JPS6284595A - 多層セラミック配線基板 - Google Patents
多層セラミック配線基板Info
- Publication number
- JPS6284595A JPS6284595A JP22528285A JP22528285A JPS6284595A JP S6284595 A JPS6284595 A JP S6284595A JP 22528285 A JP22528285 A JP 22528285A JP 22528285 A JP22528285 A JP 22528285A JP S6284595 A JPS6284595 A JP S6284595A
- Authority
- JP
- Japan
- Prior art keywords
- multilayer ceramic
- substrate
- ceramic
- ceramic wiring
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims description 32
- 239000000758 substrate Substances 0.000 title description 33
- 239000004020 conductor Substances 0.000 claims description 15
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical group Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 11
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical group [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 5
- ZVWKZXLXHLZXLS-UHFFFAOYSA-N zirconium nitride Chemical compound [Zr]#N ZVWKZXLXHLZXLS-UHFFFAOYSA-N 0.000 claims description 4
- 238000000034 method Methods 0.000 description 12
- 239000000463 material Substances 0.000 description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 239000000654 additive Substances 0.000 description 5
- 239000012298 atmosphere Substances 0.000 description 5
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 5
- 229910010271 silicon carbide Inorganic materials 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 3
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 230000001603 reducing effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229910014813 CaC2 Inorganic materials 0.000 description 1
- 229910020101 MgC2 Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- 239000004632 polycaprolactone Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000010802 sludge Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22528285A JPS6284595A (ja) | 1985-10-08 | 1985-10-08 | 多層セラミック配線基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22528285A JPS6284595A (ja) | 1985-10-08 | 1985-10-08 | 多層セラミック配線基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6284595A true JPS6284595A (ja) | 1987-04-18 |
| JPH0445997B2 JPH0445997B2 (enrdf_load_stackoverflow) | 1992-07-28 |
Family
ID=16826890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22528285A Granted JPS6284595A (ja) | 1985-10-08 | 1985-10-08 | 多層セラミック配線基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6284595A (enrdf_load_stackoverflow) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5527841A (en) * | 1978-08-16 | 1980-02-28 | Ngk Spark Plug Co | Metallization of highly aluminous ceramics |
| JPS57180006A (en) * | 1981-04-30 | 1982-11-05 | Hitachi Ltd | High thermally conductive electric insulator |
| JPS6077186A (ja) * | 1983-09-30 | 1985-05-01 | 株式会社東芝 | 金属化表面を有するセラミツクス焼結体 |
| JPS60173900A (ja) * | 1984-02-20 | 1985-09-07 | 株式会社東芝 | セラミツクス回路基板 |
| JPS60178687A (ja) * | 1984-02-27 | 1985-09-12 | 株式会社東芝 | 高熱伝導性回路基板 |
| JPS60178688A (ja) * | 1984-02-27 | 1985-09-12 | 株式会社東芝 | 高熱伝導性回路基板 |
| JPS60180954A (ja) * | 1984-02-27 | 1985-09-14 | 株式会社東芝 | 窒化アルミニウムグリ−ンシ−トの製造方法 |
-
1985
- 1985-10-08 JP JP22528285A patent/JPS6284595A/ja active Granted
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5527841A (en) * | 1978-08-16 | 1980-02-28 | Ngk Spark Plug Co | Metallization of highly aluminous ceramics |
| JPS57180006A (en) * | 1981-04-30 | 1982-11-05 | Hitachi Ltd | High thermally conductive electric insulator |
| JPS6077186A (ja) * | 1983-09-30 | 1985-05-01 | 株式会社東芝 | 金属化表面を有するセラミツクス焼結体 |
| JPS60173900A (ja) * | 1984-02-20 | 1985-09-07 | 株式会社東芝 | セラミツクス回路基板 |
| JPS60178687A (ja) * | 1984-02-27 | 1985-09-12 | 株式会社東芝 | 高熱伝導性回路基板 |
| JPS60178688A (ja) * | 1984-02-27 | 1985-09-12 | 株式会社東芝 | 高熱伝導性回路基板 |
| JPS60180954A (ja) * | 1984-02-27 | 1985-09-14 | 株式会社東芝 | 窒化アルミニウムグリ−ンシ−トの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0445997B2 (enrdf_load_stackoverflow) | 1992-07-28 |
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