JPS629248B2 - - Google Patents

Info

Publication number
JPS629248B2
JPS629248B2 JP55074209A JP7420980A JPS629248B2 JP S629248 B2 JPS629248 B2 JP S629248B2 JP 55074209 A JP55074209 A JP 55074209A JP 7420980 A JP7420980 A JP 7420980A JP S629248 B2 JPS629248 B2 JP S629248B2
Authority
JP
Japan
Prior art keywords
epoxy
butadiene
cured product
resin composition
equivalent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55074209A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57120A (en
Inventor
Shunichi Numata
Masanori Segawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7420980A priority Critical patent/JPS57120A/ja
Publication of JPS57120A publication Critical patent/JPS57120A/ja
Publication of JPS629248B2 publication Critical patent/JPS629248B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Organic Insulating Materials (AREA)
JP7420980A 1980-06-04 1980-06-04 Curable resin composition Granted JPS57120A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7420980A JPS57120A (en) 1980-06-04 1980-06-04 Curable resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7420980A JPS57120A (en) 1980-06-04 1980-06-04 Curable resin composition

Publications (2)

Publication Number Publication Date
JPS57120A JPS57120A (en) 1982-01-05
JPS629248B2 true JPS629248B2 (cg-RX-API-DMAC7.html) 1987-02-27

Family

ID=13540564

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7420980A Granted JPS57120A (en) 1980-06-04 1980-06-04 Curable resin composition

Country Status (1)

Country Link
JP (1) JPS57120A (cg-RX-API-DMAC7.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5959719A (ja) * 1982-09-30 1984-04-05 Osaka Gas Co Ltd 導管の内面ライニング用樹脂組成物
JPS6162512A (ja) * 1984-09-05 1986-03-31 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物
JPS6162514A (ja) * 1984-09-05 1986-03-31 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物
JPS63150320A (ja) * 1986-12-12 1988-06-23 Sanyu Kogyo Kk エポキシ樹脂組成物
EP0658603A3 (en) * 1993-12-13 1997-11-19 Daicel Chemical Industries, Ltd. A compatible blend containing an epoxy-modified block copolymer, a process, a thermoplastic resin composition, resin compositions and an asphalt composition containing an epoxy-modified block copolymer
JP3785749B2 (ja) * 1997-04-17 2006-06-14 味の素株式会社 エポキシ樹脂組成物並びに該組成物を用いた多層プリント配線板の製造法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54120642A (en) * 1978-03-13 1979-09-19 Nippon Soda Co Ltd Cathode-deposition-type electrocoating composition

Also Published As

Publication number Publication date
JPS57120A (en) 1982-01-05

Similar Documents

Publication Publication Date Title
US5789482A (en) Epoxy resin with anhydride, toughener and active hydrogen-containing compound
CA2039404C (en) Modified epoxy resins
CN102884100B (zh) 包括作为增韧剂的聚(环氧丙烷)多元醇的环氧树脂组合物
CN1065259C (zh) 用于封闭电子元件的环氧树脂模制材料及用其封闭的半导体装置
CN110218414B (zh) 一种环氧树脂组合物及其制备方法和应用
KR100253771B1 (ko) 에폭시 수지 경화제의 저장 안정한 현탁액
CA2010649A1 (en) Tough epoxy casting resins
JP3695521B2 (ja) 液状エポキシ樹脂組成物及び半導体装置
JPS629248B2 (cg-RX-API-DMAC7.html)
JPS6360069B2 (cg-RX-API-DMAC7.html)
JPS62290720A (ja) 電子部品封止用エポキシ樹脂成形材料
JP2012188611A (ja) エポキシ樹脂組成物
JPS6136854B2 (cg-RX-API-DMAC7.html)
JPH0723423B2 (ja) 硬化性樹脂組成物
JPH0315655B2 (cg-RX-API-DMAC7.html)
JP2004244441A (ja) 熱硬化性樹脂組成物
JP4435342B2 (ja) エポキシ樹脂組成物及び半導体封止用エポキシ樹脂組成物
JPH06128360A (ja) 液状エポキシ樹脂組成物
JP2708225B2 (ja) エポキシ樹脂の硬化法
JPS6159328B2 (cg-RX-API-DMAC7.html)
JPH08295721A (ja) 潜伏性触媒及び該触媒を配合してなる熱硬化性樹脂組成物
JPH01272620A (ja) 電子部品封止用エポキシ樹脂成形材料
JPH0573126B2 (cg-RX-API-DMAC7.html)
JPH04328117A (ja) 半導体封止用エポキシ樹脂組成物
JPH0124167B2 (cg-RX-API-DMAC7.html)