JP2005085896A - 処理システム及び処理方法 - Google Patents
処理システム及び処理方法 Download PDFInfo
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- JP2005085896A JP2005085896A JP2003314578A JP2003314578A JP2005085896A JP 2005085896 A JP2005085896 A JP 2005085896A JP 2003314578 A JP2003314578 A JP 2003314578A JP 2003314578 A JP2003314578 A JP 2003314578A JP 2005085896 A JP2005085896 A JP 2005085896A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
【解決手段】複数枚の基板Wを処理するシステム1において,複数枚の基板Wを収納するキャリアCAから複数枚の基板Wを一括して取り出し,キャリアCAに複数枚の基板Wを一括して収納する複数枚搬送装置40と,キャリアCBの任意の箇所から一枚の基板MWを取り出し,前記複数枚搬送装置40の任意の箇所に一枚の基板MWを受け渡す一枚搬送装置41と,を備えた。
【選択図】図1
Description
MW モニターウェハ
W ウェハ
1 処理システム
3 ウェハ搬送ユニット
5 処理ユニット
40 複数枚搬送装置
41 一枚搬送装置
46 搬送アーム
61 一枚搬送アーム
76 基板処理装置
85 ロータ回転機構
92 ロータ
Claims (6)
- 複数枚の基板を処理するシステムであって,
複数枚の基板を収納するキャリアから複数枚の基板を一括して取り出し,キャリアに複数枚の基板を一括して収納する複数枚搬送装置と,
キャリアの任意の箇所から一枚の基板を取り出し,前記複数枚搬送装置の任意の箇所に一枚の基板を受け渡す一枚搬送装置と,を備えたことを特徴とする,処理システム。 - 複数枚の基板を処理するシステムであって,
基板を処理流体で処理する処理部と,
前記処理部において複数枚の基板を保持する基板保持機構と,
複数枚の基板を収納するキャリアから複数枚の基板を一括して取り出し,前記基板保持機構に複数枚の基板を一括して受け渡す複数枚搬送装置と,
キャリアの任意の箇所から一枚の基板を取り出し,前記複数枚搬送装置の任意の箇所に一枚の基板を受け渡す一枚搬送装置と,を備えたことを特徴とする,処理システム。 - 前記一枚搬送装置は,前記複数枚搬送装置の任意の箇所から一枚の基板を取り出し,キャリアの任意の箇所に一枚の基板を収納することを特徴とする,請求項1又は2に記載の処理システム。
- 前記一枚搬送装置は,前記複数枚搬送装置の任意の箇所から一枚の基板を取り出し,待機用の基板収納部の任意の箇所に一枚の基板を受け渡し,
前記待機用の基板収納部の任意の箇所から一枚の基板を取り出し,前記複数枚搬送装置の任意の箇所に一枚の基板を受け渡すことを特徴とする,請求項1,2又は3に記載の処理システム。 - 前記複数枚搬送装置は,所定間隔を空けて略水平に保持された複数の搬送アームと,前記複数の搬送アームを水平方向にスライドさせるスライド機構と,前記複数の搬送アームを鉛直方向の回転中心軸を中心として回転させる回転機構と,前記複数の搬送アームを鉛直方向に昇降させる昇降機構を備えることを特徴とする,請求項1〜4のいずれかに記載の処理システム。
- 複数枚の基板を処理する方法であって,
複数枚の基板を収納したキャリアから,複数枚搬送装置によって複数枚の基板を一括して取り出し,
一枚搬送装置によって,前記複数枚搬送装置に保持された複数枚の基板から任意の基板を取り出し,
前記一枚搬送装置によって,キャリアから検査用の基板を取り出し,前記複数枚搬送装置の基板を取り出した箇所に,前記検査用の基板を受け渡し,
前記複数枚搬送装置によって,基板を処理する処理部に前記複数枚の基板及び検査用の基板を一括して搬入し,前記処理部において前記複数枚の基板及び検査用の基板を処理し,前記複数枚搬送装置によって,処理後の前記複数枚の基板及び検査用の基板を処理部から一括して搬出し,
前記一枚搬送装置によって,前記複数枚搬送装置から検査用の基板を取り出してキャリアに戻し,
前記複数枚搬送装置によって,処理後の複数枚の基板をキャリアに一括して収納することを特徴とする,処理方法。
Priority Applications (2)
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JP2003314578A JP4413562B2 (ja) | 2003-09-05 | 2003-09-05 | 処理システム及び処理方法 |
US10/901,405 US7404409B2 (en) | 2003-09-05 | 2004-07-29 | Substrate processing system and substrate processing method |
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JP2003314578A JP4413562B2 (ja) | 2003-09-05 | 2003-09-05 | 処理システム及び処理方法 |
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JP2005085896A true JP2005085896A (ja) | 2005-03-31 |
JP4413562B2 JP4413562B2 (ja) | 2010-02-10 |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006351864A (ja) * | 2005-06-16 | 2006-12-28 | Tokyo Electron Ltd | 処理システム及び処理方法 |
JP2007123592A (ja) * | 2005-10-28 | 2007-05-17 | Tokyo Electron Ltd | 基板処理装置及びバッチ編成装置並びにバッチ編成方法及びバッチ編成プログラム |
JP2010206041A (ja) * | 2009-03-05 | 2010-09-16 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
US9257319B2 (en) | 2011-06-03 | 2016-02-09 | Tel Nexx, Inc. | Parallel single substrate processing system with alignment features on a process section frame |
US20200343115A1 (en) * | 2017-08-31 | 2020-10-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus and method for inspecting wafer carriers |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100761576B1 (ko) * | 2004-12-24 | 2007-09-27 | 다이닛뽕스크린 세이조오 가부시키가이샤 | 기판 처리장치 |
US7964042B2 (en) * | 2007-07-30 | 2011-06-21 | Dainippon Screen Mfg. Co., Ltd. | Substrate processing apparatus and substrate processing method |
KR101181560B1 (ko) * | 2008-09-12 | 2012-09-10 | 다이닛뽕스크린 세이조오 가부시키가이샤 | 기판처리장치 및 그것에 사용되는 기판반송장치 |
NL2005626C2 (nl) * | 2010-11-04 | 2012-05-07 | Fico Bv | Drager voor gesepareerde elektronische componenten en werkwijze voor visuele inspectie van gesepareerde elektronische componenten. |
JP5829458B2 (ja) * | 2011-08-25 | 2015-12-09 | 株式会社Screenホールディングス | 基板処理装置 |
WO2014082212A1 (en) * | 2012-11-28 | 2014-06-05 | Acm Research (Shanghai) Inc. | Method and apparatus for cleaning semiconductor wafer |
JP6688714B2 (ja) * | 2016-09-29 | 2020-04-28 | 株式会社Screenホールディングス | 基板配列装置および基板配列方法 |
CN113167564B (zh) * | 2018-12-11 | 2023-06-27 | 日商乐华股份有限公司 | 静电电容传感器 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3938436B2 (ja) | 1998-06-05 | 2007-06-27 | 大日本スクリーン製造株式会社 | 基板移載装置およびそれを用いた基板処理装置 |
JP2001274107A (ja) * | 2000-03-28 | 2001-10-05 | Nec Kyushu Ltd | 拡散炉 |
KR100797435B1 (ko) * | 2000-06-30 | 2008-01-24 | 동경 엘렉트론 주식회사 | 액처리장치 |
JP4342745B2 (ja) * | 2000-09-27 | 2009-10-14 | 株式会社日立国際電気 | 基板処理方法および半導体装置の製造方法 |
CN1608308A (zh) * | 2001-11-13 | 2005-04-20 | Fsi国际公司 | 微型电子基片的自动化加工用的减少占地的工具 |
-
2003
- 2003-09-05 JP JP2003314578A patent/JP4413562B2/ja not_active Expired - Fee Related
-
2004
- 2004-07-29 US US10/901,405 patent/US7404409B2/en not_active Expired - Fee Related
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006351864A (ja) * | 2005-06-16 | 2006-12-28 | Tokyo Electron Ltd | 処理システム及び処理方法 |
JP2007123592A (ja) * | 2005-10-28 | 2007-05-17 | Tokyo Electron Ltd | 基板処理装置及びバッチ編成装置並びにバッチ編成方法及びバッチ編成プログラム |
JP4688637B2 (ja) * | 2005-10-28 | 2011-05-25 | 東京エレクトロン株式会社 | 基板処理装置及びバッチ編成装置並びにバッチ編成方法及びバッチ編成プログラム |
US8002511B2 (en) | 2005-10-28 | 2011-08-23 | Tokyo Electron Limited | Batch forming apparatus, substrate processing system, batch forming method, and storage medium |
KR101071326B1 (ko) | 2005-10-28 | 2011-10-07 | 도쿄엘렉트론가부시키가이샤 | 배치 형성 장치, 기판 처리 시스템, 배치 형성 방법 및 배치 형성 프로그램을 기록한 기록 매체 |
JP2010206041A (ja) * | 2009-03-05 | 2010-09-16 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
US9257319B2 (en) | 2011-06-03 | 2016-02-09 | Tel Nexx, Inc. | Parallel single substrate processing system with alignment features on a process section frame |
US9293356B2 (en) | 2011-06-03 | 2016-03-22 | Tel Nexx, Inc. | Parallel single substrate processing system |
US9449862B2 (en) | 2011-06-03 | 2016-09-20 | Tel Nexx, Inc. | Parallel single substrate processing system |
US9508582B2 (en) | 2011-06-03 | 2016-11-29 | Tel Nexx, Inc. | Parallel single substrate marangoni module |
US20200343115A1 (en) * | 2017-08-31 | 2020-10-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus and method for inspecting wafer carriers |
US11929271B2 (en) * | 2017-08-31 | 2024-03-12 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus and method for inspecting wafer carriers |
Also Published As
Publication number | Publication date |
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US7404409B2 (en) | 2008-07-29 |
JP4413562B2 (ja) | 2010-02-10 |
US20050051195A1 (en) | 2005-03-10 |
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