JP2012172632A - Glow plug control device, and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a glow plug control device that covers the periphery of an insert part of a multichip module with a shaping material without fixing the module to a mold, and a method for manufacturing the same.SOLUTION: A GCU 100 includes a plate-shaped primary molding unit covered with a molding material to be filled in a cavity 27 in a mold 20 through a gate 25, and a control unit 40 which is accommodated in the primary molding unit 70 to control heat generation of a glow plug. An opposing edge part 71 opposite to the opening part 25a of the gate 25 to be opened in the cavity 27 in the primary molding unit 70 is configured to reduce the thickness thereof toward the opening part 25a. The molding material to be filled in the cavity 27 smoothly flows along the opposing edge part 71, thereby reducing resistance to be applied to the primary molding unit 70 from the molding material.

Description

  The present invention relates to a glow plug control device that controls heat generation of a glow plug, and a method for manufacturing the glow plug control device.

  Conventionally, a glow plug control device for controlling heat generation of a glow plug for improving startability of a diesel engine is known. For example, Patent Document 1 discloses a glow plug energization control device including a plurality of IC chips as a control unit that controls heat generation of a glow plug and a mold resin that accommodates the plurality of IC chips. In the glow plug energization control device disclosed in Patent Document 1, a plate-shaped multichip module made up of a plurality of IC chips and a mold resin is accommodated in a resin housing.

  On the other hand, Patent Document 2 discloses a semiconductor device with a connector including a plate-like IC package in which a semiconductor integrated substrate such as an IC chip is accommodated in a mold resin. In the semiconductor device with a connector disclosed in Patent Document 2, the periphery of the IC package containing the semiconductor integrated substrate is covered with a molding material such as epoxy resin.

JP 2010-164005 A Japanese Utility Model Publication No. 63-102246

  The inventors of the present application have conceived a configuration in which the periphery of a multichip module that accommodates a plurality of IC chips is further covered with a molding material such as a resin in a glow plug control device as disclosed in Patent Document 1. In this configuration, the multichip module is accommodated in the cavity in the mold, and the multichip module is fixed to the mold. Then, by filling the cavity in the clamped mold with the molding material through the gate, the periphery of the multichip module is covered with the molding material.

  However, in the above-described configuration and process, the molding material filled in the cavity flows in the cavity, thereby contacting a portion of the multichip module that faces the opening of the gate that opens to the cavity. Then, the molding material is temporarily stopped from flowing by the contacted portion of the multichip module. Thus, a resistance force acts on the insert portion from the molding material. Therefore, unless the multichip module is fixed to the mold, the periphery of the multichip module cannot be covered with the molding material.

  The present invention has been made in view of the above problems, and the object thereof is to cover the periphery of the insert portion with a molding material without fixing the insert portion of a multichip module or the like to a mold. To provide a glow plug control device and a method of manufacturing the glow plug control device.

  In order to achieve the above object, according to the first aspect of the present invention, there is provided a plate-like insert portion whose periphery is covered with a molding material filled in a cavity in a mold through a gate, and is accommodated in the insert portion. A glow plug control device comprising: a control unit configured to control heat generation of the glow plug by being connected to the plug, wherein an opposing edge facing the opening of the gate opening in the cavity in the insert portion is formed in the opening It is characterized by a shape in which the plate thickness decreases with increasing proximity.

  According to the present invention, the molding material filled in the cavity in the mold through the gate flows in the cavity, thereby facing the opening of the gate opening in the cavity in the plate-shaped insert portion. Touch the opposite edge. The opposing edge portion of the insert portion has a shape in which the plate thickness decreases as it approaches the opening portion of the gate. Therefore, the molding material can smoothly flow along the facing edge without being stopped by the facing edge. As described above, the resistance force acting on the insert portion from the molding material is reduced. Therefore, it is possible to provide a glow plug control device in which the periphery of the insert portion is covered with the molding material without fixing the insert portion to the mold.

  The invention according to claim 2 is characterized in that the opposing edge portion has a pair of inclined surfaces which are plane-symmetric with respect to a virtual plane along the plate surface direction of the insert portion.

  According to this invention, the molding material that flows along the opposing edge causes the resistance in the thickness direction of the insert portion to act on the opposing edge. Since the pair of inclined surfaces of the opposing edge portions are plane-symmetric with respect to a virtual plane along the plate surface direction of the insert portion, the resistance forces in the plate thickness direction generated by the molding material cancel each other. Therefore, even if the insert portion is not more reliably fixed in the thickness direction, the periphery of the insert portion is reliably covered with the molding material.

  In the invention according to claim 3, the glow plug control device is connected to the control portion inside the insert portion, and extends to the outside of the insert portion, and a holding member that holds the lead member in the cavity And the distal end portion of the opposite edge portion is positioned so as to be shifted to the holding member side from the virtual center plane passing along the plate surface direction of the insert portion and passing through the center of the insert portion in the plate thickness direction. Features.

  According to this invention, the front-end | tip part of an opposing edge part has shifted | deviated and located in the holding member side rather than the virtual center plane passing through the center of the thickness direction of an insert part. Therefore, the molding material that flows along the opposing edge causes the insert portion to exert a resistance force toward the holding member in the plate thickness direction. Due to this resistance force, the lead member extending to the outside of the insert portion is pressed toward the holding member. The lead member pressed by the resistance force of the molding material can be securely held by the holding member. Therefore, by fixing the holding member to the mold, the periphery of the insert part is reliably covered with the molding material even if the insert part is not securely fixed to the mold.

  The invention according to claim 4 is characterized in that the opposing edge is in contact with a thermoplastic resin as a molding material.

  According to this invention, the thermoplastic resin generally has a high viscosity. Therefore, when it contacts with the thermoplastic resin as a molding material, an insert part will receive resistance. However, since the flow of the molding material is smoothed by the shape of the opposing edge where the plate thickness decreases, an increase in resistance is suppressed. As described above, the action of reducing the resistance force by reducing the thickness of the opposing edge is particularly effective in the embodiment using the thermoplastic resin having a high viscosity as the molding material.

  In the invention according to claim 5, the glow plug control device further includes a strip-shaped lead member connected to the control unit inside the insert portion and extending to the outside of the insert portion, The width direction is characterized by being along a separation direction away from the opening.

  According to this invention, the width direction of the strip-shaped lead member extending to the outside of the insert portion is along the separation direction separating from the opening. When the molding material flowing in the cavity flows along the separating direction away from the opening, the width direction of the lead member follows the flow of the molding material. As described above, the resistance force acting on the lead member from the molding material is reduced. Therefore, the resistance force acting on the insert portion through the lead member connected to the control portion is reduced. Therefore, even if the lead portion is configured to extend to the outside, the insert portion is reliably covered with the molding material without being fixed to the mold.

  In the invention according to claim 6, of the pair of side portions facing the width direction of the lead member, one opposing side portion facing the separation direction has a shape in which the plate thickness decreases as the distance from the opening portion increases. It is characterized by.

  According to the present invention, the opposite side portion of the lead member that faces the separation direction has a shape in which the plate thickness decreases as the opening portion of the gate approaches. Therefore, the molding material flowing along the separation direction can smoothly flow along the opposite side portion without being stopped by the opposite side portion. As described above, the resistance force acting on the insert portion from the molding material through the lead member is reduced. Therefore, the insert portion is reliably covered with the molding material without being fixed to the mold, even if the lead member extends outside.

  According to a seventh aspect of the present invention, the glow plug control device further includes a holding member that has a restricting portion that restricts movement of the insert portion in the separating direction and holds the lead member in the cavity. To do.

  According to this invention, even if the insert portion tries to move in the separating direction away from the opening due to the action of the resistance force from the molding material, the movement of the insert portion is restricted by the restricting portion of the holding member. Therefore, by fixing the holding member to the mold, the periphery of the insert portion can be covered with the molding material even if the insert portion is not securely fixed to the mold.

  According to an eighth aspect of the present invention, there is provided a glow plug control device including an insert portion whose periphery is covered with a molding material filled through a pair of gates formed so as to face a mold, and opens into the cavity. The pair of facing edge portions that individually face each opening of the pair of gates has a shape in which the plate thickness decreases as the opening becomes closer to the corresponding opening.

  According to this invention, the flow of the molding material filled into the cavity from one of the pair of gates and the flow of the molding material filled into the cavity from the other of the pair of gates face each other. . Therefore, the molding material filled from one gate acts on the opposing edge facing the opening of the one gate, and the molding material filled from the other gate is the opening of the other gate. The resisting forces acting on the opposing opposing edges cancel each other. As described above, the periphery of the insert portion is reliably covered with the molding material even if the insert portion is not more securely fixed.

  According to the ninth aspect of the present invention, a plate-like insert portion whose periphery is covered with a molding material filled into a cavity in a mold through a gate, and a glow plug which is accommodated in the insert portion and connected to a glow plug. A glow plug control device manufacturing method comprising: a control unit that controls heat generation of a plug, wherein an opposing edge having a shape in which a thickness of the insert portion is reduced is opposed to an opening of a gate that opens in a cavity. As described above, an installation step of installing the insert portion in the cavity and a filling step of filling the molding material melted through the gate into the cavity in which the insert portion is installed in the installation step are characterized in that .

  According to the present invention, in the filling step, the molten molding material filled into the cavity through the gate contacts the insert portion formed in a plate shape. In the insert portion installed by the installation step, the opposing edge portion having a tapered shape with a reduced thickness is opposed to the opening portion of the gate. Therefore, the filled molding material contacts the taper-shaped opposing edge and can smoothly flow along the opposing edge without being stopped by the opposing edge. As described above, the resistance force acting on the insert portion from the molding material is reduced. Therefore, even if the insert portion is not fixed to the mold in the installation process, the periphery of the insert portion is covered with the molding material.

  In the installation step of the invention described in claim 10, the insert portion is installed so that the plate surface direction of the insert portion is along the separating direction away from the opening portion.

  According to this invention, the plate | board surface direction of the insert part installed in the installation process is along the separation direction spaced apart from an opening part. When the molding material flowing in the cavity flows along the separating direction away from the opening, the plate surface direction of the insert portion follows the flow of the molding material. By the above, the resistance force which acts on parts other than the opposing edge part of an insert part from a molding material is reduced. Therefore, the sum total of the resistance force which acts on an insert part is reduced reliably. Therefore, the periphery of the insert portion is reliably covered with the molding material without being fixed to the mold.

  In addition, the structure of Claims 2-8 is applicable also to the glow plug control apparatus manufactured by the manufacturing method of Claims 9 and 10.

It is a figure explaining the structure of GCU by 1st embodiment of this invention, Comprising: (a) is a top view of GCU, (b) is a front view of GCU, (c) is GCU's It is the figure seen from the connector side, (d) is a side view of GCU. It is a figure for demonstrating in detail an installation process among the processes which manufacture GCU, Comprising: (a) is a top view of the metal mold | die with which the multichip module was installed, and the IIA-IIA line cross section of (b) It is a figure, (b) is a side view of the metal mold | die with which the multichip module was installed, and is the IIB-IIB sectional view taken on the line of (a). It is a figure for demonstrating in detail a filling process among the processes which manufacture GCU. It is a figure for demonstrating in detail a mold release process among the processes which manufacture GCU. It is a figure for demonstrating the characteristic part of GCU by 2nd embodiment of this invention, Comprising: It is the enlarged view to which the area | region V of FIG.1 (b) was expanded. FIGS. 5A and 5B are views for explaining a cross-sectional shape of an extension portion of the lead member, where FIG. 5A is a cross-sectional view taken along the line VIA-VIA in FIG. 5 and FIG. It is. It is a figure which shows a filling process among the processes which manufacture GCU by 2nd embodiment of this invention. It is a figure for demonstrating the characteristic part of GCU by 3rd embodiment of this invention. FIGS. 9A and 9B are views for explaining a cross-sectional shape of an extension portion of a lead member, where FIG. 9A is a cross-sectional view taken along line IXA-IXA in FIG. 8 and FIG. 5B is a cross-sectional view taken along line IXB-IXB in FIG. It is. It is a figure which shows a filling process among the processes which manufacture GCU by 3rd embodiment of this invention. It is a figure explaining the structure of GCU by 4th embodiment of this invention, Comprising: It is a figure which shows another modification of FIG. It is a figure which shows a filling process among the processes which manufacture GCU by 4th embodiment of this invention.

  Hereinafter, a plurality of embodiments of the present invention will be described with reference to the drawings. In addition, the overlapping description may be abbreviate | omitted by attaching | subjecting the same code | symbol to the corresponding component in each embodiment. When only a part of the configuration is described in each embodiment, the configuration of the other embodiment described above can be applied to the other part of the configuration. In addition, not only combinations of configurations explicitly described in the description of each embodiment, but also the configurations of a plurality of embodiments can be partially combined even if they are not explicitly specified unless there is a problem with the combination. .

(First embodiment)
FIG. 1 shows a glow plug control unit (GCU) 100 according to a first embodiment of the present invention. The GCU 100 is connected to a plurality of glow plugs that generate heat upon application of an electric current, an engine control device that controls an internal combustion engine mounted on the vehicle, and a power source such as a battery. The GCU 100 supplies electric power supplied from a power source to each glow plug based on a control signal from the engine control device.

  Each glow plug is installed in the internal combustion engine so as to protrude into each combustion chamber formed in the internal combustion engine. The glow plug has a built-in structure that generates heat when energized by a ceramic heater or the like. When the temperature in the combustion chamber has to be raised to stabilize the combustion, for example, immediately after starting the internal combustion engine, the temperature in the combustion chamber is maintained at about 900 degrees Celsius by energizing the glow plug. Is done.

  The GCU 100 includes a multichip module 10, a terminal member 60, and a secondary molding unit 80. The multichip module 10 includes a primary molding unit 70, a control unit 40, a lead member 50, and the like.

  The primary molding part 70 is formed of a thermosetting resin such as an epoxy resin. The primary molding part 70 is exhibiting the plate shape which has a longitudinal direction. The primary molding part 70 is covered with a secondary molding part 80. The primary molding unit 70 accommodates a part of the lead member 50 and the control unit 40.

  The control unit 40 is accommodated in the primary molding unit 70. The control unit 40 is connected to the engine control device, the power source, and a plurality of glow plugs through the lead member 50, the terminal member 60, and the like. The control unit 40 includes a control IC 41 and a plurality of power ICs 42 that operate as switching elements. The control IC 41 is connected to each power IC 42 by wire bonding or the like inside the primary molding unit 70. The control IC 41 is connected to the engine control device through the lead member 50, the terminal member 60, and the like, and acquires a control signal from the engine control device. The control IC 41 controls the switching of each power IC 42 by outputting a drive signal to each power IC 42 based on the control signal.

  The power IC 42 is, for example, a metal-oxide-semiconductor field-effect transistor (MOSFET). The power IC 42 is embedded in the primary molding unit 70 according to the number of cylinders of the internal combustion engine, that is, the number of glow plugs connected to the GCU 100. The control unit 40 in the first embodiment has four power ICs 42. The gate of each power IC 42 is connected to the control IC 41. The drain of each power IC 42 is connected to a power source through the lead member 50, the terminal member 60, and the like. The source of each power IC 42 is connected to one of the plurality of glow plugs through the lead member 50, the terminal member 60, and the like. Each power IC 42 supplies electric power supplied from a power source to each glow plug based on a drive signal from the control IC 41. With the above configuration, the control unit 40 controls the heat generation of the glow plug by controlling the switching operation of each power IC 42 connected to the glow plug by the control IC 41.

  The lead member 50 is formed of a metal material having excellent conductivity such as a copper alloy. A plurality of lead members 50 are provided in the GCU 100. A part of each lead member 50 is accommodated in the primary molding unit 70, and is connected to the control unit 40 inside the primary molding unit 70. Each lead member 50 has a strip-like extension part 50 a extending from the side surface extending along the longitudinal direction of the primary molding part 70 to the outside of the primary molding part 70. Each extending portion 50a is bent at an intermediate portion in the extending direction to form a first extending portion 51 and a second extending portion 52. The first extending portion 51 is a portion extending from the side surface of the primary molding portion 70 along the plate surface direction of the primary molding portion 70. The second extending portion 52 is a portion that extends along the plate thickness direction of the primary molding portion 70 while being continuous with the first extending portion 51 due to the bending of the lead member 50. The distal end portion of the second extending portion 52 in the extending direction is bent along the plate surface direction of the primary molding portion 70 and is connected to the terminal member 60 by resistance welding or the like.

  The terminal member 60 is formed of a metal material having excellent conductivity such as a copper alloy. A plurality of terminal members 60 are provided in the GCU 100 in accordance with the number of extending portions 50 a extending to the outside of the primary molding portion 70. In each drawing, in order to make the drawing easy to see, the number of the extending portions 50a and the terminal members 60 is reduced from the actual number.

  Each terminal member 60 has a strip shape extending in one direction, and is bent at an intermediate portion to form a holding portion 61 and an electrical connection portion 65. The holding part 61 is accommodated in the secondary molding part 80. The holding portion 61 extends along the tip portion of the second extending portion 52 in the extending direction. Each holding portion 61 holds the lead member 50 by being connected to each tip portion of each second extending portion 52. The electrical connection portion 65 is exposed to the outside of the secondary molding portion 80 by extending from the holding portion 61 along the thickness direction of the primary molding portion 70.

  The secondary molding part 80 is formed of a thermoplastic resin such as a polybutylene terephthalate (PBT) resin or a polyphenylene sulfide (PPS) resin. The secondary molding part 80 has a connector part 81. The connector unit 81 is a configuration for connecting the engine control device, the power source, and the glow plug outside the GCU 100 to the control unit 40. A mating connector portion (not shown) is fitted to the connector portion 81. The connector part 81 forms a fitting space 81 a and a locking claw 82. The fitting space 81 a is a space for accommodating the mating connector portion that fits into the connector portion 81. The electrical connection portion 65 of the terminal member 60 is exposed in the fitting space 81a. By fitting the mating connector portion to the connector portion 81, the electrical connection portion 65 is electrically connected to an electrical contact provided in the mating connector portion. The locking claw 82 protrudes from a wall portion surrounding the accommodation space in a direction intersecting with the extending direction of the electrical connection portion 65. The locking claw 82 prevents the mating connector portion from detaching from the connector portion 81 by locking the mating connector portion.

(Characteristic part)
Next, the characteristic part of GCU100 is demonstrated in detail.

  The primary molding part 70 has a main body part 75 and an opposing edge part 71. The main body 75 is formed in a rectangular plate shape. The facing edge portion 71 is one of a plurality of edge portions surrounding the outer edge of the main body portion 75. The opposing edge portion 71 is formed in a tapered shape in which the plate thickness decreases toward the outer edge. When a virtual plane along the plate surface direction of the primary molding portion 70 and passing through the center of the primary molding portion 70 in the plate thickness direction is defined as the center plane CP, the opposing edge 71 is in relation to the center plane CP of the primary molding portion 70. A pair of plane-symmetric inclined surfaces 74 is provided. The inclined surface 74 has a constant rate of change indicating a change in plate thickness with respect to the longitudinal direction. A tip end portion 72 of the opposing edge portion 71 in the extending direction is located on the center plane CP. Further, the pair of corner portions 73 of the opposed edge portion 71 are chamfered. Thereby, the width | variety of the opposing edge part 71 of the primary molding part 70 is reducing, so that it goes to an outer edge.

  Next, the mold 20 used in the process of forming the secondary molding part 80 around the primary molding part 70 in the process of manufacturing the GCU 100 will be described with reference to FIG.

  The mold 20 is divided into a plurality of split molds 21, 22, 23 and the like. A gate 25 and a cavity 27 are formed in the mold 20. The gate 25 is a passage for filling the melted thermoplastic resin in the cavity 27. The cavity 27 is formed in a shape that complements the secondary molding portion 80 (see FIG. 1B). For convenience, among the molds 20 divided into three, those having the gate 25 are referred to as the split mold 21 and those mainly forming the connector portion 81 (see FIG. 1B) are the split mold 22. Other than these, the split mold 23 is used. The process of manufacturing the GCU 100 using the above mold 20 will be described in detail below with reference to FIGS.

(Installation process)
In the installation process shown in FIG. 2, the multichip module 10 is installed in the cavity 27 formed in the mold 20. Specifically, the terminal member 60 connected to the extending portion 50 a of the lead member 50 is held by the split mold 22. The multichip module 10 is installed in the cavity 27 so that the opposing edge 71 of the primary molding part 70 faces the opening 25 a of the gate 25 opening in the cavity 27. Thereby, the plate | board thickness of the opposing edge part 71 reduces, so that it approaches the opening part 25a. In addition, the multichip module 10 is installed in the cavity 27 so that the plate surface direction of the primary molding portion 70 and the width direction of the extending portion 50a of the lead member 50 are along the separating direction away from the opening 25a. .

(Clamping process)
After the multichip module 10 is installed in the cavity 27 by the installation process, the split molds 21 to 23 are closed. And each split mold 21-23 is clamped in order to prevent the leakage of the molding material from the cavity 27 by the pressure at the time of filling.

(Filling process)
In the filling step shown in FIG. 3, the melted molding material is filled into the cavity 27 of the mold 20 clamped in the mold clamping step through the gate 25 at a preset pressure. Here, the filled molding material flows along the extending direction of the gate 25 in the separating direction away from the opening 25a. Therefore, the separation direction is hereinafter referred to as a flow direction FD of the molding material. The thermoplastic resin as the molding material filled in the cavity 27 through the gate 25 comes into contact with the opposed edge portion 71 facing the opening 25 a and flows along the pair of inclined surfaces 74 of the opposed edge portion 71. Then, the molding material forms a secondary molding portion 80 surrounding the primary molding portion 70 and the like.

(Release process)
In the mold release process shown in FIG. 4, after the solidification of the molding material filled in the filling process, each of the split molds 21 to 23 is opened. Then, the GCU 100 having the molded secondary molding portion 80 is released from the cavity 27 in the mold 20.

  In the first embodiment described so far, the facing edge 71 in contact with the molding material filled in the cavity 27 has a tapered shape. Therefore, the molding material can smoothly flow along the facing edge 71 without being stopped by the facing edge 71. As described above, the resistance force acting on the primary molding portion 70 from the molding material is reduced. Therefore, the GCU 100 in which the periphery of the primary molding part 70 is covered with the molding material can be provided without fixing the multichip module 10 including the primary molding part 70 to the mold 20.

  In addition, in the first embodiment, the pair of inclined surfaces 74 of the opposing edge portion 71 are symmetrical with respect to the center plane CP of the primary molding portion 70, so that the resistance force in the plate thickness direction caused by the molding material is Offset each other.

  Moreover, in 1st embodiment, the plate | board surface direction of the primary molding part 70 installed in the metal mold | die 20 in the installation process is along the flow direction FD of the molding material which flows through the inside of the cavity 27. FIG. Therefore, the resistance force that acts on the main body 75 of the primary molding portion 70 from the molding material that flows along the opposing edge portion 71 is reduced. In addition, the width direction of the extending portion 50 a of the lead member 50 is also along the flow direction FD of the molding material flowing in the cavity 27. Therefore, the resistance force which acts on the primary molding part 70 from the molding material through the extension part 50a is reduced.

  Furthermore, in the first embodiment, the molding material can smoothly wrap around the side surface in the longitudinal direction of the primary molding portion 70 along the chamfered corner portion 73 of the opposed edge portion 71. Therefore, the resistance force which acts on the primary molding part 70 from a molding material is further reduced.

  By these, the sum total of the resistance force which acts on the primary shaping | molding part 70 is reduced reliably. Therefore, even if the multichip module 10 including the primary molding part 70 is not more securely fixed to the mold 20, the periphery of the primary molding part 70 is reliably covered with the molding material.

  In addition, in the first embodiment, the thermoplastic resin as the molding material filled in the cavity 27 generally has a higher viscosity than the thermosetting resin. Therefore, when it contacts with the thermoplastic resin as a molding material, the primary molding part 70 will receive resistance. However, since the flow of the molding material is smoothed by the shape of the opposed edge 71 where the plate thickness decreases, an increase in resistance is suppressed. Thus, the action of reducing the resistance force by reducing the thickness of the opposing edge 71 is particularly effective in a form using a thermoplastic resin having a high viscosity as the molding material.

  In addition, thermoplastic resins are generally superior in toughness as compared to thermosetting resins. Since the GCU is installed in the vicinity of the internal combustion engine, the GCU is subjected to great use environment stress such as severe temperature change, vibration, and collision with, for example, pebbles. By forming the secondary molded part 80 from a thermoplastic resin, the secondary molded part 80 is unlikely to be damaged even under such usage environment stress. Therefore, the reliability of the GCU 100 can be dramatically improved.

  In the first embodiment, the terminal member 60 corresponds to the “holding member” in the claims, the primary molding portion 70 corresponds to the “insert portion” in the claims, and the GCU 100 corresponds to the claims. It corresponds to a “glow plug control device”.

(Second embodiment)
The second embodiment of the present invention shown in FIGS. 5 to 7 is a modification of the first embodiment. The GCU 200 according to the second embodiment includes a multichip module 210 corresponding to the multichip module 10 (see FIG. 1A) of the first embodiment. Further, the mold 220 used in the process of manufacturing the GCU 200 is different from the mold 20 (see FIG. 2) of the first embodiment. Hereinafter, the manufacturing method of GCU200 by 2nd embodiment is demonstrated in detail.

  As shown in FIG. 7, the primary molding part 270 of the multichip module 210 has a pair of opposing edge parts 271a and 271b. The pair of opposing edge portions 271 a and 271 b are both edge portions in the longitudinal direction of the primary molding portion 270. Each of the opposing edge portions 271a and 271b is formed in a tapered shape in which the plate thickness decreases toward the outer edge. Each of the opposing edge portions 271a and 271b has substantially the same shape as the opposing edge portion 71 (see FIG. 1D) of the first embodiment, and is formed on the central plane CP in the plate thickness direction of the primary molding portion 270. On the other hand, it is plane-symmetric and the corners 273a and 273b are chamfered.

  As shown in FIGS. 5 and 6, the lead member 250 of the multichip module 210 has an extending portion 250 a corresponding to the extending portion 50 a (see FIG. 1A) of the first embodiment. . Each extending portion 250a is substantially the same as the first extending portion 51 and the second extending portion 52 (see FIG. 1B) of the first embodiment, and the first extending portion 251 and the second extending portion 252 are the same. Is forming. The first extending portion 251 is a portion extending from the side surface of the primary molding portion 270 along the plate surface direction of the primary molding portion 270. The second extending portion 252 is a portion that extends along the plate thickness direction of the primary molding portion 270 while being continuous with the first extending portion 251 due to the bending of the lead member 250. A pair of opposing side portions 252a and 252b along the extending direction of the extending portion 250a, and the opposing side portions 252a and 252b extending from the first extending portion 251 to the second extending portion 252 are formed on the outer edge. It is formed in the taper shape which plate | board thickness reduces, so that it goes. Assuming that a virtual plane passing through the center of the first extending portion 251 and the second extending portion 252 along the plate surface direction and passing through the center of the first extending portion 251 and the second extending portion 252 in the plate thickness direction is the center plane CP1, each opposing side portion 252a and 252b are plane-symmetric shapes with respect to the center plane CP1.

  As shown in FIG. 7, the mold 220 used in the process of manufacturing the GCU 200 according to the second embodiment corresponds to the split mold 21 and the split mold 22, and the split mold 23 of the first embodiment (see FIG. 2). Split mold 223. The split mold 223 has a gate 226 for filling the cavity 27 with a molten molding material. The gate 226 faces the gate 25 formed in the split mold 21.

  The process of manufacturing the GCU 200 using the above mold 220 will be described in detail with reference to FIGS. In addition, description is abbreviate | omitted about the clamping process and mold release process which are substantially the same as the manufacturing method of 1st embodiment.

(Installation process)
In the installation process, the multichip module 210 is installed in the cavity 27 so that one opposing edge 271 a of the primary molding part 270 faces the opening 25 a of the gate 25 opening in the cavity 27. By installing the multichip module 210, the other facing edge 271 b of the primary molding portion 270 faces the opening 226 a of the gate 226 that opens to the cavity 27. As described above, the plate thickness of the pair of facing edge portions 271a and 271b that individually face the pair of opening portions 25a and 226a decreases as the distance from the corresponding opening portions 25a and 226a increases.

  In addition, the molding material filled in the cavity 27 from the opening 25a flows in the separating direction away from the opening 25a along the extending direction of the gate 25. Therefore, the separation direction away from the opening 25a is the flow direction FD1 of the molding material. On the other hand, the molding material filled in the cavity 27 from the opening 226a flows in the separating direction away from the opening 226a along the extending direction of the gate 226. Therefore, the separation direction away from the opening 226a is the flow direction FD2 of the molding material. The multichip module 210 is installed in the cavity 27 so that the plate surface direction of the primary molding part 270 and the width direction of the extension part 250a are along the flow directions FD1 and FD2. As a result, the plate thickness of the pair of opposed side portions 252a and 252b decreases as the distance from the corresponding opening portions 25a and 226a becomes closer.

(Filling process)
In the filling process, the melted molding material is filled into the cavity 27 of the mold 220 clamped in the mold clamping process through the gate 25 and the gate 226 at a preset pressure. The molding material filled in the cavity 27 through the gate 25 comes into contact with the opposing edge 271a facing the opening 25a and flows along the opposing edge 271a. Further, the molding material filled in the cavity 27 through the gate 226 comes into contact with the facing edge 271b facing the opening 226a and flows along the facing edge 271b. Then, the molding material forms a secondary molding portion 80 surrounding the primary molding portion 270 and the like. After the above filling process, the GCU 200 is manufactured through a mold release process.

  In the second embodiment described so far, the molding material filled into the cavity 27 through the gate 25 can smoothly flow along the opposing edge 271a without being stopped by the opposing edge 271a. In addition, the molding material filled in the cavity 27 through the gate 226 can smoothly flow along the opposing edge 271b without being stopped by the opposing edge 271b. As described above, even if the pair of gates 25 and 226 facing each other is formed on the mold 220, the resistance force that acts on the primary molding portion 270 from the molding material is reduced. Therefore, it is possible to provide the GCU 200 in which the periphery of the primary molding unit 270 is covered with the molding material without fixing the multichip module 210 including the primary molding unit 270 to the mold 220.

  In addition, in the second embodiment, the flow direction FD1 of the molding material filled into the cavity 27 from the gate 25 and the flow direction FD2 of the molding material filled into the cavity 27 from the gate 226 face each other. Therefore, the resistance force that the molding material filled from the gate 25 acts on the opposite edge portion 271a and the resistance force that the molding material filled from the gate 226 acts on the opposite edge portion 271b cancel each other.

  In the second embodiment, the opposing side portions 252a and 252b of the lead member 250 have a shape in which the plate thickness decreases as the opening portions 25a and 226a of the gates 25 and 226 become closer to each other. Therefore, the molding material can smoothly flow along the facing side portions 252a and 252b without being stopped by the facing side portions 252a and 252b. As described above, the resistance force acting on the primary molding portion 270 from the molding material through the lead member 250 is reduced.

  By these, the sum total of the resistance force which acts on the primary shaping | molding part 270 is reduced reliably. Therefore, even if the multi-chip module 210 including the primary molding part 270 is not more securely fixed to the mold 220, the periphery of the primary molding part 270 is reliably covered with the molding material.

  In the second embodiment, the primary molding portion 270 corresponds to an “insert portion” in the claims, and the GCU 200 corresponds to a “glow plug control device” in the claims.

(Third embodiment)
The third embodiment of the present invention shown in FIGS. 8 to 10 is a modification of the second embodiment. The GCU 300 according to the third embodiment includes a multi-chip module 310 corresponding to the multi-chip module 210 (see FIG. 5) of the second embodiment. Hereinafter, the GCU 300 according to the third embodiment will be described in detail.

  The primary molding part 370 of the multichip module 310 has a pair of opposing edge parts 371a and 371b. The pair of opposing edge portions 371 a and 371 b are both edges in the longitudinal direction of the primary molding portion 370. Each of the opposing edge portions 371a and 371b is formed in a tapered shape in which the plate thickness decreases toward the outer edge. The front end portions 372a and 372b of the opposing edge portions 371a and 371b are located on the terminal member 60 side with respect to the center surface CP of the primary molding portion 370. Further, the corner portions 373a and 373b of the facing edge portions 371a and 371b are chamfered.

  The lead member 350 of the multichip module 310 has an extending portion 350a corresponding to the extending portion 250a (see FIG. 5) of the second embodiment. The shape of the cross section orthogonal to the extending direction of the extending part 350a is a trapezoidal shape. The width of the first extending portion 351 of the extending portion 350 a is narrowed as the distance from the terminal member 60 increases. The width of the second extending portion 352 of the extending portion 350a is narrower as it is separated from the primary molding portion 370. As described above, the plate thickness of the pair of opposed side portions 352a and 352b of the extending portion 350a decreases toward the outer edge.

  As in the third embodiment described so far, even if the tip portions 372a and 372b of the opposing edge portions 371a and 371b are shifted from the center plane CP, the molding material is used for the opposing edge portions 371a. , 371b can flow smoothly. Therefore, the flow of the molding material is not stopped by the opposed edge portions 371a and 371b. As described above, the resistance force acting on the primary molding portion 370 from the molding material is reduced. Therefore, it is possible to provide the GCU 300 in which the periphery of the primary molding unit 370 is covered with the molding material without fixing the multichip module 310 including the primary molding unit 370 to the mold 220.

  In addition, in 3rd embodiment, each front-end | tip part 372a, 372b is shifted | deviated and located in the terminal member 60 side rather than center plane CP. Therefore, the molding material that flows along the opposing edge portions 371a and 371b causes the primary molding portion 370 to act on the primary molding portion 370 in the plate thickness direction toward the terminal member 60 side. Thereby, the extending part 350 a extending from the primary molding part 370 is pressed toward the terminal member 60.

  Further, the molding material that flows along the first extending portion 351 of the extending portion 350 a causes the resistance force RF <b> 11 toward the terminal member 60 side to act on the lead member 350. The extension part 350 a is pressed toward the terminal member 60 by the resistance force RF <b> 11. Further, the resistance force RF12 acting from the molding material on the second extending portion 352 of the extending portion 350a cancels each other by the arrangement of the extending portions 350a arranged in two rows in the longitudinal direction of the primary molding portion 370. Therefore, the holding of the extending part 350a to the terminal member 60 is not hindered by the resistance force RF12 acting on the second extending portion 352.

  The extension portion 350 a pressed by the resistance force RF and the resistance force RF <b> 11 can be securely held by the terminal member 60. Therefore, by fixing the terminal member 60 to the split mold 22, the periphery of the primary molding portion 370 is reliably covered with the molding material even if the multichip module 310 is not securely fixed to the mold 220. .

  In the third embodiment, the primary molding portion 370 corresponds to an “insert portion” in the claims, and the GCU 300 corresponds to a “glow plug control device” in the claims.

(Fourth embodiment)
The fourth embodiment of the present invention shown in FIGS. 11 and 12 is another modification of the first embodiment. In GCU400 by 4th embodiment, the shape of some terminal members 460 differs from terminal member 60 (refer to Drawing 1 (b)) of a 1st embodiment. Hereinafter, the GCU 400 according to the fourth embodiment will be described in detail.

  As shown in FIG. 11, the pair of terminal members 460 are a part of the plurality of terminal members arranged along the longitudinal direction of the primary molding portion 70. The pair of terminal members 460 are located farthest from the opposing edge 71 among the plurality of terminal members. Each terminal member 460 includes a restricting portion 463 in addition to the holding portion 61 and the electrical connecting portion 65.

  The restricting portion 463 branches off from between the holding portion 61 and the electrical connecting portion 65 in the terminal member 460. The restricting portion 463 extends once in the direction away from the facing edge portion 71 along the longitudinal direction of the primary molding portion 70. The restricting portion 463 is bent along the plate thickness direction of the primary molding portion 70 at the intermediate portion. The leading end portion of the restricting portion 463 extends toward the contact edge portion 476 located on the opposite side of the opposing edge portion 71 in the longitudinal direction of the primary molding portion 70. The restricting portion 463 restricts the movement of the primary molding portion 70 in the direction from the facing edge portion 71 toward the contact edge portion 476 by bringing the tip portion into contact with the contact edge portion 476.

  In the filling process of the fourth embodiment described so far, the molding material filled in the cavity 27 through the gate 25 comes into contact with the facing edge 71 facing the opening 25 a and flows along the facing edge 71. To do. At this time, the primary molding part 70 tends to move in the direction away from the opening 25a and in the direction from the facing edge 71 toward the contact edge 476 by the action of the resistance force from the molding material. However, the primary molding portion 70 is restricted from moving in the separation direction by the restriction portion 463 of the terminal member 460 fixed to the split mold 22. Therefore, even if the primary molding part 70 is not securely fixed to the mold 20, the periphery of the primary molding part 70 is reliably covered with the molding material.

  In the fourth embodiment, the terminal member 460 corresponds to the “holding member” in the claims, and the GCU 400 corresponds to the “glow plug control device” in the claims.

(Other embodiments)
Although a plurality of embodiments according to the present invention have been described above, the present invention is not construed as being limited to the above embodiments, and can be applied to various embodiments and combinations without departing from the gist of the present invention. can do.

  In the above embodiment, the rate of change in the plate thickness direction with respect to the longitudinal direction is constant for the pair of inclined surfaces of the opposing edge portions. However, the change rate of the inclination of the inclined surface may not be constant. For example, the rate of change in the plate thickness direction with respect to the longitudinal direction may be increased toward the outer edge of the opposing edge. Alternatively, the rate of change in the plate thickness direction with respect to the longitudinal direction may become smaller toward the outer edge of the opposing edge.

  In the first embodiment and the like, the tip portion of the opposing edge portion is located on the virtual center plane of the primary molding portion. Moreover, in the said 3rd embodiment, the front-end | tip part of the opposing edge part has shifted | deviated and located in the terminal member side with respect to the virtual center plane. However, the position of the opposing edge may be shifted to the opposite side of the terminal member with respect to the virtual center plane.

  In the said embodiment, the plate | board surface direction of the primary molding part was along the flow direction of the molding material which flows through the inside of a cavity. Further, the width direction of the extending portion of the lead member was along the flow direction of the molding material flowing in the cavity. However, the plate surface direction and the width direction may not be along the flow direction of the molding material.

  In the said embodiment, the primary molding part was formed with the thermosetting resin. Moreover, the secondary molding part was formed with the thermoplastic resin. However, for example, the primary molded part may be formed of a thermoplastic resin. Or the secondary molding part may be formed with the thermosetting resin. Furthermore, resin materials other than those exemplified in the above embodiment as the thermosetting resin and the thermoplastic resin may be appropriately used as the molding material for the primary molding part and the secondary molding part.

RF, RF11, RF12 Resistance force FD, FD1, FD2 Flow direction CP Virtual center plane CP1 of primary molding part Virtual center planes 10, 210, 310 of extended parts Multichip modules 20, 220 Molds 21, 22, 23, 223 Split mold 25, 226 Gate 25a, 226a Opening 27 Cavity 40 Control unit 41 Control IC
42 Power IC
50, 250, 350 Lead members 50a, 250a, 350a Extension parts 51, 251 and 351 First extension parts 52, 252 and 352 Second extension parts 252a, 252b, 352a and 352b Opposite side parts 60 and 460 Terminal member (holding) Element)
61 Holding part 463 Restriction part 65 Electrical connection part 70,270,370 Primary molding part (insert part)
71, 271a, 271b, 371a, 371b Opposing edge portions 72, 372a, 372b Tip portions 73, 273a, 273b, 373a, 373b Corner portion 74 Inclined surface 75 Body portion 476 Contact edge portion 80 Secondary molding portion 81 Connector portion 81a Fitting space 82 Locking claw 100, 200, 300, 400 GCU (glow plug control device)

Claims (10)

A plate-like insert portion whose periphery is covered with a molding material filled into a cavity in a mold through a gate, and a control for controlling heat generation of the glow plug by being accommodated in the insert portion and connected to the glow plug. A glow plug control device comprising:
The glow plug control device according to claim 1, wherein an opposing edge portion of the insert portion that faces the opening portion of the gate that opens into the cavity has a shape in which a plate thickness decreases as the opening portion approaches the opening portion.   2. The glow plug control device according to claim 1, wherein the opposed edge portion has a pair of inclined surfaces that are plane-symmetric with respect to a virtual plane along the plate surface direction of the insert portion. A lead member connected to the control portion inside the insert portion and extending to the outside of the insert portion;
A holding member for holding the lead member in the cavity,
The tip portion of the opposing edge is positioned so as to be shifted to the holding member side from a virtual center plane that passes along the plate surface direction of the insert portion and passes through the center of the insert portion in the plate thickness direction. The glow plug control device according to claim 1.   The glow plug control device according to any one of claims 1 to 3, wherein the opposed edge portion is in contact with a thermoplastic resin as the molding material. A strip-shaped lead member connected to the control unit inside the insert part and extending to the outside of the insert part;
The glow plug control device according to any one of claims 1 to 4, wherein a width direction of the lead member is along a separation direction that is separated from the opening.   The pair of side portions facing the width direction of the lead member, wherein one opposing side portion facing the separation direction has a shape in which the plate thickness decreases as the distance from the opening portion increases. 5. The glow plug control device according to 5.   The glow plug according to claim 5, further comprising a holding member that has a restricting portion that restricts movement of the insert portion in the separation direction and holds the lead member in the cavity. Control device. A glow plug control device comprising the insert part surrounded by the molding material filled through a pair of the gates formed to face the mold,
The pair of facing edge portions individually facing each opening portion of the pair of gates opening in the cavity have a shape in which a plate thickness decreases as the opening portion approaches the corresponding opening portion. The glow plug control device according to any one of 1 to 7. A plate-like insert portion whose periphery is covered with a molding material filled into a cavity in a mold through a gate, and a control for controlling heat generation of the glow plug by being accommodated in the insert portion and connected to the glow plug. And a method of manufacturing a glow plug control device comprising:
An installation step of installing the insert portion in the cavity such that an opposing edge having a shape in which the plate thickness decreases in the insert portion is opposed to an opening portion of the gate opening in the cavity;
In the installation step, a filling step of filling the molding material melted through the gate into the cavity in which the insert portion is installed;
A method for manufacturing a glow plug control device comprising:   10. The method for manufacturing a glow plug control device according to claim 9, wherein, in the installation step, the insert part is installed so that a plate surface direction of the insert part is along a separation direction away from the opening part. .

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