JPS6258149B2 - - Google Patents
Info
- Publication number
- JPS6258149B2 JPS6258149B2 JP57104350A JP10435082A JPS6258149B2 JP S6258149 B2 JPS6258149 B2 JP S6258149B2 JP 57104350 A JP57104350 A JP 57104350A JP 10435082 A JP10435082 A JP 10435082A JP S6258149 B2 JPS6258149 B2 JP S6258149B2
- Authority
- JP
- Japan
- Prior art keywords
- tray
- die
- conveyor
- wafer ring
- refilling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10P72/0446—
-
- H10P72/16—
-
- H10P72/3411—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57104350A JPS58220442A (ja) | 1982-06-17 | 1982-06-17 | ダイ詰め換え装置におけるトレ−搬送装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57104350A JPS58220442A (ja) | 1982-06-17 | 1982-06-17 | ダイ詰め換え装置におけるトレ−搬送装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58220442A JPS58220442A (ja) | 1983-12-22 |
| JPS6258149B2 true JPS6258149B2 (enExample) | 1987-12-04 |
Family
ID=14378430
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57104350A Granted JPS58220442A (ja) | 1982-06-17 | 1982-06-17 | ダイ詰め換え装置におけるトレ−搬送装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58220442A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2520508Y2 (ja) * | 1989-07-28 | 1996-12-18 | ニチデン機械株式会社 | 部品整列装置 |
-
1982
- 1982-06-17 JP JP57104350A patent/JPS58220442A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58220442A (ja) | 1983-12-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3132353B2 (ja) | チップの搭載装置および搭載方法 | |
| KR100874856B1 (ko) | 반도체 패키지 제조용 절단 및 핸들링 장치 | |
| CN112247538A (zh) | 一种能够自动上料的块状电池插壳设备 | |
| JP2808259B2 (ja) | チップ自動ローディング装置 | |
| JPH0964148A (ja) | ウェーハリングの供給・返送装置 | |
| JPH05183022A (ja) | チップ自動選別搬送装置 | |
| JPS6258148B2 (enExample) | ||
| JPS6258149B2 (enExample) | ||
| JP3710902B2 (ja) | リードフレームの分離搬送装置 | |
| CN116002153A (zh) | 编带机构及相应的在线模块包装转换机 | |
| CN117262685B (zh) | 一种机械叉手 | |
| JPH0992664A (ja) | チップの搭載装置 | |
| CN111942860B (zh) | 一种全自动烧录系统及烧录方法 | |
| JPH0977240A (ja) | ワ−ク排出機構 | |
| TWI436445B (zh) | 改良的網狀區塊總成 | |
| JP2542685B2 (ja) | プリント配線基板投入装置 | |
| CN216871904U (zh) | 一种集成电路封装的生产线 | |
| KR101646974B1 (ko) | 베어칩 포장 장치 | |
| CN222469846U (zh) | 一种分拣机构、输送检测装置及自动分拣设备 | |
| JP2566897Y2 (ja) | 板材仕分け集積装置 | |
| KR100833935B1 (ko) | 테이핑 검사장치 | |
| JP3789837B2 (ja) | ワーク処理装置 | |
| JPS6262053B2 (enExample) | ||
| JP2002053107A (ja) | 自動包装機における袋供給装置 | |
| JPH04341434A (ja) | 板材の分離装置 |