JPS6263967U - - Google Patents
Info
- Publication number
- JPS6263967U JPS6263967U JP15522185U JP15522185U JPS6263967U JP S6263967 U JPS6263967 U JP S6263967U JP 15522185 U JP15522185 U JP 15522185U JP 15522185 U JP15522185 U JP 15522185U JP S6263967 U JPS6263967 U JP S6263967U
- Authority
- JP
- Japan
- Prior art keywords
- ito
- dipping
- spraying
- electronic component
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002923 metal particle Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000003990 capacitor Substances 0.000 claims 1
- 238000007598 dipping method Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000005507 spraying Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
添附図面は本考案電子部品組付状態を示す部品
基盤の縦断図面、 １……絶縁基盤、２……ＩＴＯ、３……導電性
接着剤、５……ＬＳＩ、７……チツプコンデンサ
ー、９……金属粒子、１０……モールド樹脂。
基盤の縦断図面、 １……絶縁基盤、２……ＩＴＯ、３……導電性
接着剤、５……ＬＳＩ、７……チツプコンデンサ
ー、９……金属粒子、１０……モールド樹脂。
Claims (1)
- 絶縁基盤の表面に設けたＩＴＯ若しくは金属パ
ターン配線上に、金属粒子を混入した導電性接着
剤をスプレー法或はデイツプ法など任意手段にて
塗布し、該接着剤を介して、チツプコンデンサー
或はＬＳＩチツプなどの回路素子を加熱圧着して
なることを特徴とする電子部品組付構造。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15522185U JPS6263967U (ja) | 1985-10-09 | 1985-10-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15522185U JPS6263967U (ja) | 1985-10-09 | 1985-10-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6263967U true JPS6263967U (ja) | 1987-04-21 |
Family
ID=31075733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15522185U Pending JPS6263967U (ja) | 1985-10-09 | 1985-10-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6263967U (ja) |
-
1985
- 1985-10-09 JP JP15522185U patent/JPS6263967U/ja active Pending
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