JPH04755U - - Google Patents
Info
- Publication number
- JPH04755U JPH04755U JP3893790U JP3893790U JPH04755U JP H04755 U JPH04755 U JP H04755U JP 3893790 U JP3893790 U JP 3893790U JP 3893790 U JP3893790 U JP 3893790U JP H04755 U JPH04755 U JP H04755U
- Authority
- JP
- Japan
- Prior art keywords
- thermosetting resin
- insulating substrate
- copper foil
- sealed
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
- 239000011889 copper foil Substances 0.000 claims 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
図は本考案の実施例の断面図を示す。
１……絶縁基板、２……回路、５……電子部品
、８……熱硬化性樹脂、９……銅箔部。
、８……熱硬化性樹脂、９……銅箔部。
Claims (1)
- 絶縁基板に電子部品を接続しこれを熱硬化性樹
脂で封止するプリント配線板において、絶縁基板
の熱硬化性樹脂と反対側の表面に銅箔部を設ける
ことを特徴とするプリント配線板。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3893790U JPH04755U (ja) | 1990-04-11 | 1990-04-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3893790U JPH04755U (ja) | 1990-04-11 | 1990-04-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04755U true JPH04755U (ja) | 1992-01-07 |
Family
ID=31547390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3893790U Pending JPH04755U (ja) | 1990-04-11 | 1990-04-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04755U (ja) |
-
1990
- 1990-04-11 JP JP3893790U patent/JPH04755U/ja active Pending