JPH0445997B2 - - Google Patents

Info

Publication number
JPH0445997B2
JPH0445997B2 JP60225282A JP22528285A JPH0445997B2 JP H0445997 B2 JPH0445997 B2 JP H0445997B2 JP 60225282 A JP60225282 A JP 60225282A JP 22528285 A JP22528285 A JP 22528285A JP H0445997 B2 JPH0445997 B2 JP H0445997B2
Authority
JP
Japan
Prior art keywords
substrate
ceramic
multilayer ceramic
aluminum nitride
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60225282A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6284595A (ja
Inventor
Juzo Shimada
Hideo Takamizawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP22528285A priority Critical patent/JPS6284595A/ja
Publication of JPS6284595A publication Critical patent/JPS6284595A/ja
Publication of JPH0445997B2 publication Critical patent/JPH0445997B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP22528285A 1985-10-08 1985-10-08 多層セラミック配線基板 Granted JPS6284595A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22528285A JPS6284595A (ja) 1985-10-08 1985-10-08 多層セラミック配線基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22528285A JPS6284595A (ja) 1985-10-08 1985-10-08 多層セラミック配線基板

Publications (2)

Publication Number Publication Date
JPS6284595A JPS6284595A (ja) 1987-04-18
JPH0445997B2 true JPH0445997B2 (enrdf_load_stackoverflow) 1992-07-28

Family

ID=16826890

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22528285A Granted JPS6284595A (ja) 1985-10-08 1985-10-08 多層セラミック配線基板

Country Status (1)

Country Link
JP (1) JPS6284595A (enrdf_load_stackoverflow)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6028790B2 (ja) * 1978-08-16 1985-07-06 日本特殊陶業株式会社 高アルミナ質セラミックスのメタライズ法
JPS57180006A (en) * 1981-04-30 1982-11-05 Hitachi Ltd High thermally conductive electric insulator
JPS6077186A (ja) * 1983-09-30 1985-05-01 株式会社東芝 金属化表面を有するセラミツクス焼結体
JPS60173900A (ja) * 1984-02-20 1985-09-07 株式会社東芝 セラミツクス回路基板
JPS60178688A (ja) * 1984-02-27 1985-09-12 株式会社東芝 高熱伝導性回路基板
JPS60180954A (ja) * 1984-02-27 1985-09-14 株式会社東芝 窒化アルミニウムグリ−ンシ−トの製造方法
JPS60178687A (ja) * 1984-02-27 1985-09-12 株式会社東芝 高熱伝導性回路基板

Also Published As

Publication number Publication date
JPS6284595A (ja) 1987-04-18

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