JPS60131873A - Cerqmic-metal direct bonded body and manufacture - Google Patents

Cerqmic-metal direct bonded body and manufacture

Info

Publication number
JPS60131873A
JPS60131873A JP23764783A JP23764783A JPS60131873A JP S60131873 A JPS60131873 A JP S60131873A JP 23764783 A JP23764783 A JP 23764783A JP 23764783 A JP23764783 A JP 23764783A JP S60131873 A JPS60131873 A JP S60131873A
Authority
JP
Japan
Prior art keywords
ceramic
metal
bonded body
direct bonded
metal direct
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23764783A
Other languages
Japanese (ja)
Inventor
顕生 佐谷野
俊一郎 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP23764783A priority Critical patent/JPS60131873A/en
Publication of JPS60131873A publication Critical patent/JPS60131873A/en
Pending legal-status Critical Current

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  • Pressure Welding/Diffusion-Bonding (AREA)
  • Ceramic Products (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 [発明の技術分野J オ\発明は、ヒラミックス−金属直接接合体およびその
製造方法に関する。
DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The invention relates to a Hiramix-metal direct bonded body and a method for manufacturing the same.

[発明の技術的背景とその問題点] 従来から、セラミックス部材を金属部材に接合さ虻る方
法としては、セラミックス部材表面にモリゾデンーマン
カンペースト等を塗布し、非酸化性雰囲気中で焼成して
金属化処理を施した後、ニッケルめっぎを行ない、ろう
付けして金属部材と接合づ−る方法が一般に用いられて
いる。
[Technical background of the invention and its problems] Conventionally, the method of joining a ceramic member to a metal member is to apply a molyzodene-mancan paste or the like to the surface of the ceramic member and then sinter it in a non-oxidizing atmosphere. A commonly used method is to perform metallization treatment, then perform nickel plating, and then join it to a metal member by brazing.

この方法は、アルミナのような酸化物系のセラミックス
部材と金属部材とを接合する場合には有効であるが、窒
化物系セラミックス、酸窒化物系セラミックスあるいは
炭化物系セラミックスのような非酸化物系セラミックス
と金属部材とを接合する場合には接合強面が不十分にな
るという111点があった。
This method is effective when joining oxide-based ceramic members such as alumina and metal members, but it is effective for joining non-oxide ceramic members such as nitride-based ceramics, oxynitride-based ceramics, or carbide-based ceramics. There were 111 points in which the strength of the joint was insufficient when joining ceramics and metal members.

ところで、非酸化物系セラミックスは一般に耐摩耗性や
高温特性に優れているため、これらの特性の要求される
各種分野への応用が考えられており、そのためにも非酸
化物系セラミックスと金属部材との接合技術の確立が強
く望まれ′Cいる。
By the way, non-oxide ceramics generally have excellent wear resistance and high-temperature properties, and are being considered for application in various fields that require these properties. There is a strong desire to establish a bonding technology for this purpose.

[発明の目的] 本発明者等はこのような点に対処し゛C12意研究を進
めたところ、セラミックス部材と金属部材とをこれらの
成分元素からなる共晶組織の層を介して接合させた場合
、金属化処理のような前処理を必要とせず、しかも大き
い接合強1文が得られることを見出した。
[Purpose of the Invention] The inventors of the present invention have conducted research on the C12 concept to address these points, and have found that when a ceramic member and a metal member are joined through a layer of eutectic structure composed of these component elements, It has been found that a pretreatment such as metallization treatment is not required, and a high bonding strength can be obtained.

本発明はこのような知見に基づいてなされたもので、金
属化処理のような前処理を必要とぜず、しかも大ぎい接
合強度を有Jるセラミックス−金属直接接合体およびそ
の製造方法を提供することを目的とする。
The present invention has been made based on such knowledge, and provides a ceramic-metal direct bonded body that does not require pretreatment such as metallization treatment and has high bonding strength, and a method for manufacturing the same. The purpose is to

[発明の概要] 艷なわら本発明のセラミックス−金属直接接合体は、セ
ラミックス部材と金属部材とがセラミックス部材ど金属
部材の成分元素からなる共晶組織の層を介し−C接合さ
れていることを特徴としている。
[Summary of the Invention] In the ceramic-metal direct bonded body of the present invention, a ceramic member and a metal member are bonded by -C through a layer of eutectic structure made of component elements of the metal member such as the ceramic member. It is characterized by

また本発明のセラミックス−金属直接接合体の製造方法
は、セラミックス部材と金属部材とを接触させ、これら
セラミックス部材と金属部材の成分元素を含む共晶組織
の融点以上で、かつセラミックス部材と金属部材のいず
れをも溶融、昇華あるいは分解させない温度下で焼成す
ることを特徴どしている。
Further, the method for producing a ceramic-metal direct bonded body of the present invention includes bringing a ceramic member and a metal member into contact with each other, and at least the melting point of the eutectic structure containing the component elements of the ceramic member and the metal member, and the ceramic member and the metal member being in contact with each other. It is characterized by being fired at a temperature that does not cause melting, sublimation, or decomposition of any of the above.

本発明に使用されるセラミックス部材としては、窒化ケ
イ素、窒化アルミニウム窒化チタンのような窒化物系セ
ラミックス、サイア0ンのような酸窒化物系セラミック
スあるいは炭化ケイ素のような縦化物系セラミックスお
よび、これらの複合体のような非酸化物系セラミックス
焼結体が好適している。また、酸化物セラミックスにも
適用i1J I’llである。
Ceramic members used in the present invention include nitride ceramics such as silicon nitride, aluminum nitride, titanium nitride, oxynitride ceramics such as SIA0, and vertical ceramics such as silicon carbide. A non-oxide ceramic sintered body such as a composite of is suitable. It is also applicable to oxide ceramics.

また、本発明に使用される金属部材は、これらのセラミ
ックスと共晶組織を形成し得る金属であって、ニッケル
またはニッケルを含む合金からなる金属部材が適しくい
る。
Further, the metal member used in the present invention is a metal that can form a eutectic structure with these ceramics, and a metal member made of nickel or an alloy containing nickel is suitably used.

本発明におけるセラミックス−金属直接接体は、次のよ
うな方法で製造される。
The ceramic-metal direct contact body in the present invention is manufactured by the following method.

1゛なわち、セラミックス部材、例えばノド醸化物系セ
ラミックスと、この非酸化物系セラミックスの成分元素
と共晶組織を形成し得る金属元素を含有づる金属部材と
を、それぞれ接合すべき面を接触させて、これを非酸化
1!1雰囲気、例えばホーミングガス中で両者の成分元
素による共晶が形成される温度以上ぐ、かつセラミック
ス部材おJ、び金属部材のいずれをも溶融、昇華あるい
は分解を起こさせない温度範囲で数分間加熱することに
より行なわれる。なお、□接合時に接触部がそれぞれ密
着するように加圧することは、接合状態を均一にするた
めに効果がある。
1. In other words, the surfaces to be joined are brought into contact with a ceramic member, for example, a clay-based ceramic, and a metal member containing a metal element that can form a eutectic structure with the constituent elements of the non-oxide ceramic. This is then heated in a non-oxidizing 1:1 atmosphere, such as a homing gas, at a temperature higher than the temperature at which a eutectic is formed by both component elements, and both the ceramic member and the metal member are melted, sublimated or decomposed. This is done by heating for several minutes at a temperature range that does not cause □ Applying pressure so that the contact portions come into close contact with each other during bonding is effective in making the bonded state uniform.

このような非酸化性雰囲気下における加熱により、両部
材の接触面には薄い共晶絹様による層が形成され、両部
材は強固に接合される。
By heating in such a non-oxidizing atmosphere, a thin eutectic silk-like layer is formed on the contact surfaces of the two members, and the two members are firmly joined.

[発明の実施例] 以下本発明の実施例について説明する。[Embodiments of the invention] Examples of the present invention will be described below.

実施例 直方体状(10x10x3龍)のTi N (C。Example Rectangular parallelepiped (10x10x3 dragons) TiN (C.

2%含有)焼結体試料と、650℃で20分間焼鈍した
厚さO,3nのニッケル板とを重ね合せ、ニッケル板上
に約10gのタングステン鍾を載せ、これをホーミング
ガス(N2 :H2=1 : 1)の還元性雰囲気中で
1280℃で5分間加熱して両者を接合させた。
A sintered body sample (containing 2%) and a nickel plate with a thickness of 0.3 nm annealed at 650°C for 20 minutes were stacked together, a tungsten plow weighing about 10 g was placed on the nickel plate, and the sintered body sample was heated with a homing gas (N2:H2). The two were bonded by heating at 1280° C. for 5 minutes in a reducing atmosphere of =1:1).

このようにしC得られたセラミックス−ニッケル直接接
合体の境界面を電子顧微鋭(X2000)C観察したと
ころ、連続的に変化する境界層を呈しくおり、充分な接
合状態を示すものであった。
Electron Microscope (X2000) C observation of the interface of the ceramic-nickel direct bonded body obtained in this way revealed that a continuously changing boundary layer was observed, indicating a satisfactory bonding state. Ta.

[発明の効果] 以上の実施例からも明らかなように本発明のセラミック
ス−金属直接接合体は、従来金属部材との接合が困難で
あった非酸化物系セラミックスにもセラミックス部材を
大きい接合強度で接合させることができ、しかも前処理
を必要としないのぐ、作業の手数を大幅に軽減さU゛る
ことかできる。
[Effects of the Invention] As is clear from the above examples, the ceramic-metal direct bonded body of the present invention can bond ceramic members with high bonding strength, even with non-oxide ceramics, which have conventionally been difficult to bond with metal members. Since the bonding process can be carried out with no pretreatment and no pretreatment is required, the number of operations can be significantly reduced.

代理人弁理士 須 山 佐 −Representative Patent Attorney Su Yamasa -

Claims (9)

【特許請求の範囲】[Claims] (1)セラミックス部材と金属部材とがセラミックス部
材ど金属部Hの各成分元素からなる共晶組織を含む層を
介して接合されていることを特徴とりるセラミックス−
金属直接接合体。
(1) A ceramic member characterized in that a ceramic member and a metal member are joined via a layer containing a eutectic structure consisting of each component element of the metal portion H of the ceramic member.
Metal direct joint.
(2)セラミックス部材は、非酸化物系セラミックスか
らなる特許請求の範囲第1項記載のセラミックス−金属
直接接合体。
(2) The ceramic-metal direct bonded body according to claim 1, wherein the ceramic member is made of a non-oxide ceramic.
(3)セラミックス部材は、窒化物系セラミックス、酸
窒化物系セラミックスおよび炭窒化物系セラミックスか
ら選ばれたセラミックスからなる特許請求の範囲第1項
または第2項記載のセラミックス−金属直接接合体。
(3) The ceramic-metal direct bonded body according to claim 1 or 2, wherein the ceramic member is made of a ceramic selected from nitride ceramics, oxynitride ceramics, and carbonitride ceramics.
(4)セラミックス部材は、成分元素としてチタンおよ
び窒素を含有する特許請求の範囲第1項ないし第3項の
いずれか1項記載のセラミックス−金属直接接合体。
(4) The ceramic-metal direct bonded body according to any one of claims 1 to 3, wherein the ceramic member contains titanium and nitrogen as component elements.
(5)金属部Iは、ニッケルまたはニッケルを含有する
合金からなる特許請求の範囲第1項ないし第4項のいず
れか1項記載のヒラミックス−金属直接接合体。
(5) The Hiramix-metal direct bonded body according to any one of claims 1 to 4, wherein the metal portion I is made of nickel or an alloy containing nickel.
(6)セラミックス部材と金属部材どを接触させ、これ
らセラミックス部材と金属部材の成分元素を含む共晶組
織の融点以上で、かつセラミックス部材と金属部材のい
ずれをも溶融、昇華あるいは分解させない温度下で焼成
することを特徴と1−るしラミックスー金属直接接合体
の製造方法。
(6) A ceramic member and a metal member are brought into contact at a temperature that is higher than the melting point of the eutectic structure containing the component elements of the ceramic member and the metal member, and that does not melt, sublimate, or decompose either the ceramic member or the metal member. 1. A method for producing a lamic-metal direct bonded body.
(7)セラミックス部材は、非酸化物系セラミックスか
らなる特許請求の範囲第6項記載のセラミックス−金属
直接接合体の製造方法。
(7) The method for manufacturing a ceramic-metal direct bonded body according to claim 6, wherein the ceramic member is made of a non-oxide ceramic.
(8)セラミックス部材は、窒化物系セラミックス、酸
窒化物系セラミックスおよび炭化物系セラミックスから
選ばれたセラミックスからなる特許請求の範1f11第
6項または第7項記載のセラミックス−金属直接接合体
の製造方法。
(8) Production of a ceramic-metal direct bonded body according to claim 1f11, paragraph 6 or 7, in which the ceramic member is made of a ceramic selected from nitride ceramics, oxynitride ceramics, and carbide ceramics. Method.
(9)セラミックス部材は、成分元素とし°τチタンお
よび窒素を含有する特許請求の範囲第6項ないし第8項
のいずれか1項記載のセラミックス−金属゛直接接1合
体の製造方法。 <10)金属部材は、ニッケルまたはニッケルを含有す
る合金からなる特許請求の範囲第6項ないし第9項のい
ずれか1項記載のセラミックス−金属直接接合体の製造
方法。
(9) A method for producing a ceramic-metal direct bonded assembly according to any one of claims 6 to 8, wherein the ceramic member contains titanium and nitrogen as component elements. <10) The method for manufacturing a ceramic-metal direct bonded body according to any one of claims 6 to 9, wherein the metal member is made of nickel or an alloy containing nickel.
JP23764783A 1983-12-15 1983-12-15 Cerqmic-metal direct bonded body and manufacture Pending JPS60131873A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23764783A JPS60131873A (en) 1983-12-15 1983-12-15 Cerqmic-metal direct bonded body and manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23764783A JPS60131873A (en) 1983-12-15 1983-12-15 Cerqmic-metal direct bonded body and manufacture

Publications (1)

Publication Number Publication Date
JPS60131873A true JPS60131873A (en) 1985-07-13

Family

ID=17018417

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23764783A Pending JPS60131873A (en) 1983-12-15 1983-12-15 Cerqmic-metal direct bonded body and manufacture

Country Status (1)

Country Link
JP (1) JPS60131873A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01283367A (en) * 1988-05-09 1989-11-14 Mitsubishi Metal Corp Production of target for sputtering

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50132022A (en) * 1974-03-04 1975-10-18
JPS5237914A (en) * 1975-07-30 1977-03-24 Gen Electric Method of directly combining metal to ceramics and metal
JPS5713515A (en) * 1980-06-27 1982-01-23 Mitsubishi Electric Corp Process control checking circuit

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50132022A (en) * 1974-03-04 1975-10-18
JPS5237914A (en) * 1975-07-30 1977-03-24 Gen Electric Method of directly combining metal to ceramics and metal
JPS5713515A (en) * 1980-06-27 1982-01-23 Mitsubishi Electric Corp Process control checking circuit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01283367A (en) * 1988-05-09 1989-11-14 Mitsubishi Metal Corp Production of target for sputtering

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