JPS629223B2 - - Google Patents
Info
- Publication number
- JPS629223B2 JPS629223B2 JP56006863A JP686381A JPS629223B2 JP S629223 B2 JPS629223 B2 JP S629223B2 JP 56006863 A JP56006863 A JP 56006863A JP 686381 A JP686381 A JP 686381A JP S629223 B2 JPS629223 B2 JP S629223B2
- Authority
- JP
- Japan
- Prior art keywords
- external connection
- connection pads
- leads
- wiring board
- row
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 15
- 239000012212 insulator Substances 0.000 description 4
- 230000010354 integration Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56006863A JPS57120360A (en) | 1981-01-19 | 1981-01-19 | Lead structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56006863A JPS57120360A (en) | 1981-01-19 | 1981-01-19 | Lead structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57120360A JPS57120360A (en) | 1982-07-27 |
| JPS629223B2 true JPS629223B2 (enrdf_load_stackoverflow) | 1987-02-27 |
Family
ID=11650074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56006863A Granted JPS57120360A (en) | 1981-01-19 | 1981-01-19 | Lead structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57120360A (enrdf_load_stackoverflow) |
-
1981
- 1981-01-19 JP JP56006863A patent/JPS57120360A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57120360A (en) | 1982-07-27 |
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