JPS6274359U - - Google Patents
Info
- Publication number
- JPS6274359U JPS6274359U JP1985166073U JP16607385U JPS6274359U JP S6274359 U JPS6274359 U JP S6274359U JP 1985166073 U JP1985166073 U JP 1985166073U JP 16607385 U JP16607385 U JP 16607385U JP S6274359 U JPS6274359 U JP S6274359U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- seat
- section
- hole
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図及び第２図は夫々本考案に係るリード付
回路部品の基板への取付構造の一実施例に適用す
る発光ダイオードの上方及び下方斜視図、第３図
は上記発光ダイオードの基板への取付状態の一部
切截側面図、第４図及び第５図は夫々上記発光ダ
イオードの係止凸部の各種例を下方より見た拡大
斜視図である。
１：発光ダイオード、２：発光部、３：受座部
、３ａ：鍔部、３ｂ，３ｅ，３ｇ：係止凸部、３
ｆ：溝、３ｈ：大径部、３ｃ：凹部、４：リード
、５：基板、５ａ，５ｂ：孔、６：半田。
1 and 2 are upper and lower perspective views, respectively, of a light emitting diode applied to an embodiment of the structure for attaching a leaded circuit component to a substrate according to the present invention, and FIG. 3 is a perspective view of the above light emitting diode to a substrate. A partially cutaway side view of the attached state, and FIGS. 4 and 5 are enlarged perspective views of various examples of the locking convex portion of the light emitting diode, respectively, viewed from below. 1: Light emitting diode, 2: Light emitting part, 3: Seat part, 3a: Flange part, 3b, 3e, 3g: Locking convex part, 3
f: groove, 3h: large diameter portion, 3c: recess, 4: lead, 5: substrate, 5a, 5b: hole, 6: solder.
Claims (1)
発光部の下部の受座部と該受座部より下方へ突出
するリードとを有し、該受座部下面の該リードが
突出する部分に半田収納用凹部を設け、かつ該受
座部下面の他の部分に係止凸部を設けたリード付
回路部品とよりなり、前記リード付回路部品を前
記基板に対し、前記リードを前記第１の孔に挿通
させ、かつ前記係止凸部を前記第２の孔に圧入し
て仮組付し、前記リードを前記基板のプリントに
半田付するよう構成したリード付回路部品の基板
への装着構造。 It has a substrate having first and second holes, a circuit section, a seat section below the light emitting section, and a lead protruding downward from the seat section, and the lead on the bottom surface of the seat protrudes. A leaded circuit component is provided with a recessed portion for storing solder in a portion thereof, and a locking convex portion is provided in another portion of the lower surface of the seat. A board of a circuit component with a lead, which is inserted into the first hole, temporarily assembled by press-fitting the locking convex part into the second hole, and soldering the lead to a print on the board. Attachment structure to.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985166073U JPS6274359U (en) | 1985-10-29 | 1985-10-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985166073U JPS6274359U (en) | 1985-10-29 | 1985-10-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6274359U true JPS6274359U (en) | 1987-05-13 |
Family
ID=31096696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985166073U Pending JPS6274359U (en) | 1985-10-29 | 1985-10-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6274359U (en) |
-
1985
- 1985-10-29 JP JP1985166073U patent/JPS6274359U/ja active Pending