JPS6290838A - Base plate for fluorescent display tube - Google Patents

Base plate for fluorescent display tube

Info

Publication number
JPS6290838A
JPS6290838A JP22994385A JP22994385A JPS6290838A JP S6290838 A JPS6290838 A JP S6290838A JP 22994385 A JP22994385 A JP 22994385A JP 22994385 A JP22994385 A JP 22994385A JP S6290838 A JPS6290838 A JP S6290838A
Authority
JP
Japan
Prior art keywords
layer
fluorescent display
display tube
base plate
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP22994385A
Other languages
Japanese (ja)
Other versions
JPH0640472B2 (en
Inventor
Mitsuaki Morikawa
森川 光明
Tomohiko Furukawa
智彦 古川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Noritake Itron Corp
Original Assignee
Ise Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ise Electronics Corp filed Critical Ise Electronics Corp
Priority to JP60229943A priority Critical patent/JPH0640472B2/en
Publication of JPS6290838A publication Critical patent/JPS6290838A/en
Publication of JPH0640472B2 publication Critical patent/JPH0640472B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE:To prevent positional shift of through-holes so as to greatly increase the yield of a base plate for a fluorescent display tube by using a paste prepared by making a low melting point glass powder and a photosensitive liquid to form an insulating layer with a pattern conforming with a photomask. CONSTITUTION:After a wiring pattern 2 is formed on a glass base plate 1, a photosensitive insulation plate layer 3 composed of a mixture of frit glass used as the low melting point glass powder and a photosensitive liquid is applied to the entire surface of the base plate 1. Next, after the layer 3 is dried, it is exposed to light 4 from a light source through a photomask 5 with a given pattern to form through-holes 6. The layer 3 containing the frit glass and having the through holes 6 is then sintered, fused and solidifed to form an insulating layer 3a. After that, an anodic pad 7 and a phosphor layer 8 are formed over the layer 3a through the holes 6, thereby forming a base plate for a fluorescent display tube.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、蛍光表示管に用いられる基板に関し、特に絶
縁基板の表面に形成される配線パターン上に、低融点ガ
ラス粉末(フリットガラスともいう)を含有する感光性
絶縁ペーストを用いて露光法により絶縁層を形成した蛍
光表示管用基板に関するものである。
[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a substrate used for a fluorescent display tube, and in particular, the present invention relates to a substrate used for a fluorescent display tube. ) The present invention relates to a substrate for a fluorescent display tube in which an insulating layer is formed by an exposure method using a photosensitive insulating paste containing the following.

〔従来の技術〕[Conventional technology]

従来、蛍光表示管用基板を作製する場合は、その概略工
程を第2図に示すように、絶縁基板としてのガラス基板
1上にAt薄膜などの配線パターン2を形成しく同図(
[L))、次にスクリーン印刷法10を用いて絶縁性ペ
ースト9を所定の位置に塗布しペースト層9を形成する
(同図(b) 、 (C) )0このとき、前記ペース
ト層9は、配線パターン2を含むガラス基板1上のほぼ
全面を被覆すると共に、その配線パターン2の一部21
L  と後述する蛍光面を形成すべき陽極パッド(セグ
メント電極)とを接続するためのスルーホール6を残し
て選択的に形成される。
Conventionally, when manufacturing a substrate for a fluorescent display tube, the schematic process is shown in FIG. 2, in which a wiring pattern 2 such as an At thin film is formed on a glass substrate 1 serving as an insulating substrate.
[L)) Then, using the screen printing method 10, an insulating paste 9 is applied to a predetermined position to form a paste layer 9 (FIGS. 6(b) and (C)). At this time, the paste layer 9 is covers almost the entire surface of the glass substrate 1 including the wiring pattern 2, and also covers a part 21 of the wiring pattern 2.
It is selectively formed, leaving a through hole 6 for connecting L and an anode pad (segment electrode) on which a phosphor screen to be described later is to be formed.

次に、このようにして形成されたペースト層9は560
℃程度の高温度で焼成し、ガラス基板1上に溶融、固着
して、絶縁層9aとなす(同図(d))。
Next, the paste layer 9 formed in this way has 560
It is fired at a high temperature of approximately .degree. C., and is melted and fixed onto the glass substrate 1 to form an insulating layer 9a (FIG. 1(d)).

次いで、この絶縁層9a上にそのスルーホール6を介し
て陽極パッドIを導体層として形成し、この上に蛍光体
層8を被着して蛍光面を形成するこ2により(同図(e
))、基板作製工程が完了する。
Next, an anode pad I is formed as a conductor layer on this insulating layer 9a through the through hole 6, and a phosphor layer 8 is deposited thereon to form a phosphor screen (2) as shown in FIG.
)), the substrate fabrication process is completed.

なお、第2図中、11はスクリーンメツシュ、12はス
ギージである。
In addition, in FIG. 2, 11 is a screen mesh, and 12 is a sugeige.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

しかし、このような従来の方法では、配線パターン2が
粗い場合は問題はなかったが、配線パターン2が高密度
、高精度になるにつれて絶縁層9aを所定の位置に設計
通り正しく印刷形成することが困難となってきており、
正しい位置に印刷できない場合にはスルーホール6が隣
の配線パターンの上にもかかり、接触してしまう結果と
なる。この原因は、スクリーン印刷に用いるスクリーン
メツシュ11が使用中に徐々に伸びるため、スルーホー
ル6の位置がずれてしまうことに起因する場合が多い。
However, with such a conventional method, there was no problem when the wiring pattern 2 was rough, but as the wiring pattern 2 becomes denser and more precise, it becomes difficult to print and form the insulating layer 9a at a predetermined position correctly as designed. It is becoming difficult to
If the through hole 6 cannot be printed in the correct position, the through hole 6 will overlap and come into contact with the adjacent wiring pattern. This is often caused by the fact that the screen mesh 11 used for screen printing gradually stretches during use, causing the through holes 6 to be misaligned.

このように、従来のものではスルーホールのずれによる
歩留低下が大きな問題であった。
As described above, in the conventional devices, a decrease in yield due to misalignment of the through holes was a major problem.

本発明は、かかる点に鑑みなされたもので、フォトリソ
グラフィ一工程にてバターニングできる感光性絶縁ペー
ストを用いることにより、上記した従来の問題点を解消
した蛍光表示管用基板を提供するものでおる。
The present invention has been made in view of these points, and provides a substrate for a fluorescent display tube that eliminates the above-mentioned conventional problems by using a photosensitive insulating paste that can be patterned in one photolithography process. .

〔問題点を解決するための手段〕[Means for solving problems]

本発明の蛍光表示管用基板は、絶縁基板の表面に配線パ
ターンを形成し、次いでこの配線パターン上に該配線パ
ターンと導体層とを接続するためのスルーホールを残し
て絶縁層を形成したうえ、この絶縁層上にそのスルーホ
ールを介して前記導体層を形成してなる蛍光表示管用基
板において、前記絶縁層を低融点ガラス粉末と感光性液
状体とを混合してなるペーストにて形成したことを特徴
とする。
In the fluorescent display tube substrate of the present invention, a wiring pattern is formed on the surface of an insulating substrate, and then an insulating layer is formed on the wiring pattern by leaving a through hole for connecting the wiring pattern and a conductor layer. In the fluorescent display tube substrate in which the conductor layer is formed on the insulating layer through the through hole, the insulating layer is formed of a paste made of a mixture of low melting point glass powder and a photosensitive liquid. It is characterized by

〔作用〕[Effect]

本発明においては、低融点ガラス粉末と感光性液状体と
を混合してなる感光性の絶縁ペーストを用いて絶縁層を
形成することにより、この絶縁層は露光によりバターニ
ングできるので、フォトマスクに忠実な絶縁層のパター
ン形成ができる。
In the present invention, by forming an insulating layer using a photosensitive insulating paste made by mixing a low melting point glass powder and a photosensitive liquid, this insulating layer can be patterned by exposure to light, so it can be used as a photomask. Accurate insulating layer pattern formation is possible.

〔実施例〕〔Example〕

以下、本発明を第1図を参照して詳細に説明する。 Hereinafter, the present invention will be explained in detail with reference to FIG.

第1図(−)乃至(e)は本発明に係る蛍光表示管用基
板の一実施例を示す基本的な工程断面図でおり、同図に
おいて第2図と同一符号は同一または相当部分を示して
いる。まずガラス基板1上に配線パターン2を形成しく
同図(、) ’) 、次に低融点ガラス粉末としてのフ
リットガラスと感光性液状体とを混合してなる感光性絶
縁ペースト3を印刷法あるいは他の方法により前記ガラ
ス基板1上の全面に塗布する(同図(b))。次いでこ
のペースト層3を乾燥した後、光源よりの照射光4を所
定のパターンをもったフォトマスク5を通して露光する
と(同図(C))、前記ペースト層3がネガ型感光性の
場合は露光部分が現像液に不宕となり、未露光部分は現
像液に溶け、第1図(d)に示すようなスルーホール6
が形成される。まだ、前記ペースト層3がポジ型感光性
の場合はネガ型とは反対に露光部分が現像液に溶解し、
未露光部分は残存することとなり、同様に(−でスルー
ホール6を形成できる。
1(-) to 1(e) are basic process cross-sectional views showing one embodiment of a substrate for a fluorescent display tube according to the present invention, in which the same reference numerals as in FIG. 2 indicate the same or corresponding parts. ing. First, a wiring pattern 2 is formed on a glass substrate 1, and then a photosensitive insulating paste 3 made by mixing frit glass as a low melting point glass powder and a photosensitive liquid is applied using a printing method or The coating is applied to the entire surface of the glass substrate 1 by another method (FIG. 2(b)). Next, after drying this paste layer 3, it is exposed to irradiation light 4 from a light source through a photomask 5 having a predetermined pattern ((C) in the same figure). The unexposed part becomes resistant to the developer, and the unexposed part dissolves in the developer, forming a through hole 6 as shown in Figure 1(d).
is formed. However, if the paste layer 3 is positive type photosensitive, the exposed part will dissolve in the developer, contrary to the negative type.
The unexposed portion will remain, and a through hole 6 can be formed in the same way (-).

次イで、このように露光法でスルーホール6を形成した
フリットガラスを含むペースト層3を焼成した溶融、固
着させて絶縁層3aを形成した後(同図(d))、この
絶縁層3&上にそのスルーホール6を介して陽極パッド
T、蛍光体層8を形成することにより、蛍光表示管用基
板が作製される。
Next, in step A, the insulating layer 3a is formed by firing, melting, and fixing the paste layer 3 containing the frit glass in which the through holes 6 are formed by the exposure method (FIG. 1(d)). By forming an anode pad T and a phosphor layer 8 thereon through the through hole 6, a substrate for a fluorescent display tube is manufactured.

このようにして作製された蛍光表示管用基板は、フォト
マスク5に忠実な絶縁層3&のパターン形成が可能とな
り、従来のようなスルーホールの位置ずれが全く無くな
る。
In the fluorescent display tube substrate manufactured in this way, it is possible to form a pattern of the insulating layer 3 & that is faithful to the photomask 5, and there is no misalignment of the through holes as in the conventional case.

つぎに本発明の実施態様を具体的に説明する。Next, embodiments of the present invention will be specifically described.

ifガラス基板上にスパッタリング法によりAt薄膜を
1.5μm厚に成膜し、これをフォトエツチング法にて
バターニングして所定のAt配線パターンを形成する。
If an At thin film is formed to a thickness of 1.5 μm on a glass substrate by sputtering, this is patterned by photoetching to form a predetermined At wiring pattern.

この人を配線パターンは線幅30μm、ピッチ60Am
で、蛍光面を形成すべき箇所ば200X2501zmの
パッド形状とした。次に、このAt配線パターン上に、
無機フリットガラスと感光性液状体とを混合してなるネ
ガ型感光性絶縁ペースト’6スクリーン印刷法にて基板
全面に10μm厚程度に印刷形成し、乾燥後所定のフォ
トマスクを用いて露光する。この露光時の超高圧水銀灯
の露光量は30〜50mJ/屋程度である。次に1−1
−1 ?リクロロエタンを用いて室温にてスプレー現像
を行うと、前記ペースト層の未露光部分が溶解し、その
部分にスルーホールが形成される。
The wiring pattern for this person has a line width of 30 μm and a pitch of 60 Am.
The area where the phosphor screen was to be formed had a pad shape of 200 x 2501 zm. Next, on this At wiring pattern,
A negative photosensitive insulating paste made by mixing an inorganic frit glass and a photosensitive liquid is printed on the entire surface of the substrate to a thickness of about 10 μm using the 6 screen printing method, and after drying, it is exposed to light using a predetermined photomask. The exposure amount of the ultra-high pressure mercury lamp during this exposure is about 30 to 50 mJ/house. Next 1-1
-1? When spray development is performed using dichloroethane at room temperature, the unexposed portions of the paste layer are dissolved and through holes are formed in those portions.

次いで560℃、30分間空気中にて焼成を行うと、上
記ペースト層形成部分が溶融、固着し、スルーホールを
有する絶縁層の形成が完了する。しかる後、陽極パッド
、蛍光体層をそれぞれ形成し、蛍光表示管用基板を作製
した。
Next, when baking is performed in air at 560° C. for 30 minutes, the paste layer forming portion is melted and fixed, and the formation of the insulating layer having through holes is completed. Thereafter, an anode pad and a phosphor layer were formed, respectively, to produce a substrate for a fluorescent display tube.

したがって、このような基板の作製に際し、絶縁層形成
後そのパターン形状について測定したところ、フォトマ
スク寸法にはほぼ忠実なスルーホールが得られ、±10
/Am程度の範囲で絶縁層のパターン形成が可能となり
、実用上、良好であった。
Therefore, when manufacturing such a substrate, we measured the pattern shape after forming the insulating layer, and found that through holes were obtained that were almost faithful to the photomask dimensions, and were within ±10
It became possible to form a pattern of the insulating layer within a range of about /Am, which was good for practical use.

また、上記実施例のようにフリットガラスを含む感光性
絶縁ペーストを用いて絶縁層を形成した場合、フリット
ガラス成分金倉まない感光性絶縁ペースト(以下、有機
ペーストと称する)を用いたものに比べて1次のような
問題がなく、蛍光表示管の製造上有利となる。すなわち
、前記有機ペーストで蛍光表示管の熱工程に耐えられる
ものが現実には無く、現実にある耐熱性有機ペースト、
例えばポリイミド樹脂の耐熱性は450℃程度しかなく
、使用に耐えない。仮に高耐熱性有機ペーストが出来た
としても非常に高価な材料(ポリイミド系)を使うので
、蛍光表示管には使いづらいものとなる。また、蛍光表
示管では蛍光面近傍の絶縁層が電子による衝撃(要する
に電子が若干当る)を受けやすく、そのため有機ペース
ト層の結合手が切れ分解しやすいので、ガス放出源とな
る。これは有機ペースト層が無機フリットより結合力が
弱いことに起因するものである。
In addition, when an insulating layer is formed using a photosensitive insulating paste containing frit glass as in the above example, compared to one using a photosensitive insulating paste (hereinafter referred to as organic paste) that does not contain frit glass component Kanakura. Therefore, there is no problem such as the first-order problem, which is advantageous in manufacturing a fluorescent display tube. In other words, there are no organic pastes that can withstand the thermal process of fluorescent display tubes, and there are currently existing heat-resistant organic pastes.
For example, polyimide resin has a heat resistance of only about 450° C., making it unusable. Even if a highly heat-resistant organic paste were created, it would be difficult to use in fluorescent display tubes because it would require extremely expensive materials (polyimide-based). Further, in a fluorescent display tube, the insulating layer near the phosphor screen is easily bombarded by electrons (in short, it is slightly hit by electrons), and as a result, the bonds in the organic paste layer are easily broken and decomposed, which becomes a source of gas emissions. This is due to the fact that the organic paste layer has a weaker bonding force than the inorganic frit.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明に係る蛍光表示管用基板によ
れば、フリットガラスを含有する感光性絶縁ペーストを
用いて絶縁膜を形成することにより、フォトマスクに忠
実な絶縁層のパターン形成ができるので、従来のような
スルーホールの位置ずれが全く無くなり、歩留りを大幅
傾向上させることができる効果がある。
As explained above, according to the substrate for a fluorescent display tube according to the present invention, by forming an insulating film using a photosensitive insulating paste containing frit glass, it is possible to form an insulating layer pattern faithful to a photomask. , there is no misalignment of through holes as in the conventional method, and the yield can be significantly increased.

【図面の簡単な説明】[Brief explanation of drawings]

第1図(−)乃至(−)は本発明に係る蛍光表示管用基
板の一実施例を示す基本的な工程断面図、第2図(a>
乃至(−)は従来による蛍光表示管用基板の一例を示す
工程断面図である。 1・・・・ガラス基板、2・・・・配線パターン、3・
・寧・フリットガラスを含む感光性絶縁ペースト、3a
・・・・絶縁層、4・・・・光、56@・−フォトマス
ク、6・・・・スルーホール、γ・・・・陽極パッド、
8・・・・蛍光体層。
1(-) to 1(-) are basic process cross-sectional views showing one embodiment of a substrate for a fluorescent display tube according to the present invention, and FIG. 2(a>
1 to (-) are process cross-sectional views showing an example of a conventional fluorescent display tube substrate. 1...Glass substrate, 2...Wiring pattern, 3...
・Ning・Photosensitive insulation paste containing frit glass, 3a
...Insulating layer, 4...Light, 56@-Photomask, 6...Through hole, γ...Anode pad,
8...phosphor layer.

Claims (1)

【特許請求の範囲】[Claims] 絶縁基板の表面に配線パターンを形成し、次いでこの配
線パターン上に該配線パターンと導体層とを接続するた
めのスルーホールを残して絶縁層を形成したうえ、この
絶縁層上にそのスルーホールを介して前記導体層を形成
してなる蛍光表示管用基板において、前記絶縁層を低融
点ガラス粉末と感光性液状体とを混合してなるペースト
にて形成したことを特徴とする蛍光表示管用基板。
A wiring pattern is formed on the surface of an insulating substrate, and then an insulating layer is formed by leaving a through hole on this wiring pattern to connect the wiring pattern and the conductor layer, and the through hole is formed on this insulating layer. 1. A substrate for a fluorescent display tube, wherein the conductor layer is formed through a substrate for a fluorescent display tube, characterized in that the insulating layer is formed from a paste made by mixing a low-melting point glass powder and a photosensitive liquid.
JP60229943A 1985-10-17 1985-10-17 Method for manufacturing substrate for fluorescent display tube Expired - Fee Related JPH0640472B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60229943A JPH0640472B2 (en) 1985-10-17 1985-10-17 Method for manufacturing substrate for fluorescent display tube

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60229943A JPH0640472B2 (en) 1985-10-17 1985-10-17 Method for manufacturing substrate for fluorescent display tube

Publications (2)

Publication Number Publication Date
JPS6290838A true JPS6290838A (en) 1987-04-25
JPH0640472B2 JPH0640472B2 (en) 1994-05-25

Family

ID=16900147

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60229943A Expired - Fee Related JPH0640472B2 (en) 1985-10-17 1985-10-17 Method for manufacturing substrate for fluorescent display tube

Country Status (1)

Country Link
JP (1) JPH0640472B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2700659A1 (en) * 1993-01-18 1994-07-22 Matra Sep Imagerie Inf Manufacture of multilayer circuits on insulated substrates

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54124671A (en) * 1978-03-20 1979-09-27 Nec Corp Production of fluorescent display tube
JPS5714534A (en) * 1980-06-30 1982-01-25 Daicel Chem Ind Ltd Protein rbf-pm

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54124671A (en) * 1978-03-20 1979-09-27 Nec Corp Production of fluorescent display tube
JPS5714534A (en) * 1980-06-30 1982-01-25 Daicel Chem Ind Ltd Protein rbf-pm

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2700659A1 (en) * 1993-01-18 1994-07-22 Matra Sep Imagerie Inf Manufacture of multilayer circuits on insulated substrates

Also Published As

Publication number Publication date
JPH0640472B2 (en) 1994-05-25

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