JPS6272129A - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法Info
- Publication number
- JPS6272129A JPS6272129A JP21287785A JP21287785A JPS6272129A JP S6272129 A JPS6272129 A JP S6272129A JP 21287785 A JP21287785 A JP 21287785A JP 21287785 A JP21287785 A JP 21287785A JP S6272129 A JPS6272129 A JP S6272129A
- Authority
- JP
- Japan
- Prior art keywords
- etching
- oxide film
- polycrystalline silicon
- silicon oxide
- silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 10
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 238000005530 etching Methods 0.000 claims abstract description 64
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 37
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 37
- 239000010703 silicon Substances 0.000 claims abstract description 37
- 239000000758 substrate Substances 0.000 claims abstract description 36
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 34
- 229910052814 silicon oxide Inorganic materials 0.000 claims abstract description 34
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 33
- 238000000034 method Methods 0.000 claims abstract description 26
- 238000001020 plasma etching Methods 0.000 claims abstract description 19
- 238000000151 deposition Methods 0.000 claims abstract description 8
- 238000001312 dry etching Methods 0.000 claims abstract description 7
- 239000012535 impurity Substances 0.000 claims abstract description 3
- 150000002500 ions Chemical class 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 description 7
- 238000002955 isolation Methods 0.000 description 7
- 239000007789 gas Substances 0.000 description 5
- 239000000047 product Substances 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 229910001882 dioxygen Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 239000012495 reaction gas Substances 0.000 description 2
- 241000293849 Cordylanthus Species 0.000 description 1
- 241000123069 Ocyurus chrysurus Species 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000001947 vapour-phase growth Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Landscapes
- Drying Of Semiconductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21287785A JPS6272129A (ja) | 1985-09-26 | 1985-09-26 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21287785A JPS6272129A (ja) | 1985-09-26 | 1985-09-26 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6272129A true JPS6272129A (ja) | 1987-04-02 |
JPH057863B2 JPH057863B2 (enrdf_load_stackoverflow) | 1993-01-29 |
Family
ID=16629740
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21287785A Granted JPS6272129A (ja) | 1985-09-26 | 1985-09-26 | 半導体装置の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6272129A (enrdf_load_stackoverflow) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04215432A (ja) * | 1990-12-14 | 1992-08-06 | Mitsubishi Electric Corp | 微細加工方法 |
JP2006045656A (ja) * | 2004-08-09 | 2006-02-16 | Fuji Xerox Co Ltd | シリコン構造体製造方法、モールド金型製造方法、成形部材製造方法、シリコン構造体、インクジェット記録ヘッド、及び、画像形成装置 |
JP2011215404A (ja) * | 2010-03-31 | 2011-10-27 | Toppan Printing Co Ltd | フォトマスクブランクとその製造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4880440A (enrdf_load_stackoverflow) * | 1972-02-02 | 1973-10-27 | ||
JPS6025249A (ja) * | 1983-07-22 | 1985-02-08 | Pioneer Electronic Corp | 半導体装置の製造方法 |
-
1985
- 1985-09-26 JP JP21287785A patent/JPS6272129A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4880440A (enrdf_load_stackoverflow) * | 1972-02-02 | 1973-10-27 | ||
JPS6025249A (ja) * | 1983-07-22 | 1985-02-08 | Pioneer Electronic Corp | 半導体装置の製造方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04215432A (ja) * | 1990-12-14 | 1992-08-06 | Mitsubishi Electric Corp | 微細加工方法 |
JP2006045656A (ja) * | 2004-08-09 | 2006-02-16 | Fuji Xerox Co Ltd | シリコン構造体製造方法、モールド金型製造方法、成形部材製造方法、シリコン構造体、インクジェット記録ヘッド、及び、画像形成装置 |
JP2011215404A (ja) * | 2010-03-31 | 2011-10-27 | Toppan Printing Co Ltd | フォトマスクブランクとその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPH057863B2 (enrdf_load_stackoverflow) | 1993-01-29 |
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