JPS6258149B2 - - Google Patents

Info

Publication number
JPS6258149B2
JPS6258149B2 JP10435082A JP10435082A JPS6258149B2 JP S6258149 B2 JPS6258149 B2 JP S6258149B2 JP 10435082 A JP10435082 A JP 10435082A JP 10435082 A JP10435082 A JP 10435082A JP S6258149 B2 JPS6258149 B2 JP S6258149B2
Authority
JP
Japan
Prior art keywords
tray
die
conveyor
wafer ring
refilling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP10435082A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58220442A (ja
Inventor
Noboru Fujino
Seiichi Chiba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP10435082A priority Critical patent/JPS58220442A/ja
Publication of JPS58220442A publication Critical patent/JPS58220442A/ja
Publication of JPS6258149B2 publication Critical patent/JPS6258149B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP10435082A 1982-06-17 1982-06-17 ダイ詰め換え装置におけるトレ−搬送装置 Granted JPS58220442A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10435082A JPS58220442A (ja) 1982-06-17 1982-06-17 ダイ詰め換え装置におけるトレ−搬送装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10435082A JPS58220442A (ja) 1982-06-17 1982-06-17 ダイ詰め換え装置におけるトレ−搬送装置

Publications (2)

Publication Number Publication Date
JPS58220442A JPS58220442A (ja) 1983-12-22
JPS6258149B2 true JPS6258149B2 (enrdf_load_stackoverflow) 1987-12-04

Family

ID=14378430

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10435082A Granted JPS58220442A (ja) 1982-06-17 1982-06-17 ダイ詰め換え装置におけるトレ−搬送装置

Country Status (1)

Country Link
JP (1) JPS58220442A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2520508Y2 (ja) * 1989-07-28 1996-12-18 ニチデン機械株式会社 部品整列装置

Also Published As

Publication number Publication date
JPS58220442A (ja) 1983-12-22

Similar Documents

Publication Publication Date Title
JP3132353B2 (ja) チップの搭載装置および搭載方法
KR100874856B1 (ko) 반도체 패키지 제조용 절단 및 핸들링 장치
CN112247538A (zh) 一种能够自动上料的块状电池插壳设备
JP2808259B2 (ja) チップ自動ローディング装置
CN1260905A (zh) 托架储存和提供装置
JPH0964148A (ja) ウェーハリングの供給・返送装置
JPH05183022A (ja) チップ自動選別搬送装置
CN116002153A (zh) 编带机构及相应的在线模块包装转换机
TWI436445B (zh) 改良的網狀區塊總成
JPS6258148B2 (enrdf_load_stackoverflow)
JPS6258149B2 (enrdf_load_stackoverflow)
CN111942860B (zh) 一种全自动烧录系统及烧录方法
JPH0992664A (ja) チップの搭載装置
JPH10172991A (ja) リードフレームの分離搬送装置
JPH0977240A (ja) ワ−ク排出機構
CN114695191A (zh) 带安装器
JP2542685B2 (ja) プリント配線基板投入装置
CN216871904U (zh) 一种集成电路封装的生产线
KR101646974B1 (ko) 베어칩 포장 장치
CN117262685B (zh) 一种机械叉手
CN222469846U (zh) 一种分拣机构、输送检测装置及自动分拣设备
JP2566897Y2 (ja) 板材仕分け集積装置
TW202534012A (zh) 移載裝置
KR100833935B1 (ko) 테이핑 검사장치
JP3789837B2 (ja) ワーク処理装置