JPS6264473A - Fusion joining device for article - Google Patents

Abstract

PURPOSE:To execute efficiently heating and cooling, and also to reduce a loss of a heat energy by forming a treating tank whose lower part and upper part consist of a heating tank and a cooling tank, respectively, through a heat insulating material, and providing a turnable cover which has provided a water feed use hollow part on an opening part of the cooling tank. CONSTITUTION:A treating tank 12 is formed by providing a heating tank 17 and a cooling tank 18 on the lower part and the upper part, respectively, through a heat insulating material 19. A heat transition liquid 13 having a boiling point exceeding a melting point of a paste solder 22 is contained in the heating tank 17. The cooling tank 18 is provided with a cooler 16, and also a cover 26 having a hollow part 27 for feeding a cooling water 28 is provided so as to be turnable on an upper opening part 25. A placing base 23 on which a printed board 20 to which the paste solder 22 has been applied, and chip parts 21 have been placed in charged to the heating tank 17 through a rod 24. Subsequently, the heat transition liquid 13 is heated and boiled by a heater 14, the paste solder 22 is heated and melted by generated vapor 15, and the printed board 20 and the chip parts 21 are joined. The vapor 15 which has further ascended is cooled and solidified by the cooler and the cover 26, dropped down and collected to the heating tank 17 as the heat transition liquid 13.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] This invention relates to fusion bonding of articles, in which 1. vapor of a heated liquid heat transfer liquid 4. melts a bonding agent for bonding articles as a heating medium. It is related to the device.

[Conventional technology]

Generally, to join articles, a solid, liquid, or gaseous heating medium substance heated by electric heat such as a soldering iron is used, or
Thermal energy is transferred to the bonding agent using a beam of heat, etc. to heat the bonding agent.The bonding agent is turned into a fluid, and the heat retained in the bonding agent is used to raise the bonding area of the article to the appropriate temperature for bonding, and then the product is cooled. The joint is performed using

Here, in the above joining method, FIG. 2 is a side sectional view without showing the device used in the conventional article fusion method disclosed in Japanese Patent Publication No. 53-40934, and 1 is a side sectional view of the container. , 2 is a heating coil, 3 is a cooling coil, and 4 is a fluorine-based heat transfer liquid, which is fluorinated polyoxypropylene sold by E.D. DuPont under the name Freon E5. The heat transfer liquid 4 is placed in the container 1 to the position shown in the figure, heated by the heating coil 2 to its boiling point, and maintained at that temperature. The steam 4a generated by heating from the boiling-below heat transfer liquid 4 fills the cooling coil 3 almost up to the horizontal plane as shown by the dashed line 5, and the steam 4a condenses at the position of the cooling coil 3 and becomes a liquid. and return to the bottom of container 1. 6 is a printed circuit board, 7 is a holder for mounting and holding the printed circuit board 6, 8 is a chip component such as an electronic component to be joined to the printed circuit board 6, and 9 is a paste applied to powdered solder. Pase I solder, which is a mixed glue-like bonding agent, is applied in advance to the upper surface of the printed circuit board 6 and the lower surface of the chip component 8. The heat transfer liquid 4 used has a boiling point higher than the melting point of the base solder 9.

In this way, the heat transfer liquid 4 boils and becomes steam 4a, and the thermal energy of this steam 4a is used as a heat medium to melt the paste solder 9.Then, the holder 7 is pulled upward and the cooling coil 3 and The printed circuit board 6 and the chip component 8 are bonded by cooling and solidifying in air.

[Problem that the invention seeks to solve]

By the way, as a conventional method for fusing articles, heat transfer liquid 4
Opening 11 of container 1 in order to use continuously in vapor state.
Since the heat transfer liquid 4 cannot be avoided and the expensive heat transfer liquid 4 is consumed rapidly, there is a problem that there is a large economic loss.

In addition, the space above the liquid level of the heat transfer liquid 4 up to a required height is a steam heat-insulating layer A in which steam 4a accumulates depending on the size of the printed circuit board 6 or chip component 8 to be bonded. Above is a vapor condensation layer B where the vapor 4a is mixed with the atmosphere outside the container 1.

-a, since the heat transfer liquid 4 is expensive, the vapor condensation layer B
The steam 4a is condensed by the cooling coil 3 and stored in the container 1 as a heat transfer liquid 4.

In this way, the steam heat retaining layer A and the steam condensation layer B inside the container 1 are required to have functions that have contradictory heat conditions.

In other words, it is necessary that the vapor heat insulation layer A reaches the melting temperature of the paste solder 9, which is the bonding agent, in a short time.
In the vapor condensation layer B, it is necessary to condense and liquefy the vapor 4a.

For this reason, it is necessary to maintain a high temperature in the steam heat retention layer A and a low temperature in the steam condensation layer B, but in conventional equipment, heat transfer occurs between the steam heat retention layer A and the steam condensation layer B within the container 1. There was a problem in that there was a large loss of thermal energy because of the

The present invention was made in order to solve the above-mentioned problems, and an object thereof is to provide a fusion bonding apparatus for articles in which the loss of thermal energy is reduced as much as possible.

[Means for solving problems]

The fusion bonding apparatus according to the present invention divides a processing tank into upper and lower halves to form a lower heating tank and an upper cooling tank, interposes a heat insulating material between these, and furthermore, the cooling tank is A rotatable lid with a hollow part for water passage is provided at the opening.

[Effect]

In this invention, the t1 insulation material prevents the transfer of thermal energy from the divided heating tank to the cooling tank.

Further, the lid prevents the vapor of the heat transfer liquid from being discharged, and further promotes condensation of the vapor by passing water through the lid for cooling.

〔Example〕

FIG. 1 is a side sectional view showing an embodiment of the present invention, in which numeral 11 shows the entire fusion bonding device for articles, 12 a processing tank of the fusion bonding device 11, and 13 housed in the processing tank 12. This heat transfer liquid 13 uses, for example, Florina-1 (trademark name of Sumitomo 3M Limited), which is a fluorine-based inert liquid. 14 is the heat transfer liquid 1
15 is the steam generated by heating the heat transfer liquid 13 by the heater 14; 16 is r1'U;
A cooler 17 for condensing the steam 15 is a lower heating tank formed by dividing the processing tank 12 into two, which accommodates the heat transfer liquid 13 and allows the steam 15 generated by being heated by the heater 14 to It's full.

18 is a cooling tank in which the cooler 16 is installed below the processing tank 12; 19 is a heat insulating material interposed between the boundary surface 17n of the heating tank 17 and the boundary surface 1811 of the cooling tank 18;
The heat held by the heating tank 17 itself is prevented from being transmitted to the cooling tank 18. 20 is a printed circuit board as a first article; 21 is a chip component as a second article bonded to the printed circuit board 20; and 22 is a base as a bonding agent for bonding the printed circuit board 20 and the chip component 21. 23 is a mounting table for the printed circuit board 2o, 24 is a rod that is connected to the mounting table 23 and moves it up and down (IIIK moving mechanism is omitted), 25 is an opening of the processing tank 18, 26 is a rotatable lid that closes the opening 25; 27 is a hollow portion formed in the lid 26;
8 is cooling water that is passed into the hollow portion 27.

The heat transfer liquid 13 used has a boiling point higher than the melting point of the paste binder 22.

As described above, the printed circuit board 20 and the chip component 21 are coated with paste 1-solder 22 and temporarily fixed at the bonding position.

Next, the heat transfer liquid 13 is heated and boiled by the heater 14 to generate steam 15. Then, the paste band 22 is heated and melted in a short time by the thermal energy of the steam 15. Next, when the mounting table 23 is moved upward and taken out from the opening 25, it is cooled and solidified.

Next, the steam 15 is cooled by the cooler 16 and the lid 26, condenses and drips, and becomes the heat transfer liquid 13 and is stored.

〔Effect of the invention〕

As explained above, the present invention divides a processing tank into upper and lower halves to form a heating tank and a cooling tank, interposes a heat insulating material between them, and further provides a hollow part for water passage at the opening of the cooling tank. Since the rotatable lid is provided, there is less heat transfer in the treatment tank, heating and cooling are performed efficiently, and there is less loss of thermal energy held by steam. In addition, the steam in the cooling tank is sealed by a lid, and is further cooled by cooling water to promote condensation, which has the advantage of reducing consumption of expensive heat transfer liquid and being economical.

[Brief explanation of drawings]

FIG. 1 is a side sectional view showing an embodiment of the present invention, and FIG. 2 is a side sectional view showing an example of a conventional device. In the figure, 11 is a fusion bonding device, 12 is a processing tank, 13 is a heat transfer liquid, 14 is a heater, 15 is steam, 16 is a cooler, 17
18 is a heating tank, 18 is a cooling tank, and 17a. 18a is a boundary surface, 19 is a heat insulating material, 2o is a printed circuit board,
21 Place the chip parts, 22 the base solder, 23+, f3, 24 Ha F, 25 Lt Il
n0 part, 26 is a lid, 27 is a hollow part, and 28 is cooling water.

Claims (1)

[Claims] A heat transfer liquid having a boiling point higher than the melting point of the binder is stored in a processing tank, and the binder is melted by the steam generated by heating the heat transfer liquid to form a first article and a second article. In a fusion bonding apparatus for articles in which the vapor at the upper part of the heat transfer liquid is cooled and condensed and refluxed, the processing tank is divided into upper and lower halves to form a lower heating tank and an upper cooling tank. A heat insulating material is interposed between the cooling tank, and an openable and closable lid having a hollow part for water passage is provided in the upper opening of the cooling tank, and the first article and the second article are placed thereon. What is claimed is: 1. A fusion splicing device for articles, comprising a mounting table that is controlled to move up and down.