JPS6286841A - 高周波混成集積回路 - Google Patents

高周波混成集積回路

Info

Publication number
JPS6286841A
JPS6286841A JP22931585A JP22931585A JPS6286841A JP S6286841 A JPS6286841 A JP S6286841A JP 22931585 A JP22931585 A JP 22931585A JP 22931585 A JP22931585 A JP 22931585A JP S6286841 A JPS6286841 A JP S6286841A
Authority
JP
Japan
Prior art keywords
circuit
high frequency
hybrid integrated
integrated circuit
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP22931585A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0365896B2 (enrdf_load_stackoverflow
Inventor
Masaharu Koyama
小山　正治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP22931585A priority Critical patent/JPS6286841A/ja
Publication of JPS6286841A publication Critical patent/JPS6286841A/ja
Publication of JPH0365896B2 publication Critical patent/JPH0365896B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H01L2924/1617—Cavity coating

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP22931585A 1985-10-14 1985-10-14 高周波混成集積回路 Granted JPS6286841A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22931585A JPS6286841A (ja) 1985-10-14 1985-10-14 高周波混成集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22931585A JPS6286841A (ja) 1985-10-14 1985-10-14 高周波混成集積回路

Publications (2)

Publication Number Publication Date
JPS6286841A true JPS6286841A (ja) 1987-04-21
JPH0365896B2 JPH0365896B2 (enrdf_load_stackoverflow) 1991-10-15

Family

ID=16890211

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22931585A Granted JPS6286841A (ja) 1985-10-14 1985-10-14 高周波混成集積回路

Country Status (1)

Country Link
JP (1) JPS6286841A (enrdf_load_stackoverflow)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0677251U (ja) * 1993-03-29 1994-10-28 京セラ株式会社 半導体素子収納用パッケージ
US5444297A (en) * 1992-06-17 1995-08-22 Mitsubishi Denki Kabushiki Kaisha Noise resistant semiconductor power module
US5687470A (en) * 1991-11-06 1997-11-18 Nokia Mobile Phones Limited Method for forming an RF shielded enclosure
US5703761A (en) * 1995-09-07 1997-12-30 Siemens Aktiengesellschaft Shielding for flat modules
EP0872889A3 (de) * 1997-04-16 2000-04-19 DaimlerChrysler Aerospace Aktiengesellschaft Gehäuse für elektronische Bauelemente
KR100455015B1 (ko) * 1996-05-08 2005-01-17 더블유.엘. 고어 앤드 어소시에이트스, 인코포레이티드 전자기장애/고주파간섭방해로부터전자소자를차폐하는리드어셈블리
JP2015126289A (ja) * 2013-12-25 2015-07-06 株式会社東芝 半導体パッケージ
JP2015126025A (ja) * 2013-12-25 2015-07-06 株式会社東芝 半導体パッケージ
US9343794B2 (en) 2014-02-07 2016-05-17 Kabushiki Kaisha Toshiba Millimeter wave bands semiconductor package
US9343793B2 (en) 2014-02-07 2016-05-17 Kabushiki Kaisha Toshiba Millimeter wave bands semiconductor package
US9536843B2 (en) 2013-12-25 2017-01-03 Kabushiki Kaisha Toshiba Semiconductor package and semiconductor module

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104528693B (zh) 2009-05-26 2017-05-10 创业发展联盟技术有限公司 碳材料及其制造方法

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5687470A (en) * 1991-11-06 1997-11-18 Nokia Mobile Phones Limited Method for forming an RF shielded enclosure
US5444297A (en) * 1992-06-17 1995-08-22 Mitsubishi Denki Kabushiki Kaisha Noise resistant semiconductor power module
JPH0677251U (ja) * 1993-03-29 1994-10-28 京セラ株式会社 半導体素子収納用パッケージ
US5703761A (en) * 1995-09-07 1997-12-30 Siemens Aktiengesellschaft Shielding for flat modules
KR100455015B1 (ko) * 1996-05-08 2005-01-17 더블유.엘. 고어 앤드 어소시에이트스, 인코포레이티드 전자기장애/고주파간섭방해로부터전자소자를차폐하는리드어셈블리
EP0872889A3 (de) * 1997-04-16 2000-04-19 DaimlerChrysler Aerospace Aktiengesellschaft Gehäuse für elektronische Bauelemente
JP2015126289A (ja) * 2013-12-25 2015-07-06 株式会社東芝 半導体パッケージ
JP2015126025A (ja) * 2013-12-25 2015-07-06 株式会社東芝 半導体パッケージ
US9536843B2 (en) 2013-12-25 2017-01-03 Kabushiki Kaisha Toshiba Semiconductor package and semiconductor module
US9343794B2 (en) 2014-02-07 2016-05-17 Kabushiki Kaisha Toshiba Millimeter wave bands semiconductor package
US9343793B2 (en) 2014-02-07 2016-05-17 Kabushiki Kaisha Toshiba Millimeter wave bands semiconductor package

Also Published As

Publication number Publication date
JPH0365896B2 (enrdf_load_stackoverflow) 1991-10-15

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