JPS6260042U - - Google Patents
Info
- Publication number
- JPS6260042U JPS6260042U JP1985151036U JP15103685U JPS6260042U JP S6260042 U JPS6260042 U JP S6260042U JP 1985151036 U JP1985151036 U JP 1985151036U JP 15103685 U JP15103685 U JP 15103685U JP S6260042 U JPS6260042 U JP S6260042U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- container
- conductor
- cooling module
- type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000012212 insulator Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
Description
第１図は本考案の一実施例で、容器の基体部分
に冷却モジユールを取りつけた状況を示す断面図
である。 １……ケース、２……半導体素子、５……絶縁
体、６……吸装導体、７，８……Ｎ形・Ｐ形半導
体部材（冷却用）、９，１０……放熱導体、１１
，１２……ピン。
に冷却モジユールを取りつけた状況を示す断面図
である。 １……ケース、２……半導体素子、５……絶縁
体、６……吸装導体、７，８……Ｎ形・Ｐ形半導
体部材（冷却用）、９，１０……放熱導体、１１
，１２……ピン。
Claims (1)
- 熱電冷却作用を有する、少なくとも１対以上の
Ｎ形・Ｐ形半導体部材の組に、吸熱導体・放熱導
体を接続した冷却モジユールを容器に収容し、前
記吸熱導体上に絶縁体を介して半導体素子を接触
し、前記放熱導体を容器壁面に接して配置すると
ともに、前記冷却モジユールの電流が容器のピン
を介して印加されることを特徴とする冷却モジユ
ール内蔵の半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985151036U JPS6260042U (ja) | 1985-10-01 | 1985-10-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985151036U JPS6260042U (ja) | 1985-10-01 | 1985-10-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6260042U true JPS6260042U (ja) | 1987-04-14 |
Family
ID=31067730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985151036U Pending JPS6260042U (ja) | 1985-10-01 | 1985-10-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6260042U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002100714A (ja) * | 2000-09-21 | 2002-04-05 | Ibiden Co Ltd | 半導体装置 |
-
1985
- 1985-10-01 JP JP1985151036U patent/JPS6260042U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002100714A (ja) * | 2000-09-21 | 2002-04-05 | Ibiden Co Ltd | 半導体装置 |
| JP4712948B2 (ja) * | 2000-09-21 | 2011-06-29 | イビデン株式会社 | 半導体装置 |