JPS6258664A - 放熱性絶縁基板 - Google Patents
放熱性絶縁基板Info
- Publication number
- JPS6258664A JPS6258664A JP19758385A JP19758385A JPS6258664A JP S6258664 A JPS6258664 A JP S6258664A JP 19758385 A JP19758385 A JP 19758385A JP 19758385 A JP19758385 A JP 19758385A JP S6258664 A JPS6258664 A JP S6258664A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- heat
- aluminum nitride
- insulating substrate
- sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 43
- 238000009413 insulation Methods 0.000 title description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims abstract description 19
- 239000000919 ceramic Substances 0.000 claims abstract description 15
- 238000001816 cooling Methods 0.000 claims abstract description 12
- 239000004065 semiconductor Substances 0.000 claims abstract description 11
- 230000017525 heat dissipation Effects 0.000 abstract description 7
- 238000005245 sintering Methods 0.000 abstract description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 abstract description 2
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 abstract description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 238000000748 compression moulding Methods 0.000 abstract 1
- 239000010949 copper Substances 0.000 description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19758385A JPS6258664A (ja) | 1985-09-09 | 1985-09-09 | 放熱性絶縁基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19758385A JPS6258664A (ja) | 1985-09-09 | 1985-09-09 | 放熱性絶縁基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6258664A true JPS6258664A (ja) | 1987-03-14 |
| JPH0337310B2 JPH0337310B2 (enrdf_load_stackoverflow) | 1991-06-05 |
Family
ID=16376900
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19758385A Granted JPS6258664A (ja) | 1985-09-09 | 1985-09-09 | 放熱性絶縁基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6258664A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01123352U (enrdf_load_stackoverflow) * | 1988-02-15 | 1989-08-22 | ||
| JPH04162756A (ja) * | 1990-10-26 | 1992-06-08 | Toshiba Corp | 半導体モジュール |
| JP2002043632A (ja) * | 2000-07-21 | 2002-02-08 | Citizen Electronics Co Ltd | 発光ダイオード |
-
1985
- 1985-09-09 JP JP19758385A patent/JPS6258664A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01123352U (enrdf_load_stackoverflow) * | 1988-02-15 | 1989-08-22 | ||
| JPH04162756A (ja) * | 1990-10-26 | 1992-06-08 | Toshiba Corp | 半導体モジュール |
| JP2002043632A (ja) * | 2000-07-21 | 2002-02-08 | Citizen Electronics Co Ltd | 発光ダイオード |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0337310B2 (enrdf_load_stackoverflow) | 1991-06-05 |
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