JPS6259409B2 - - Google Patents

Info

Publication number
JPS6259409B2
JPS6259409B2 JP57078715A JP7871582A JPS6259409B2 JP S6259409 B2 JPS6259409 B2 JP S6259409B2 JP 57078715 A JP57078715 A JP 57078715A JP 7871582 A JP7871582 A JP 7871582A JP S6259409 B2 JPS6259409 B2 JP S6259409B2
Authority
JP
Japan
Prior art keywords
cooling
disk
rotary joint
shaft
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57078715A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58194241A (ja
Inventor
Koji Matsuda
Tsukasa Nogami
Susumu Yamada
Masahiko Aoki
Katsuo Naito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NITSUSHIN HAIBORUTEEJI KK
Original Assignee
NITSUSHIN HAIBORUTEEJI KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NITSUSHIN HAIBORUTEEJI KK filed Critical NITSUSHIN HAIBORUTEEJI KK
Priority to JP57078715A priority Critical patent/JPS58194241A/ja
Publication of JPS58194241A publication Critical patent/JPS58194241A/ja
Publication of JPS6259409B2 publication Critical patent/JPS6259409B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411Constructional aspects of the reactor
    • H01J37/3435Target holders (includes backing plates and endblocks)

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
JP57078715A 1982-05-10 1982-05-10 イオン注入装置のタ−ゲツト冷却装置 Granted JPS58194241A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57078715A JPS58194241A (ja) 1982-05-10 1982-05-10 イオン注入装置のタ−ゲツト冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57078715A JPS58194241A (ja) 1982-05-10 1982-05-10 イオン注入装置のタ−ゲツト冷却装置

Publications (2)

Publication Number Publication Date
JPS58194241A JPS58194241A (ja) 1983-11-12
JPS6259409B2 true JPS6259409B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1987-12-10

Family

ID=13669562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57078715A Granted JPS58194241A (ja) 1982-05-10 1982-05-10 イオン注入装置のタ−ゲツト冷却装置

Country Status (1)

Country Link
JP (1) JPS58194241A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101407686B1 (ko) * 2006-08-17 2014-07-02 액셀리스 테크놀러지스, 인크. 이온 주입 시스템을 위한 워크피스 핸들링 스캔 아암
WO2018142459A1 (ja) * 2017-01-31 2018-08-09 住友重機械工業株式会社 ターゲット装置
JP7304261B2 (ja) * 2019-10-07 2023-07-06 キヤノントッキ株式会社 成膜装置、成膜方法および電子デバイスの製造方法

Also Published As

Publication number Publication date
JPS58194241A (ja) 1983-11-12

Similar Documents

Publication Publication Date Title
US6231732B1 (en) Cylindrical carriage sputtering system
WO1998008997A9 (en) A cylindrical carriage sputtering system
US7528392B2 (en) Techniques for low-temperature ion implantation
US4553069A (en) Wafer holding apparatus for ion implantation
US5929456A (en) Ion implantation system and method adapted for serial wafer processing
JPS60240045A (ja) サイクリツク真空処理装置において熱伝達を制御するための装置
US4229655A (en) Vacuum chamber for treating workpieces with beams
JP7154406B2 (ja) メカニカルシールアセンブリ付き回転ユニオン
JP2023097404A (ja) 高圧熱処理装置
KR100608957B1 (ko) 성막 장치 및 이를 이용한 성막 방법
JPS6259409B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
WO2002027754A3 (en) An apparatus for the backside gas cooling of a wafer in a batch ion implantation system
US6863736B2 (en) Shaft cooling mechanisms
JPS6322409B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS6127857B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH05345253A (ja) 旋盤用工作物スピンドル装置
US4717829A (en) Platen and beam setup flag assembly for ion implanter
US4806769A (en) Disk exchangeable target mechanism with effective cooling means, for ion implantation system
JPH0817709A (ja) 荷電粒子ビーム装置
GB2109996A (en) Hydraulically actuated semiconductor wafer clamping and cooling apparatus
US4685119A (en) Movable anode x-ray source with enhanced anode cooling
JPH0855814A (ja) イオン注入装置用エンドステーション
JPS6322410B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP3455899B2 (ja) 冷却媒体移送式冷却装置
JPS59138043A (ja) イオン打込装置のウエハ冷却機構