JPS62179893A - Brazing filler metal for joining metal and ceramics - Google Patents
Brazing filler metal for joining metal and ceramicsInfo
- Publication number
- JPS62179893A JPS62179893A JP2199486A JP2199486A JPS62179893A JP S62179893 A JPS62179893 A JP S62179893A JP 2199486 A JP2199486 A JP 2199486A JP 2199486 A JP2199486 A JP 2199486A JP S62179893 A JPS62179893 A JP S62179893A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- alloy
- brazing filler
- ceramics
- joining
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 76
- 239000002184 metal Substances 0.000 title claims abstract description 76
- 238000005219 brazing Methods 0.000 title claims abstract description 37
- 239000000919 ceramic Substances 0.000 title claims abstract description 35
- 239000000945 filler Substances 0.000 title abstract description 23
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 29
- 239000000956 alloy Substances 0.000 claims abstract description 29
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 19
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 17
- 229910017944 Ag—Cu Inorganic materials 0.000 claims abstract description 16
- 150000002739 metals Chemical class 0.000 claims abstract description 16
- 229910052802 copper Inorganic materials 0.000 claims abstract description 12
- 239000000463 material Substances 0.000 claims description 13
- 239000000843 powder Substances 0.000 abstract description 11
- 239000011248 coating agent Substances 0.000 abstract description 6
- 238000000576 coating method Methods 0.000 abstract description 6
- 239000011888 foil Substances 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 11
- 229910052723 transition metal Inorganic materials 0.000 description 9
- 150000003624 transition metals Chemical class 0.000 description 9
- 229910000881 Cu alloy Inorganic materials 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 239000003292 glue Substances 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 230000005496 eutectics Effects 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910001092 metal group alloy Inorganic materials 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910017985 Cu—Zr Inorganic materials 0.000 description 1
- 229910017309 Mo—Mn Inorganic materials 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は金属とセラミックスの接合用ろう材に関し、更
に詳しくは容易に製造出来、高い接合制度の得られるろ
う材に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a brazing filler metal for joining metals and ceramics, and more particularly to a brazing filler metal that can be easily manufactured and provides high bonding accuracy.
［発明の技術的背景とその問題点］
窒化ケイ素、炭化ケイ系、アルミナのような谷ｉセラミ
ックスからなる部材は、それぞれが倫える考異な特性を
生かすことにより、栴造部材、各種機能部材として広く
利用されはじめている。その多くの場合は、セラミック
スそれ自体を単独で利用するという態様である。[Technical background of the invention and its problems] By taking advantage of the unique characteristics of silicon nitride, silicon carbide, and alumina, components can be used as ceramic components and various functional components. It is beginning to be widely used. In many cases, ceramics themselves are used alone.
しかしながら、仮にこれらセラミックス部材にセラミッ
クスにはない他の特性を有する金属を接合できるとすれ
ば、得られた部材は新たな機能を備えた部材として一層
広い分野での利用が可能になるものと考えられる。However, if it were possible to bond these ceramic components with metals that have other properties that ceramics do not have, we believe that the resulting components would be able to be used in an even wider range of fields as components with new functions. It will be done.
このような部材において、それが構造部品である場合に
はセラミックス部材と金属部材との接合強度は充分に高
いことが要求され、また機能部材である場合にはセラミ
ックス部材と金属部材との接合界面では連続性を有する
ことが要求される。In such a component, if it is a structural component, the bonding strength between the ceramic component and the metal component is required to be sufficiently high, and if it is a functional component, the bonding strength between the ceramic component and the metal component is required to be sufficiently high. Therefore, continuity is required.
しかしながら一般に、セラミックスと金属とは各々原子
結合状態が相違する材料であり、両者の反応性などの化
学的性質；熱膨張率；電気伝導度などの物理的性質が互
いに異なるため、両者の接合時においては、両部材の接
合界面では信頼性の高い冶金的接合状態が形成され難い
。However, in general, ceramics and metals are materials with different atomic bonding states, and their chemical properties such as reactivity, thermal expansion coefficient, and physical properties such as electrical conductivity are different from each other. In this case, it is difficult to form a highly reliable metallurgical bonded state at the bonding interface between the two members.
ところで、従来より金属部材とセラミックス部材との接
合体としては以下に示すような棟々の方法で接合された
接合体が知られている。例えば、■第１は、セラミック
ス部材の金属部材と接合すべき面にＭｏ −Ｍｎが主成
分である粉末と有機バインダとの混合物を塗布し、加湿
した雰囲気中で１４００〜１７００℃に加熱して反応さ
せて、通常、メタライジングと呼ばれる層を形成し、’
？ｌＪ）で、Ｓｎ系半田などにより接合された接合体で
ある。By the way, as a bonded body of a metal member and a ceramic member, a bonded body that is bonded by various methods as shown below is conventionally known. For example, (1) a mixture of a powder containing Mo-Mn as a main component and an organic binder is applied to the surface of the ceramic member to be bonded to the metal member, and the mixture is heated to 1400 to 1700°C in a humidified atmosphere. Reacts to form a layer usually called metallization, '
? lJ) and is a bonded body joined by Sn-based solder or the like.
こうした接合体はエレクトロニクス部品において、絶縁
体としてのセラミックス部材と導体としてのＣｕ部材の
接合体として多用されている。Such a joined body is often used in electronic parts as a joined body of a ceramic member as an insulator and a Cu member as a conductor.
■第２は、金属部材とセラミックス部材とをＡｕ 、
Ｐｉのような貴金属、つまり酸素との親和力が小さい金
属を主成分とする合金を用いて接合された接合体である
。■Secondly, the metal member and the ceramic member are made of Au,
This is a bonded body that is bonded using an alloy whose main component is a noble metal such as Pi, that is, a metal that has a low affinity for oxygen.
しかしながら、上記ｑ）の方法は必要とする工程の数が
多くなり煩雑であるという欠点を有する。However, the method q) has the disadvantage that it requires a large number of steps and is complicated.
上記■の方法は簡単な工程の下で接合できるものの、高
価な貴金属を使用するため経済的メリットは極めて少な
く、しかも金属部材とセラミックス部材とが十分に接触
するように高い圧力を必要とする。Although method (2) above can be bonded using a simple process, it has very little economic merit because it uses expensive precious metals, and requires high pressure to ensure sufficient contact between the metal member and the ceramic member.
このような問題を解消するために、米国特許第２．８５
７，６６３号明細書では次のような接合方法が開示され
ている。すなわち、その方法とは、’ｌ’ｉ 、 Ｚｒ
などの活性金属とＣｕ 、 Ｎｉ 、 Ｆｅなどの遷移
金属との合金は、その共晶組成領域で活性金属の単体の
融点（Ｔｉ：１７２０℃、Ｚｒ：１８６０℃）及びＣｕ
、 Ｎｉ 、Ｆｅ 単体の融点（夫々１０８３℃、
１４５３’Ｃ，１５３４℃ ）と比較して融点を数１０
０℃低下させることに着目し、遷移金属の部材とセラミ
ックス部材の接合部に活性金属を介在させ、該接合部を
遷移金属と活性金属の合金の融点より高く、遷移金属の
融点より低い温度に加熱し、遷移金属と活性金属の原子
を相互に拡散せしめて合金化し、この合金によって遷移
金属部材とセラミックス部材と接合する方法である。In order to solve this problem, U.S. Patent No. 2.85
No. 7,663 discloses the following joining method. That is, the method is 'l'i, Zr
An alloy of an active metal such as Cu, Ni, or Fe with a transition metal such as
, Ni, Fe (1083℃, respectively)
1453'C, 1534°C)
Focusing on reducing the temperature by 0°C, we interposed an active metal in the joint between the transition metal member and the ceramic member, and brought the joint to a temperature higher than the melting point of the transition metal and active metal alloy and lower than the melting point of the transition metal. In this method, atoms of the transition metal and the active metal are heated to mutually diffuse to form an alloy, and the transition metal member and the ceramic member are bonded using this alloy.
このようｌこＴｉ 、 Ｚｒなどの活性金属とＣｕ 、
Ｎｉなどの共晶組成の合金をろう材として金属部材と
セラミックス部材を接合する方法で接合された接合体の
他にＴｉ 、 Ｚｒなどの活性金属と低融点合金、たと
えばＡｇ Ｃｕ合金との合金をろう材として用いて接
合された接合体も知られている。In this way, active metals such as Ti, Zr and Cu,
In addition to joined bodies joined by a method of joining metal members and ceramic members using an alloy with a eutectic composition such as Ni as a brazing material, alloys of active metals such as Ti and Zr and low melting point alloys such as Ag-Cu alloys are also used. A bonded body that is bonded using a brazing material is also known.
この接合体の場合、接合時、接合部は遷移金属と活性金
属との合金の融液で満たされ、それが金属部材とセラミ
ックス部材とを濡らすので、各部材を接触させるための
加圧力を殆ど必要とせず、かつ活性金属の働きにより両
部材は強固に接合された接合体が得られる。In the case of this bonded body, during bonding, the bonded area is filled with a melt of the alloy of transition metal and active metal, which wets the metal component and the ceramic component, so that almost no pressure is applied to bring the components into contact. A bonded body can be obtained in which the two members are firmly joined without the need for the active metal.
しかしながら、この接合体の欠点は、前記活性金属と遷
移金属の共晶合金あるいは活性金属と〜−Ｃｕ含Ｃｕの
合金などのろう材が脆性で任意形状のろう材が得にくく
、−したがって接合体の形状が制約されたり、あるいは
、接合に際し多大の労力を必要とすることである。この
ようなことから延性で任意形状の得られる金属とセラミ
ックスの接合用ろう材が強く求められている。However, the disadvantage of this joined body is that the brazing filler metal, such as the eutectic alloy of the active metal and transition metal or the alloy of the active metal and ~--Cu containing Cu, is brittle and it is difficult to obtain a brazing filler metal of an arbitrary shape. The shape of the material is restricted, or a great deal of effort is required for joining. For these reasons, there is a strong demand for a brazing filler metal for joining metals and ceramics that is ductile and can be formed into any desired shape.
本発明は、金属とセラミックスを強固に接合でき、かつ
延性で任意形状の得られるろう材の提供を目的とする。An object of the present invention is to provide a brazing material that can firmly join metal and ceramics, is ductile, and can be formed into an arbitrary shape.
本発明者らは、前記活性金属を含む金属とセラミックス
の接合用ろう材について鋭意研究を重ねた結果、活性金
属を含まないＡｇ −Ｃｕ合金あるいは遷移金属の中で
も軟質なＣｕは延性で容易に加工できて、任意の形状が
得られることあるいは、活性金属Ｔｉ 、 Ｚｒなども
細い線あるいは粉末にすることで形状の自由度が増すこ
とに着目し、これらを組み合わせることで容易に上記目
的を達成し得るとの事実を見い出し、本発明を開発する
に到った。As a result of extensive research into brazing fillers for joining metals and ceramics containing active metals, the present inventors found that Ag-Cu alloys that do not contain active metals or Cu, which is soft among transition metals, are ductile and easily processed. We focused on the fact that any shape can be obtained, and that the degree of freedom in shape increases when active metals such as Ti and Zr are made into thin wires or powder, and by combining these, the above objectives can be easily achieved. The present invention was developed based on the discovery that the present invention can be obtained.
すなわち、本発明の金属とセラミックスの接合用ろう材
は、々−Ｃｕ含ＣｕるいはＣｕの線、范などの表面にｌ
１ｌｉあるいはＺｒのような活性金属粉末を被覆したろ
う材、あるいは、Ｉｌｌ ｉあるいはＺｒの細線にＡｇ
−Ｃｕ合金あるいはＣｕの層を被覆したろう羽である
。That is, the brazing filler metal for bonding metals and ceramics of the present invention can be applied to the surface of a Cu-containing Cu wire or a Cu wire.
Brazing filler metal coated with active metal powder such as Illi or Zr, or Ag on thin wire of Illi or Zr.
- It is a solder blade coated with a layer of Cu alloy or Cu.
Ａｇ −Ｃｕ合金あるいはＣｕの線、箔などの表面にＴ
ｉあるいはＺｒのような活性金属粉末を被覆する方法と
しては、たとえば有機溶剤と混合して塗布する。あるい
はあらかじめ表面にスプレーのりなどののりを塗布して
おき、その後活性金属粉末を散布するなどの方法がある
。また、蒸着、スパッタリングなどの方法で活性金属微
粉を、Ａｇ −Ｃｕ合金あるいはＣｕの線、箔表面に被
覆しても良い。T on the surface of Ag-Cu alloy or Cu wire, foil, etc.
A method of coating active metal powder such as i or Zr is, for example, by mixing it with an organic solvent and applying it. Alternatively, there is a method in which a glue such as spray glue is applied to the surface in advance, and then active metal powder is sprinkled on the surface. Further, active metal fine powder may be coated on the Ag--Cu alloy or Cu wire or foil surface by a method such as vapor deposition or sputtering.
ＴｉあるいはＺｒの細線にＡｇ −Ｃｕ合金あるいはＣ
ｕの層を被覆する方法としては、ＴｉあるいはＺｒ細線
をＡｇ−Ｃｕ合金あるいはＣｕの融液に浸して引上げる
、あるいはＡｇ −Ｃｕ合金あるいはＣｕの粉末を有機
溶剤と混合して塗布するなどの方法がある。Ti or Zr thin wire with Ag-Cu alloy or C
The U layer can be coated by dipping a thin Ti or Zr wire into a Ag-Cu alloy or Cu melt and pulling it up, or by coating a mixture of Ag-Cu alloy or Cu powder with an organic solvent. There is a way.
上記Ａｇ −Ｃｕ合金あるいはＣｕの線、箔などの表面
にＴｉあるいはＺｒのような活性金属ろう材、あるいは
ＴｉあるいはＺｒ細線にＡｇ −Ｃｕ合金あるいはＣｕ
の層を被覆したろう材を金属とセラミックスの接合部材
の接合部に配し、Ａｇ’−Ｃｕ合金あるいはＣｕと活性
金属の共晶温度以上の温度に加熱すると、前者の場合は
、Ｔｉ −Ａｇ−Ｃｕ合金融液が、後者の場合は、Ｃｕ
−活性金属合金融液が接合部に生成し、金属とセラミッ
クスを強固に接合するものである。An active metal brazing material such as Ti or Zr is applied to the surface of the Ag-Cu alloy or Cu wire or foil, or an Ag-Cu alloy or Cu is applied to the Ti or Zr thin wire.
When a brazing filler metal coated with a layer of Ti-Ag is placed on the joint of a metal-ceramic joining member and heated to a temperature higher than the eutectic temperature of the Ag'-Cu alloy or Cu and the active metal, in the former case, Ti-Ag -Cu alloy liquid is Cu
- Activated metal alloy liquid is generated at the joint and firmly joins the metal and ceramic.
Ａｇ −Ｃｕ合金の融点は板底が７８０℃、Ｃｕ −Ｔ
ｉ合金が８８０℃、Ｃｕ−Ｚｒ合金が８８５℃であるこ
とから、それぞれこれらの温度より高い温度に加熱すれ
ば良い。The melting point of Ag-Cu alloy is 780℃ at the bottom of the plate, Cu-T
Since the temperature of the i-alloy is 880°C and the temperature of the Cu-Zr alloy is 885°C, it is sufficient to heat each to a temperature higher than these temperatures.
本発明のろう材を適用し得るセラミックス部材としては
、例えば、Ａｚ、ｏ、 、 ＺｒＯ，のような酸化物系
セラミックスの部材： ＳｉＣ，ＴｉＣのような炭化物
系セラミックスの部材； ８ ｉ３Ｎ、 、Ａｔ Ｎの
ような窒化物系セラミックスの部材；をあげることがで
きる。また、金属部材としては、Ｆｅ、Ｎｉ、Ｃｏ。Ceramic members to which the brazing filler metal of the present invention can be applied include, for example, oxide-based ceramic members such as Az, O, , ZrO, carbide-based ceramic members such as SiC and TiC; 8 i3N, , At Examples include nitride-based ceramic members such as N. Further, the metal members include Fe, Ni, and Co.
Ｔｉ、Ｍｏ、Ｗ、Ｎｂ、Ｔａ、Ｚｒのような金属の部材
若しくはこれら金属の適宜な合金の部材をあげることが
できる。Examples include metal members such as Ti, Mo, W, Nb, Ta, and Zr, or suitable alloy members of these metals.
以上説明したように本発明によれば強固な接合を容易に
得ることができる金属とセラミックスとの接合用ろう材
を得ることができる。As explained above, according to the present invention, it is possible to obtain a brazing material for joining metals and ceramics that can easily form a strong joint.
本発明ろう材に詔けるＡｇ −Ｃｕ合金あるいは、Ｃｕ
と活性金属との比率は、特に限定するものではないが、
Ａｇ −Ｃｕ合金と活性金属の組合わせの場合、活性金
属の比率が重量で０．１〜５％程度、ＣｕとＴｉあるい
はＣｕとＺｒの組合わせの場合それぞれの共晶組成にお
けるＣｕとＴｉあるいはＣｕのＺｒの比率（具体的には
、ＣｕとＴｉでは２８ ％Ｔｉ 、ＣｕとＺｒでは４７
％Ｚｒ）にすることが望ましい。Ag-Cu alloy or Cu that can be used in the brazing filler metal of the present invention
The ratio of active metal to active metal is not particularly limited, but
In the case of a combination of Ag-Cu alloy and an active metal, the ratio of the active metal is about 0.1 to 5% by weight, and in the case of a combination of Cu and Ti or Cu and Zr, the ratio of Cu and Ti in each eutectic composition or The ratio of Zr to Cu (specifically, 28% Ti for Cu and Ti, 47% Ti for Cu and Zr)
%Zr).
本発明のろう材は、上記のごとく、延性で加工性に富む
Ａｇ −Ｃｕ合金あるいはＣｕの線、箔の表面に活性金
属の粉末を被覆したろう材あるいは、容易に変形出来る
ＴｉあるいはＺｒの細線に延性で加工性に富むＡｇ −
Ｃｕ合金あるいはＣｕの１−を被覆したものであるため
、いずれも延性で加工性に富み、任意の形状の得られる
ろう材となりうるものである。またこれらろう材で接合
した金属とセラミックスの接合体は、活性金属の作用で
強固に接合された接合体を提供するものである。As mentioned above, the brazing material of the present invention is a ductile and highly workable Ag-Cu alloy or Cu wire, a brazing material whose surface is coated with active metal powder, or a fine wire of Ti or Zr that can be easily deformed. Ag is highly ductile and workable.
Since it is a Cu alloy or one coated with Cu, both are ductile and workable, and can be used as a brazing material that can be formed into any shape. Furthermore, the joined body of metal and ceramics joined by these brazing filler metals provides a joined body that is firmly joined by the action of the active metal.
（実施例１）
直径１ｍｙ＋の７２％Ａｇ −２８％Ｃｕろう材線の表
面に有機性スプレーのりを塗布しその鎌直径１〜２μｍ
のＴｉ粉をろう材線の重量の１．５チの比率となるよう
散布した。該ろう材は、加工性に富むろう材であった。(Example 1) Organic spray glue was applied to the surface of a 72%Ag-28%Cu brazing wire with a diameter of 1my+, and the sickle diameter was 1 to 2μm.
Ti powder was sprinkled at a ratio of 1.5 cm to the weight of the brazing wire. The brazing filler metal was a brazing filler metal with excellent workability.
（実施例２）
笛１図（１１に示すようにあらかじめ直径５０ｍｍの円
形に加工した直径１箇の７２％Ａｇ−２８％Ｃｕろう材
線の表面に有機性スプレーのりを塗布し、その後、直径
１〜２μｍのＴｉ（１ｙをろう材線の重量の１．５チの
比率となるよう散布した。該ろう材を、第２図（２＋
、 （３）に示す９９．９チＡｔ２０３セラミツクスと
コバール部材（Ｆｅ５４％、Ｎｉ２９％、Ｃ０１７％）
の接合部（４）に配した。その後、真窒炉中に配し、３
ｘ １０−５Ｔｏｒｒ ノ真空ニ排気Ｌ ７’、：
＋７） チ、８８０℃で３分保持した。冷却後得られた
Ａ／！、、０３とコバールの接合材は、強度に接合され
たものであった。(Example 2) As shown in Fig. 1 (Figure 11), organic spray glue was applied to the surface of a 72%Ag-28%Cu brazing wire that had been previously processed into a circular shape with a diameter of 50mm, and then 1 to 2 μm of Ti (1y) was sprinkled at a ratio of 1.5 μm to the weight of the brazing wire.
, 99.9-chi At203 ceramics and Kovar member (Fe54%, Ni29%, C017%) shown in (3)
It was placed at the joint (4). After that, place it in a true nitrogen furnace and
x 10-5 Torr vacuum exhaust L 7':
+7) H. Hold at 880°C for 3 minutes. A/! obtained after cooling! , 03 and Kovar were bonded together with strength.
（実施例３）
直径０．５ ＋ｒｒｍのＺｒ細線の表面に、直径４０〜
５０μｍのＣｕ粉末をポリビニルアルコールと混練シタ
ペーストを止血した。この時、ＺｒとＣｕの重量比が４
５：５５になるように塗布量を制御した。このろう材は
、延性に富んでいた。(Example 3) On the surface of a thin Zr wire with a diameter of 0.5 + rrm, a wire with a diameter of 40~
50 μm Cu powder was kneaded with polyvinyl alcohol to stop bleeding. At this time, the weight ratio of Zr and Cu is 4
The coating amount was controlled so that the ratio was 5:55. This brazing filler metal was highly ductile.
次いで該ろう材を、直径５０ ｔｍ 、厚さ３鵡のＭ。Next, the brazing filler metal was molded into an M having a diameter of 50 tm and a thickness of 3 mm.
円板の外周部表面に加工した巾２飄、深さ１日の港の中
に配し、その上に直径５０ ｔｔａｓ 、厚さ２ｆｉの
ＡｚＮ（１ｍ化アルミニウム）円板を当接し、真空炉中
に設置した。Place it in a port with a width of 2 mm and a depth of 1 day processed on the outer peripheral surface of the disk, and place an AzN (1 m aluminum) disk with a diameter of 50 ttas and a thickness of 2 fi on top of it, and place it in a vacuum furnace. installed inside.
その後、５Ｘ１０Ｔｏｒｒの真空ｉこ排気し９８０℃に
昇温しで１０分間保持した。Thereafter, the vacuum chamber was evacuated to 5×10 Torr, and the temperature was raised to 980° C. and held for 10 minutes.
冷却後炉中より取り出したＭｏとんへの接合材は強固に
接合されたものであった。After cooling, the bonding material to the Mo ton was taken out from the furnace and was firmly bonded.
第１図はろう材を示す概略図、第２図は接合状態を示す
概略図。
代理人 弁理士 則 近 憲 佑
同 竹 花 喜久男
第１図
第２図FIG. 1 is a schematic diagram showing a brazing filler metal, and FIG. 2 is a schematic diagram showing a bonded state. Agent Patent Attorney Noriyuki Chika Yudo Kikuo Takehana Figure 1 Figure 2
Claims (2)
が被覆されていることを特徴とする金属とセラミックス
との接合用ろう材。(1) Ti or Zr on Cu or Ag-Cu alloy surface
A brazing material for joining metal and ceramics, characterized by being coated with.
が被覆されていることを特徴とする金属とセラミックス
との接合用ろう材。(2) A brazing material for joining metals and ceramics, characterized in that the surface of Ti or Zr is coated with Cu or an Ag-Cu alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2199486A JPS62179893A (en) | 1986-02-05 | 1986-02-05 | Brazing filler metal for joining metal and ceramics |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2199486A JPS62179893A (en) | 1986-02-05 | 1986-02-05 | Brazing filler metal for joining metal and ceramics |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62179893A true JPS62179893A (en) | 1987-08-07 |
Family
ID=12070574
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2199486A Pending JPS62179893A (en) | 1986-02-05 | 1986-02-05 | Brazing filler metal for joining metal and ceramics |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62179893A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0710645A (en) * | 1993-10-08 | 1995-01-13 | Toshiba Corp | Aluminum nitride conjugate and its production |
| JPH07101784A (en) * | 1994-06-06 | 1995-04-18 | Toshiba Corp | Aluminum nitride joined body and its production |
| JP2016193449A (en) * | 2015-04-01 | 2016-11-17 | 富士電機株式会社 | Powder brazing material, joined body and vacuum vessel |
-
1986
- 1986-02-05 JP JP2199486A patent/JPS62179893A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0710645A (en) * | 1993-10-08 | 1995-01-13 | Toshiba Corp | Aluminum nitride conjugate and its production |
| JPH07101784A (en) * | 1994-06-06 | 1995-04-18 | Toshiba Corp | Aluminum nitride joined body and its production |
| JP2016193449A (en) * | 2015-04-01 | 2016-11-17 | 富士電機株式会社 | Powder brazing material, joined body and vacuum vessel |
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