JPS6258147B2 - - Google Patents
Info
- Publication number
- JPS6258147B2 JPS6258147B2 JP60290563A JP29056385A JPS6258147B2 JP S6258147 B2 JPS6258147 B2 JP S6258147B2 JP 60290563 A JP60290563 A JP 60290563A JP 29056385 A JP29056385 A JP 29056385A JP S6258147 B2 JPS6258147 B2 JP S6258147B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- wafers
- transfer
- heat treatment
- unloading
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 235000012431 wafers Nutrition 0.000 claims description 396
- 230000007246 mechanism Effects 0.000 claims description 125
- 238000012546 transfer Methods 0.000 claims description 103
- 238000012545 processing Methods 0.000 claims description 79
- 238000012937 correction Methods 0.000 claims description 77
- 238000010438 heat treatment Methods 0.000 claims description 48
- 230000032258 transport Effects 0.000 claims description 29
- 238000011068 loading method Methods 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 10
- 230000007723 transport mechanism Effects 0.000 claims description 8
- 230000008569 process Effects 0.000 claims description 7
- 238000004381 surface treatment Methods 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 238000001035 drying Methods 0.000 description 44
- 239000000872 buffer Substances 0.000 description 42
- 239000007788 liquid Substances 0.000 description 28
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 27
- 238000004140 cleaning Methods 0.000 description 23
- 238000009792 diffusion process Methods 0.000 description 15
- 238000005406 washing Methods 0.000 description 15
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 14
- 230000036544 posture Effects 0.000 description 14
- 239000007789 gas Substances 0.000 description 12
- 238000005530 etching Methods 0.000 description 11
- 230000004308 accommodation Effects 0.000 description 10
- 239000011295 pitch Substances 0.000 description 10
- 238000003756 stirring Methods 0.000 description 10
- 239000000428 dust Substances 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- 229910001873 dinitrogen Inorganic materials 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 239000000126 substance Substances 0.000 description 6
- 238000013459 approach Methods 0.000 description 4
- 238000011109 contamination Methods 0.000 description 4
- 238000007602 hot air drying Methods 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 239000012160 loading buffer Substances 0.000 description 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000012993 chemical processing Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 239000002516 radical scavenger Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000007667 floating Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000004060 metabolic process Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000008213 purified water Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000010129 solution processing Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29056385A JPS61166038A (ja) | 1985-12-25 | 1985-12-25 | ウエハ処理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29056385A JPS61166038A (ja) | 1985-12-25 | 1985-12-25 | ウエハ処理装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP713379A Division JPS5599739A (en) | 1979-01-26 | 1979-01-26 | Wafer treating method and its equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61166038A JPS61166038A (ja) | 1986-07-26 |
| JPS6258147B2 true JPS6258147B2 (de) | 1987-12-04 |
Family
ID=17757643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29056385A Granted JPS61166038A (ja) | 1985-12-25 | 1985-12-25 | ウエハ処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61166038A (de) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0611068B2 (ja) * | 1987-04-02 | 1994-02-09 | 東京エレクトロン株式会社 | 搬送装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5150569A (ja) * | 1974-10-29 | 1976-05-04 | Kyushu Nippon Electric | Uehaatatekaesochi |
| JPS5285461A (en) * | 1976-01-09 | 1977-07-15 | Hitachi Ltd | Continuous treating apparatus for plate form objects |
| JPS52139378A (en) * | 1976-05-17 | 1977-11-21 | Hitachi Ltd | Integrated treatment apparatus for semiconductor wafers |
-
1985
- 1985-12-25 JP JP29056385A patent/JPS61166038A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5150569A (ja) * | 1974-10-29 | 1976-05-04 | Kyushu Nippon Electric | Uehaatatekaesochi |
| JPS5285461A (en) * | 1976-01-09 | 1977-07-15 | Hitachi Ltd | Continuous treating apparatus for plate form objects |
| JPS52139378A (en) * | 1976-05-17 | 1977-11-21 | Hitachi Ltd | Integrated treatment apparatus for semiconductor wafers |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61166038A (ja) | 1986-07-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4282825A (en) | Surface treatment device | |
| US7337792B2 (en) | Liquid processing apparatus and liquid processing method | |
| US9199791B2 (en) | Device and method for buffer-storing a multiplicity of wafer-type workpieces | |
| US6769855B2 (en) | Substrate processing apparatus and substrate processing method | |
| JP4583461B2 (ja) | 基板の搬送方法、基板処理方法、半導体装置の製造方法および基板処理装置 | |
| KR100914764B1 (ko) | 기판처리장치 및 기판처리방법 | |
| JP4359640B2 (ja) | 基板搬送装置及びダウンフロー制御方法 | |
| JP4342745B2 (ja) | 基板処理方法および半導体装置の製造方法 | |
| US20060081181A1 (en) | Film forming system and film forming method | |
| JP2018098301A (ja) | 基板処理装置 | |
| KR102529592B1 (ko) | 반도체 웨이퍼를 세정하기 위한 장치 및 방법 | |
| JP2002246432A (ja) | 基板処理装置 | |
| JP2005085896A (ja) | 処理システム及び処理方法 | |
| KR20120011798A (ko) | 이온 공급 장치 및 이것을 구비한 피처리체의 처리 시스템 | |
| JP2005079250A (ja) | 基板処理装置 | |
| JPS6258147B2 (de) | ||
| JP4709912B2 (ja) | 基板処理方法および半導体装置の製造方法 | |
| JP3098547B2 (ja) | キャリアストッカ | |
| JP2001298011A (ja) | 基板洗浄装置 | |
| JP2006073573A (ja) | ストッカ付ウエーハ洗浄装置 | |
| JPH06302585A (ja) | 基板ウェット処理方法および装置 | |
| JP2002246436A (ja) | 基板処理装置 | |
| JP2001319915A5 (de) | ||
| JPH0590388A (ja) | 移替装置 | |
| CN117542771A (zh) | 芯片的搬送方法 |