ま
た、このろう合金を用いて得られる本発明の接合体は強
度が高く、熱伝導性・耐熱性・気密性にも優れている。
As described above in detail, by using the brazing alloy for joining of the present invention, the alumina ceramics and the aluminum alloy can be joined directly with high productivity. Further, the joined body of the present invention obtained by using this brazing alloy has high strength and is also excellent in thermal conductivity, heat resistance and airtightness.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施例1で得られたアルミナセラミッ
クス−アルミニウム合金の接合体の接合界面の金属組織
を示す電子顕微鏡写真。
FIG. 1 is an electron micrograph showing a metal structure of a joint interface of an alumina ceramics-aluminum alloy joint obtained in Example 1 of the present invention.

【図2】本発明の実施例1で得られたアルミナセラミッ
クス−アルミニウム合金の接合体の接合界面の金属組織
を示し、図1を拡大した電子顕微鏡写真。
FIG. 2 is an electron micrograph showing an enlarged metal microstructure of a joint interface of an alumina ceramics-aluminum alloy joint obtained in Example 1 of the present invention.

【図3】本発明の実施例6で作製された真空機器用絶縁
フランジの分解斜視図。
FIG. 3 is an exploded perspective view of an insulating flange for a vacuum device manufactured in Example 6 of the present invention.

【図4】本発明の実施例7で作製された電子素子用ヒー
トシンクの分解斜視図。
FIG. 4 is an exploded perspective view of a heat sink for an electronic device manufactured in Example 7 of the present invention.

【符号の説明】[Explanation of symbols]

1…アルミナパイプ、2…アルミニウム合金製の円盤、
11…アルミナ基板、12…アルミニウム合金製のブロ
ック。
1 ... Alumina pipe, 2 ... Aluminum alloy disc,
11 ... Alumina substrate, 12 ... Aluminum alloy block.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 アルミナ系セラミックスとアルミニウム
合金との接合に用いられるろう合金であって、5〜45
wt%のGe、5〜15wt%のSi、2〜10wt%
のMg、残部Alからなることを特徴とする接合用ろう
合金。
1. A brazing alloy used for joining an alumina-based ceramic and an aluminum alloy, which is 5 to 45.
wt% Ge, 5-15 wt% Si, 2-10 wt%
2. A brazing alloy for joining, characterized by comprising Mg and the balance Al.
【請求項2】 アルミナ系セラミックスとアルミニウム
合金とをろう合金により接合した接合体であって、前記
ろう合金が、5〜45wt%のGe、5〜15wt%の
Si、2〜10wt%のMg、残部Alからなることを
特徴とする接合体。
2. A joined body obtained by joining an alumina ceramics and an aluminum alloy by a brazing alloy, wherein the brazing alloy is 5 to 45 wt% Ge, 5 to 15 wt% Si, and 2 to 10 wt% Mg. A joined body comprising the balance Al.
JP33239594A 1994-12-14 1994-12-14 Brazing alloy and joined body for joining of alumina-based ceramics-aluminum alloy Expired - Lifetime JP3977875B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33239594A JP3977875B2 (en) 1994-12-14 1994-12-14 Brazing alloy and joined body for joining of alumina-based ceramics-aluminum alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33239594A JP3977875B2 (en) 1994-12-14 1994-12-14 Brazing alloy and joined body for joining of alumina-based ceramics-aluminum alloy

Publications (2)

Publication Number Publication Date
JPH08169778A true JPH08169778A (en) 1996-07-02
JP3977875B2 JP3977875B2 (en) 2007-09-19

Family

ID=18254498

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
JP (1) JP3977875B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001168482A (en) * 1999-09-28 2001-06-22 Toshiba Corp Ceramics circuit substrate
JP2003320452A (en) * 2002-04-30 2003-11-11 Taiheiyo Cement Corp Method for joining metal - ceramic composite materials to each other
JP2006045040A (en) * 2004-08-09 2006-02-16 Nhk Spring Co Ltd Composite material having silicon-based ceramic and its manufacturing method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001168482A (en) * 1999-09-28 2001-06-22 Toshiba Corp Ceramics circuit substrate
JP4649027B2 (en) * 1999-09-28 2011-03-09 株式会社東芝 Ceramic circuit board
JP2003320452A (en) * 2002-04-30 2003-11-11 Taiheiyo Cement Corp Method for joining metal - ceramic composite materials to each other
JP4597468B2 (en) * 2002-04-30 2010-12-15 太平洋セメント株式会社 Method for joining metal-ceramic composite materials
JP2006045040A (en) * 2004-08-09 2006-02-16 Nhk Spring Co Ltd Composite material having silicon-based ceramic and its manufacturing method

Also Published As

Publication number Publication date
JP3977875B2 (en) 2007-09-19

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