JPS61183649U - - Google Patents
Info
- Publication number
- JPS61183649U JPS61183649U JP6806185U JP6806185U JPS61183649U JP S61183649 U JPS61183649 U JP S61183649U JP 6806185 U JP6806185 U JP 6806185U JP 6806185 U JP6806185 U JP 6806185U JP S61183649 U JPS61183649 U JP S61183649U
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- thin film
- heat sink
- recording head
- thermosensitive recording
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 239000010409 thin film Substances 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第１図は本考案によるセラミツク基板の接合部
の断面図、第２図は薄膜感熱記録ヘツドのセラミ
ツク基板の接合部の平面図、第３図は第２図の断
面図である。
１……ヒートシンク、２，３……セラミツク基
板、４……配線電極、５……発熱抵抗体、６……
グレーズ部、７……アルミナ部。
FIG. 1 is a cross-sectional view of a bonded portion of a ceramic substrate according to the present invention, FIG. 2 is a plan view of a bonded portion of a ceramic substrate of a thin film thermosensitive recording head, and FIG. 3 is a cross-sectional view of FIG. 2. 1...Heat sink, 2, 3...Ceramic substrate, 4...Wiring electrode, 5...Heating resistor, 6...
Glaze part, 7...Alumina part.
Claims (1)
着してなる薄膜感熱記録ヘツドにおいて、前記複
数個のセラミツク基板の接合部を２つの傾斜面の
接点による突出部を接合部としてヒートシンク上
で当接せしめるようにしたことを特徴とする薄膜
感熱記録ヘツド。 In a thin film thermosensitive recording head formed by bonding a plurality of ceramic substrates onto a heat sink, the bonding portions of the plurality of ceramic substrates are brought into contact with each other on the heat sink using a protruding portion formed by a contact point of two inclined surfaces as a bonding portion. A thin film thermosensitive recording head characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6806185U JPS61183649U (en) | 1985-05-10 | 1985-05-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6806185U JPS61183649U (en) | 1985-05-10 | 1985-05-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61183649U true JPS61183649U (en) | 1986-11-15 |
Family
ID=30602464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6806185U Pending JPS61183649U (en) | 1985-05-10 | 1985-05-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61183649U (en) |
-
1985
- 1985-05-10 JP JP6806185U patent/JPS61183649U/ja active Pending