JPS6277447A - 金メッキを施した直径１００μｍ以下の銅細線の成形方法 - Google Patents

金メッキを施した直径１００μｍ以下の銅細線の成形方法

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Publication number
JPS6277447A
JPS6277447A JP60218416A JP21841685A JPS6277447A JP S6277447 A JPS6277447 A JP S6277447A JP 60218416 A JP60218416 A JP 60218416A JP 21841685 A JP21841685 A JP 21841685A JP S6277447 A JPS6277447 A JP S6277447A
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Japan
Prior art keywords
wire
copper
diameter
gold
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60218416A
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English (en)
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JPH07122121B2 (ja
Inventor
Yasuhiko Yoshinaga
吉永　保彦
Masaharu Ishizaka
石坂　雅治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
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Application filed by Tanaka Denshi Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Priority to JP60218416A priority Critical patent/JPH07122121B2/ja
Publication of JPS6277447A publication Critical patent/JPS6277447A/ja
Publication of JPH07122121B2 publication Critical patent/JPH07122121B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 （産業上の利用分野つ 本発明は、コンピューター等に利用される高密度磁気記
憶媒体（フロッピーディスク）等のｍ気ヘッド及びマイ
クロモーター等に使用されるリード線に関するものであ
る。
（従来の技術とその問題点） 従来、金メッキを施した銅ｆ＃ｆＩ線の成形方法は、直
径約５０μｍに形成した無１０司腺に直に純金メッキを
施し、熱処理を行った後にウレタン被膜を、施していた
。
ところが、この成形方法はメッキ結晶が粗いためボンデ
ィング性が悪く、かつウレタン被膜が不均一となってピ
ンホールの発生を招いていた。
メッキ結晶を細かくする方法としてＡｕ−Ｃ。
及びＡｕ−Ｎｉ等の合金メッキを施す方法もあるが、こ
の方法では導体の電気抵抗が犬きくなシ、かつ、ボンデ
ィング性も悪いため信頼性におとっていた。
（発明が解決しようとする技術的課題）以上の問題を解
決しようとする本発明の技術的課題は、メッキの結晶を
細かくしてボンディング性及びウレタン被覆性を向上さ
せると共に電気抵抗を小さくすることである。
（技術的課題を達成するための技術的手段）以上の技術
的課題を達成するための本発明の技術的手段は、銅又は
銅合金縁に純金メッキを施した後、ダイスを通して引抜
加工を行って所定の線径に伸線し、然る後、熱処理およ
び杷縁被膜をコーティングすることである。
ここに鋼線とは、例えば無酸素銅し、タフピッチ銅線等
であシ、銅合金縁とは例えば銀入９嗣線、罎入シ銅線等
でろシ、これらに純金メッキを施す。
また、引抜加工は伸線を行なうと共に、純金メッキの厚
さ及び表面を平滑にしてピンホールを防止し、かつウレ
タン被膜の均一化を図るものであり、ウレタン被覆は絶
縁性及び耐電圧性を高めるために施されるものである。
（発明の効果） 本発明は以上の様な方法により　＠　Ｍｂ　？ｉＡを形
成したことによ多下記の効果を有する。
■　純金メッキを施した後、ダイスを通して引抜加工を
行って所定の線径に伸線すちので、メッキの厚さが均一
で、かつ光間が、１．面光沢となってボンディング性の
向上を図ることができると共に、ウレタン被ａを均一に
施すことができ、ピンホールの発生を防止することがで
きる。
■　純金メッキを施すことにより、硬質金メッキを施し
た銅細線と比べ、電気抵抗を小さくすることができる。
（実施例） 本発明の実施例は直径１００μｍ　Ｏ）無酸素鋼の母線
に純金メッキを施した後、引抜加工により直径５０μｍ
（メッキ厚さ２μｍ）に伸線したものである。
超音波ボンディング後のプルテストにおけるボンディン
グ強度は次表（１）に示す通シで２１７、比較品のは直
径４６μｍの銅線に純金メッキ２μｍを施したものでわ
シ、比較品■は、直径４６μｍの銅線にＡｕ−Ｃｏ合金
メッキを２μｍ施したものである。比較品■■共に、メ
ッキ後の引抜加工は行なっていない。実施品、比較品共
にメッキ後フルアニールを行なっている。
表　　ＣＩ） この結果、ボンディング性の向上を図ることができろこ
とを確認することができた。
１だ、次表（２）はウレタンの被覆性の試験結果でらり
、実施品は前記派の陽１，２．３の実施品に夫々５μｍ
のウレタンを塗布したものである。
弐　（２） この結果、ウレタンの被覆を均一に施すことカテキ、か
つ、ピンホールの発生を防ぐことを６＆認することがで
きた。
次表（３）は表面抵抗測定の結果を示したものでるる。
実施品階１は直径１００μｍの無酸素鋼の母線に純金メ
ッキを行った後、直径５０ｐｍに伸線し、フルアニール
ものであり、メッキ厚さは一２μｍである。
またＮｎ２は直径４６μｍの銅線にＡｕ−Ｃｏ合金メッ
キを２μｍ施した後フルアニールしたものでおる。
餞　（３） この結果、硬質金メッキを施した銅細線に比べ電気抵抗
を小さくすることができることを確認することができた
。

Claims (1)

    【特許請求の範囲】
  1. 銅又は銅合金縁に純金メッキを施した後、ダイスを通し
    て引抜加工を行って所定の線径に伸線し、然る後、熱処
    理および絶縁皮膜をコーティングすることを特徴とする
    金メッキを施した銅細線の成形方法。
JP60218416A 1985-09-30 1985-09-30 金メッキを施した直径１００μｍ以下の銅細線の成形方法 Expired - Lifetime JPH07122121B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60218416A JPH07122121B2 (ja) 1985-09-30 1985-09-30 金メッキを施した直径１００μｍ以下の銅細線の成形方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60218416A JPH07122121B2 (ja) 1985-09-30 1985-09-30 金メッキを施した直径１００μｍ以下の銅細線の成形方法

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JPS6277447A true JPS6277447A (ja) 1987-04-09
JPH07122121B2 JPH07122121B2 (ja) 1995-12-25

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1279491A1 (en) * 2001-07-23 2003-01-29 Tao-Kuang Chang Gold wire for use in semiconductor packaging and high-frequency signal transmission and its fabrication method
CN103474408A (zh) * 2013-09-26 2013-12-25 辽宁凯立尔电子科技有限公司 一种表面有镀金层的金银合金键合丝及其制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4933833A (ja) * 1972-07-29 1974-03-28
JPS5648589A (en) * 1979-09-28 1981-05-01 Tokyo Shibaura Electric Co Nuclear reactor control rod drive
JPS5679810A (en) * 1979-12-03 1981-06-30 Sumitomo Electric Industries Method of manufacturing lead wire for electronic part
JPS5928530A (ja) * 1982-08-09 1984-02-15 Fujikura Ltd エナメル線の製造方法
JPS6036000A (ja) * 1983-08-04 1985-02-23 Toshiba Corp ディ−ゼル発電設備における負荷役入時の運転方法
JPS60118343A (ja) * 1983-11-29 1985-06-25 Sumitomo Electric Ind Ltd 複合線の製造法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4933833A (ja) * 1972-07-29 1974-03-28
JPS5648589A (en) * 1979-09-28 1981-05-01 Tokyo Shibaura Electric Co Nuclear reactor control rod drive
JPS5679810A (en) * 1979-12-03 1981-06-30 Sumitomo Electric Industries Method of manufacturing lead wire for electronic part
JPS5928530A (ja) * 1982-08-09 1984-02-15 Fujikura Ltd エナメル線の製造方法
JPS6036000A (ja) * 1983-08-04 1985-02-23 Toshiba Corp ディ−ゼル発電設備における負荷役入時の運転方法
JPS60118343A (ja) * 1983-11-29 1985-06-25 Sumitomo Electric Ind Ltd 複合線の製造法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1279491A1 (en) * 2001-07-23 2003-01-29 Tao-Kuang Chang Gold wire for use in semiconductor packaging and high-frequency signal transmission and its fabrication method
CN103474408A (zh) * 2013-09-26 2013-12-25 辽宁凯立尔电子科技有限公司 一种表面有镀金层的金银合金键合丝及其制备方法

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