JPS6310565U - - Google Patents

Info

Publication number
JPS6310565U
JPS6310565U JP10409186U JP10409186U JPS6310565U JP S6310565 U JPS6310565 U JP S6310565U JP 10409186 U JP10409186 U JP 10409186U JP 10409186 U JP10409186 U JP 10409186U JP S6310565 U JPS6310565 U JP S6310565U
Authority
JP
Japan
Prior art keywords
plating layer
support plate
lead frame
lead
nickel plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10409186U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10409186U priority Critical patent/JPS6310565U/ja
Publication of JPS6310565U publication Critical patent/JPS6310565U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図と第２図はそれぞれ本考案の第１の実施
例を示す断面図と平面図で、第１図は第２図のＡ
―Ａ線断面である。第３図と第４図はそれぞれ本
考案の第２の実施例を示す断面図と平面図で、第
３図は第４図のＢ―Ｂ線断面である。 １ａ，１ｂ……リードフレーム、２……支持板
、３，４，５……リード、１１ａ，１１ｂ……光
沢ニツケルメツキ層、１２ａ，１２ｂ……ボロン
―ニツケル合金メツキ層、１４……半田、１５…
…パワートランジスタチツプ、１６，１７……ア
ルミニウム細線。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体チツプを固着する支持板およびリードを
    含むリードフレームにおいて、このリードフレー
    ムの表面のうち少なくとも前記支持板と前記リー
    ド部分の両主面のすべてがニツケルメツキ層で被
    覆されているとともに、少なくとも前記支持板の
    うち前記半導体チツプが固着される部分および前
    記リードのうちワイヤボンデイングが行われる部
    分において前記ニツケルメツキ層の上に前記ニツ
    ケルメツキ層よりも高硬度であるボロンとニツケ
    ルの合金メツキ層が形成されていることを特徴と
    する半導体装置用リードフレーム。
JP10409186U 1986-07-07 1986-07-07 Pending JPS6310565U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10409186U JPS6310565U (ja) 1986-07-07 1986-07-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10409186U JPS6310565U (ja) 1986-07-07 1986-07-07

Publications (1)

Publication Number Publication Date
JPS6310565U true JPS6310565U (ja) 1988-01-23

Family

ID=30977266

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10409186U Pending JPS6310565U (ja) 1986-07-07 1986-07-07

Country Status (1)

Country Link
JP (1) JPS6310565U (ja)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS513742U (ja) * 1974-06-25 1976-01-12
JPS5596662A (en) * 1979-01-17 1980-07-23 Toshiba Corp Electronic component member
JPS57147259A (en) * 1981-03-05 1982-09-11 Toshiba Corp Semiconductor device using lead frame
JPS57166058A (en) * 1981-04-07 1982-10-13 Hitachi Cable Ltd Lead frame for semiconductor
JPS60117761A (ja) * 1983-11-30 1985-06-25 Toshiba Corp 半導体装置用リ−ドフレ−ム
JPS6290954A (ja) * 1985-10-16 1987-04-25 Kobe Steel Ltd リ−ドフレ−ム

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS513742U (ja) * 1974-06-25 1976-01-12
JPS5596662A (en) * 1979-01-17 1980-07-23 Toshiba Corp Electronic component member
JPS57147259A (en) * 1981-03-05 1982-09-11 Toshiba Corp Semiconductor device using lead frame
JPS57166058A (en) * 1981-04-07 1982-10-13 Hitachi Cable Ltd Lead frame for semiconductor
JPS60117761A (ja) * 1983-11-30 1985-06-25 Toshiba Corp 半導体装置用リ−ドフレ−ム
JPS6290954A (ja) * 1985-10-16 1987-04-25 Kobe Steel Ltd リ−ドフレ−ム

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