JPS6264473A - 物品の融着接合装置 - Google Patents

物品の融着接合装置

Info

Publication number
JPS6264473A
JPS6264473A JP60203343A JP20334385A JPS6264473A JP S6264473 A JPS6264473 A JP S6264473A JP 60203343 A JP60203343 A JP 60203343A JP 20334385 A JP20334385 A JP 20334385A JP S6264473 A JPS6264473 A JP S6264473A
Authority
JP
Japan
Prior art keywords
tank
cooling
heat
heating
heat transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60203343A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0416262B2 (enrdf_load_stackoverflow
Inventor
Kenji Kondo
近藤　権士
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP60203343A priority Critical patent/JPS6264473A/ja
Priority to CN86104969.1A priority patent/CN1004680B/zh
Priority to EP89201803A priority patent/EP0349094B1/en
Priority to DE8686307129T priority patent/DE3672439D1/de
Priority to EP86307129A priority patent/EP0218391B1/en
Priority to US06/908,025 priority patent/US4679721A/en
Priority to DE89201803T priority patent/DE3689005D1/de
Publication of JPS6264473A publication Critical patent/JPS6264473A/ja
Priority to KR2019900006849U priority patent/KR900007617Y1/ko
Priority to KR2019900007521U priority patent/KR920005953Y1/ko
Publication of JPH0416262B2 publication Critical patent/JPH0416262B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/012—Soldering with the use of hot gas
    • B23K1/015—Vapour-condensation soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP60203343A 1985-09-17 1985-09-17 物品の融着接合装置 Granted JPS6264473A (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP60203343A JPS6264473A (ja) 1985-09-17 1985-09-17 物品の融着接合装置
CN86104969.1A CN1004680B (zh) 1985-09-17 1986-07-30 物品的钎焊装置
US06/908,025 US4679721A (en) 1985-09-17 1986-09-16 Apparatus for fuse-bonding articles
DE8686307129T DE3672439D1 (de) 1985-09-17 1986-09-16 Apparat zum schmelz-verbinden von gegenstaenden.
EP86307129A EP0218391B1 (en) 1985-09-17 1986-09-16 Apparatus for fuse-bonding articles
EP89201803A EP0349094B1 (en) 1985-09-17 1986-09-16 Apparatus for soldering printed circuit boards
DE89201803T DE3689005D1 (de) 1985-09-17 1986-09-16 Vorrichtung zum Löten von gedruckten Schaltungen.
KR2019900006849U KR900007617Y1 (ko) 1985-09-17 1990-05-21 납땜 장치
KR2019900007521U KR920005953Y1 (ko) 1985-09-17 1990-05-30 납땜장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60203343A JPS6264473A (ja) 1985-09-17 1985-09-17 物品の融着接合装置

Publications (2)

Publication Number Publication Date
JPS6264473A true JPS6264473A (ja) 1987-03-23
JPH0416262B2 JPH0416262B2 (enrdf_load_stackoverflow) 1992-03-23

Family

ID=16472450

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60203343A Granted JPS6264473A (ja) 1985-09-17 1985-09-17 物品の融着接合装置

Country Status (2)

Country Link
JP (1) JPS6264473A (enrdf_load_stackoverflow)
KR (1) KR900007617Y1 (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02220770A (ja) * 1989-02-22 1990-09-03 Nec Corp バッチ式ベーパーフェーズソルダリング装置
JP2013190112A (ja) * 2012-03-12 2013-09-26 Mitsubishi Electric Corp 熱処理装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02220770A (ja) * 1989-02-22 1990-09-03 Nec Corp バッチ式ベーパーフェーズソルダリング装置
JP2013190112A (ja) * 2012-03-12 2013-09-26 Mitsubishi Electric Corp 熱処理装置

Also Published As

Publication number Publication date
KR900007617Y1 (ko) 1990-08-23
JPH0416262B2 (enrdf_load_stackoverflow) 1992-03-23

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees