JPS6294846U - - Google Patents
Info
- Publication number
- JPS6294846U JPS6294846U JP18604885U JP18604885U JPS6294846U JP S6294846 U JPS6294846 U JP S6294846U JP 18604885 U JP18604885 U JP 18604885U JP 18604885 U JP18604885 U JP 18604885U JP S6294846 U JPS6294846 U JP S6294846U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- gel
- bonding wire
- driving element
- wiring portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims description 2
- 239000011241 protective layer Substances 0.000 claims description 2
- 238000001746 injection moulding Methods 0.000 claims 1
Landscapes
- Electronic Switches (AREA)
Description
第１図、第２図及び第３図は本考案のサーマル
プリントヘツドのそれぞれ異なる実施例の要部断
面図、第４図は従来のサーマルプリントヘツドの
要部断面図である。
２，１２，２２，３２…基板、３，１３，２３
，３３…発熱抵抗体、４１，４２，４３，１４１
，１４２，１４３，２４１，２４２，２４３，３
４１，３４２，３４３…配線部、５，１５，２５
，３５…駆動素子、６１，６２，１６１，１６２
，２６１，２６２，３６１，３６２…ボンデイン
グワイヤ、７，１７，２７，３７…ゲル状樹脂層
、１８，２８，３８…保護層。
1, 2, and 3 are sectional views of main parts of different embodiments of the thermal print head of the present invention, and FIG. 4 is a sectional view of main parts of a conventional thermal print head. 2, 12, 22, 32...Substrate, 3, 13, 23
, 33...heating resistor, 4 1 , 4 2 , 4 3 , 14 1
,14 2 ,14 3 ,24 1 ,24 2 ,24 3 ,3
4 1 , 34 2 , 34 3 ... Wiring section, 5, 15, 25
, 35...drive element, 6 1 , 6 2 , 16 1 , 16 2
, 26 1 , 26 2 , 36 1 , 36 2 ... bonding wire, 7, 17, 27, 37 ... gel-like resin layer, 18, 28, 38 ... protective layer.
Claims (1)
び配線部と、前記基板上に載置され、前記配線部
とボンデイングワイヤにより接続された駆動素子
と、この駆動素子及びボンデイングワイヤを保護
するゲル状樹脂層とを具備するサーマルプリント
ヘツドにおいて、前記ゲル状樹脂を覆うようにト
ランスフアモールドにて射出注形してなる保護層
が設けられてなることを特徴とするサーマルプリ
ントヘツド。 A substrate, a heating resistor and wiring portion formed on the substrate, a driving element placed on the substrate and connected to the wiring portion by a bonding wire, and a gel protecting the driving element and the bonding wire. 1. A thermal print head comprising a gel-like resin layer, further comprising a protective layer formed by injection molding using a transfer mold so as to cover the gel-like resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18604885U JPS6294846U (en) | 1985-12-04 | 1985-12-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18604885U JPS6294846U (en) | 1985-12-04 | 1985-12-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6294846U true JPS6294846U (en) | 1987-06-17 |
Family
ID=31135249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18604885U Pending JPS6294846U (en) | 1985-12-04 | 1985-12-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6294846U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024004658A1 (en) * | 2022-06-30 | 2024-01-04 | ローム株式会社 | Thermal printhead, thermal printer, and method for producing thermal printhead |
-
1985
- 1985-12-04 JP JP18604885U patent/JPS6294846U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024004658A1 (en) * | 2022-06-30 | 2024-01-04 | ローム株式会社 | Thermal printhead, thermal printer, and method for producing thermal printhead |