JPS63102242U - - Google Patents

Info

Publication number
JPS63102242U
JPS63102242U JP20267186U JP20267186U JPS63102242U JP S63102242 U JPS63102242 U JP S63102242U JP 20267186 U JP20267186 U JP 20267186U JP 20267186 U JP20267186 U JP 20267186U JP S63102242 U JPS63102242 U JP S63102242U
Authority
JP
Japan
Prior art keywords
semiconductor package
cap sealing
side wall
sealing part
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20267186U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP20267186U priority Critical patent/JPS63102242U/ja
Publication of JPS63102242U publication Critical patent/JPS63102242U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H01L2924/15155—Shape the die mounting substrate comprising a recess for hosting the device the shape of the recess being other than a cuboid
    • H01L2924/15157—Top view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の半導体パツケージの縦断面図
である。第２図は従来の半導体パツケージの縦断
面図である。第３図は従来の半導体パツケージに
おいて、ボンデイング用ツールの動作範囲を広げ
る為に、キヤツプ封止部内部側壁の厚さを薄くし
た時の半導体パツケージの縦断面図である。第４
図は本考案の半導体パツケージの第２実施例の縦
断面図である。 １……半導体チツプ、２……半導体パツケージ
、３……内部リード、４……キヤツプ封止部内部
側壁、５……キヤツプ封止部。

Claims (1)

    【実用新案登録請求の範囲】
  1. 内部にボンデイング用リードを持つ半導体パツ
    ケージにおいて、内部リード形成面に接して形成
    されているキヤツプ封止部内部側壁に傾斜面を設
    けたことを特徴とする半導体パツケージ。
JP20267186U 1986-12-23 1986-12-23 Pending JPS63102242U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20267186U JPS63102242U (ja) 1986-12-23 1986-12-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20267186U JPS63102242U (ja) 1986-12-23 1986-12-23

Publications (1)

Publication Number Publication Date
JPS63102242U true JPS63102242U (ja) 1988-07-02

Family

ID=31167276

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20267186U Pending JPS63102242U (ja) 1986-12-23 1986-12-23

Country Status (1)

Country Link
JP (1) JPS63102242U (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62224036A (ja) * 1986-03-26 1987-10-02 Hitachi Tokyo Electron Co Ltd 半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62224036A (ja) * 1986-03-26 1987-10-02 Hitachi Tokyo Electron Co Ltd 半導体装置

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