JPS6268262A - 平面研削盤 - Google Patents
平面研削盤Info
- Publication number
- JPS6268262A JPS6268262A JP20648185A JP20648185A JPS6268262A JP S6268262 A JPS6268262 A JP S6268262A JP 20648185 A JP20648185 A JP 20648185A JP 20648185 A JP20648185 A JP 20648185A JP S6268262 A JPS6268262 A JP S6268262A
- Authority
- JP
- Japan
- Prior art keywords
- rotary
- wafer
- grindstone
- axis
- center
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 235000012431 wafers Nutrition 0.000 abstract description 35
- 238000003754 machining Methods 0.000 abstract description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Landscapes
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20648185A JPS6268262A (ja) | 1985-09-20 | 1985-09-20 | 平面研削盤 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20648185A JPS6268262A (ja) | 1985-09-20 | 1985-09-20 | 平面研削盤 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6268262A true JPS6268262A (ja) | 1987-03-28 |
| JPH0350665B2 JPH0350665B2 (enrdf_load_stackoverflow) | 1991-08-02 |
Family
ID=16524086
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20648185A Granted JPS6268262A (ja) | 1985-09-20 | 1985-09-20 | 平面研削盤 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6268262A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003025197A (ja) * | 2001-07-13 | 2003-01-29 | Waida Seisakusho:Kk | 研削盤におけるワークと砥石との相対位置関係調節装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5662753A (en) * | 1979-10-17 | 1981-05-28 | Tdk Corp | Surface grinder |
| JPS56139865A (en) * | 1980-03-31 | 1981-10-31 | Toshiba Corp | Grinding machine |
-
1985
- 1985-09-20 JP JP20648185A patent/JPS6268262A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5662753A (en) * | 1979-10-17 | 1981-05-28 | Tdk Corp | Surface grinder |
| JPS56139865A (en) * | 1980-03-31 | 1981-10-31 | Toshiba Corp | Grinding machine |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003025197A (ja) * | 2001-07-13 | 2003-01-29 | Waida Seisakusho:Kk | 研削盤におけるワークと砥石との相対位置関係調節装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0350665B2 (enrdf_load_stackoverflow) | 1991-08-02 |
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