JPS6291443U - - Google Patents
Info
- Publication number
- JPS6291443U JPS6291443U JP1985182883U JP18288385U JPS6291443U JP S6291443 U JPS6291443 U JP S6291443U JP 1985182883 U JP1985182883 U JP 1985182883U JP 18288385 U JP18288385 U JP 18288385U JP S6291443 U JPS6291443 U JP S6291443U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- sealing resin
- semiconductor device
- recess
- back surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 9
- 230000001681 protective effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985182883U JPH0412676Y2 (US20020095090A1-20020718-M00002.png) | 1985-11-29 | 1985-11-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985182883U JPH0412676Y2 (US20020095090A1-20020718-M00002.png) | 1985-11-29 | 1985-11-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6291443U true JPS6291443U (US20020095090A1-20020718-M00002.png) | 1987-06-11 |
| JPH0412676Y2 JPH0412676Y2 (US20020095090A1-20020718-M00002.png) | 1992-03-26 |
Family
ID=31129097
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985182883U Expired JPH0412676Y2 (US20020095090A1-20020718-M00002.png) | 1985-11-29 | 1985-11-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0412676Y2 (US20020095090A1-20020718-M00002.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019225521A1 (ja) * | 2018-05-25 | 2019-11-28 | Koa株式会社 | 抵抗器 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56129747U (US20020095090A1-20020718-M00002.png) * | 1980-02-28 | 1981-10-02 | ||
| JPS59112951U (ja) * | 1983-01-20 | 1984-07-30 | サンケン電気株式会社 | 絶縁物封止半導体装置 |
-
1985
- 1985-11-29 JP JP1985182883U patent/JPH0412676Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56129747U (US20020095090A1-20020718-M00002.png) * | 1980-02-28 | 1981-10-02 | ||
| JPS59112951U (ja) * | 1983-01-20 | 1984-07-30 | サンケン電気株式会社 | 絶縁物封止半導体装置 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019225521A1 (ja) * | 2018-05-25 | 2019-11-28 | Koa株式会社 | 抵抗器 |
| JP2019204935A (ja) * | 2018-05-25 | 2019-11-28 | Koa株式会社 | 抵抗器 |
| CN112154523A (zh) * | 2018-05-25 | 2020-12-29 | 兴亚株式会社 | 电阻器 |
| US11244774B2 (en) | 2018-05-25 | 2022-02-08 | Koa Corporation | Resistor |
| CN112154523B (zh) * | 2018-05-25 | 2022-09-16 | 兴亚株式会社 | 电阻器 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0412676Y2 (US20020095090A1-20020718-M00002.png) | 1992-03-26 |
