JPS63102246U - - Google Patents
Info
- Publication number
- JPS63102246U JPS63102246U JP19699586U JP19699586U JPS63102246U JP S63102246 U JPS63102246 U JP S63102246U JP 19699586 U JP19699586 U JP 19699586U JP 19699586 U JP19699586 U JP 19699586U JP S63102246 U JPS63102246 U JP S63102246U
- Authority
- JP
- Japan
- Prior art keywords
- connector
- resin molded
- utility
- semiconductor device
- model registration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 1
- 238000007796 conventional method Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は、この考案の好適な第１実施例を示す
断面図である。第２図は、この考案の好適な第２
実施例を示す断面図である。第３図は、この考案
の好適な第３実施例を示す正面図である。第４図
は、第３図に示すものの矢視Ａ―Ａ線方向の断面
図である。第５図は、従来の技術を示す断面図で
ある。
１……半導体集積基板、２……端子、４……シ
ール部、６……樹脂成形部、６１……コネクタ部
。
FIG. 1 is a sectional view showing a first preferred embodiment of this invention. Figure 2 shows a second preferred embodiment of this invention.
It is a sectional view showing an example. FIG. 3 is a front view showing a third preferred embodiment of this invention. FIG. 4 is a cross-sectional view of the device shown in FIG. 3 in the direction of the arrow AA line. FIG. 5 is a sectional view showing a conventional technique. DESCRIPTION OF SYMBOLS 1... Semiconductor integrated board, 2... Terminal, 4... Seal part, 6... Resin molded part, 61... Connector part.
Claims (1)
、前記端子及び基板を一体的に埋込んで形成した
コネクタ部を有する樹脂成形部とからなることを
特徴とするコネクタ付半導体装置。 (2) 上記樹脂成形部にロツク爪を形成したこと
を特徴とする実用新案登録請求の範囲第(1)項記
載のコネクタ付半導体装置。[Claims for Utility Model Registration] (1) It is characterized by consisting of a semiconductor integrated substrate connected with external connection terminals, and a resin molded part having a connector part formed by integrally embedding the terminals and the board. Semiconductor device with connector. (2) The semiconductor device with a connector as set forth in claim (1) of the utility model registration, characterized in that a locking pawl is formed in the resin molded portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19699586U JPS63102246U (en) | 1986-12-22 | 1986-12-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19699586U JPS63102246U (en) | 1986-12-22 | 1986-12-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63102246U true JPS63102246U (en) | 1988-07-02 |
Family
ID=31156318
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19699586U Pending JPS63102246U (en) | 1986-12-22 | 1986-12-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63102246U (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11168168A (en) * | 1997-12-04 | 1999-06-22 | Fuji Electric Co Ltd | Package for semiconductor device and manufacturing method therefor |
| JP2003094479A (en) * | 2001-09-20 | 2003-04-03 | Tokai Rika Co Ltd | Semiconductor device and its manufacturing method |
| JP2006303327A (en) * | 2005-04-22 | 2006-11-02 | Denso Corp | Electronic circuit device and its manufacturing method |
| JP2009094189A (en) * | 2007-10-05 | 2009-04-30 | Tokai Rika Co Ltd | Semiconductor package with connector |
| JP2011502355A (en) * | 2007-10-30 | 2011-01-20 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Module casing and method for manufacturing module casing |
| JP2012174882A (en) * | 2011-02-22 | 2012-09-10 | Denso Corp | Semiconductor device with connector and manufacturing method therefor |
| JP2012172632A (en) * | 2011-02-23 | 2012-09-10 | Denso Corp | Glow plug control device, and method for manufacturing the same |
| JP2018148186A (en) * | 2017-03-09 | 2018-09-20 | テイ・エス テック株式会社 | Light emitting device |
| JP2018148185A (en) * | 2017-03-09 | 2018-09-20 | テイ・エス テック株式会社 | Light emitting device |
| JP2019220724A (en) * | 2019-10-02 | 2019-12-26 | テイ・エス テック株式会社 | Light-emitting device |
-
1986
- 1986-12-22 JP JP19699586U patent/JPS63102246U/ja active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11168168A (en) * | 1997-12-04 | 1999-06-22 | Fuji Electric Co Ltd | Package for semiconductor device and manufacturing method therefor |
| JP2003094479A (en) * | 2001-09-20 | 2003-04-03 | Tokai Rika Co Ltd | Semiconductor device and its manufacturing method |
| JP4620303B2 (en) * | 2001-09-20 | 2011-01-26 | 株式会社東海理化電機製作所 | Semiconductor device and manufacturing method thereof |
| JP2006303327A (en) * | 2005-04-22 | 2006-11-02 | Denso Corp | Electronic circuit device and its manufacturing method |
| JP4548199B2 (en) * | 2005-04-22 | 2010-09-22 | 株式会社デンソー | Method for manufacturing electronic circuit device |
| JP2009094189A (en) * | 2007-10-05 | 2009-04-30 | Tokai Rika Co Ltd | Semiconductor package with connector |
| JP2011502355A (en) * | 2007-10-30 | 2011-01-20 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | Module casing and method for manufacturing module casing |
| JP2012174882A (en) * | 2011-02-22 | 2012-09-10 | Denso Corp | Semiconductor device with connector and manufacturing method therefor |
| JP2012172632A (en) * | 2011-02-23 | 2012-09-10 | Denso Corp | Glow plug control device, and method for manufacturing the same |
| JP2018148186A (en) * | 2017-03-09 | 2018-09-20 | テイ・エス テック株式会社 | Light emitting device |
| JP2018148185A (en) * | 2017-03-09 | 2018-09-20 | テイ・エス テック株式会社 | Light emitting device |
| JP2019220724A (en) * | 2019-10-02 | 2019-12-26 | テイ・エス テック株式会社 | Light-emitting device |