JPS6258547B2 - - Google Patents
Info
- Publication number
- JPS6258547B2 JPS6258547B2 JP17888680A JP17888680A JPS6258547B2 JP S6258547 B2 JPS6258547 B2 JP S6258547B2 JP 17888680 A JP17888680 A JP 17888680A JP 17888680 A JP17888680 A JP 17888680A JP S6258547 B2 JPS6258547 B2 JP S6258547B2
- Authority
- JP
- Japan
- Prior art keywords
- fins
- cooling device
- fin
- cooling path
- boiling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001816 cooling Methods 0.000 claims description 37
- 239000007788 liquid Substances 0.000 claims description 20
- 239000003507 refrigerant Substances 0.000 claims description 15
- 238000009835 boiling Methods 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 3
- 239000007789 gas Substances 0.000 description 6
- 230000005494 condensation Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17888680A JPS57103338A (en) | 1980-12-19 | 1980-12-19 | Boiling cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17888680A JPS57103338A (en) | 1980-12-19 | 1980-12-19 | Boiling cooling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57103338A JPS57103338A (en) | 1982-06-26 |
| JPS6258547B2 true JPS6258547B2 (ko) | 1987-12-07 |
Family
ID=16056412
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17888680A Granted JPS57103338A (en) | 1980-12-19 | 1980-12-19 | Boiling cooling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57103338A (ko) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59232448A (ja) * | 1983-06-16 | 1984-12-27 | Fujitsu Ltd | 液冷容器 |
| JPS60761A (ja) * | 1983-06-17 | 1985-01-05 | Fujitsu Ltd | 液冷モジユ−ル |
| JPS60254700A (ja) * | 1984-05-31 | 1985-12-16 | 富士通株式会社 | 冷却液浸漬回路基板 |
| US4833567A (en) * | 1986-05-30 | 1989-05-23 | Digital Equipment Corporation | Integral heat pipe module |
| JPH0727637Y2 (ja) * | 1989-12-22 | 1995-06-21 | 富士通株式会社 | 浸漬冷却構造 |
| US5529115A (en) * | 1994-07-14 | 1996-06-25 | At&T Global Information Solutions Company | Integrated circuit cooling device having internal cooling conduit |
| US6019167A (en) * | 1997-12-19 | 2000-02-01 | Nortel Networks Corporation | Liquid immersion cooling apparatus for electronic systems operating in thermally uncontrolled environments |
| KR100461721B1 (ko) * | 2002-05-27 | 2004-12-14 | 삼성전기주식회사 | 리드 방열 세라믹 패키지 |
| DE102014213108B3 (de) * | 2014-07-07 | 2015-11-05 | Robert Bosch Gmbh | Leistungsmodul mit Fluidkühlung |
-
1980
- 1980-12-19 JP JP17888680A patent/JPS57103338A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57103338A (en) | 1982-06-26 |
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