JPS6256664B2 - - Google Patents
Info
- Publication number
- JPS6256664B2 JPS6256664B2 JP55184737A JP18473780A JPS6256664B2 JP S6256664 B2 JPS6256664 B2 JP S6256664B2 JP 55184737 A JP55184737 A JP 55184737A JP 18473780 A JP18473780 A JP 18473780A JP S6256664 B2 JPS6256664 B2 JP S6256664B2
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- package
- view
- semiconductor
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W20/432—
-
- H10W70/685—
-
- H10W90/754—
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55184737A JPS57107059A (en) | 1980-12-25 | 1980-12-25 | Semiconductor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55184737A JPS57107059A (en) | 1980-12-25 | 1980-12-25 | Semiconductor package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57107059A JPS57107059A (en) | 1982-07-03 |
| JPS6256664B2 true JPS6256664B2 (index.php) | 1987-11-26 |
Family
ID=16158474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55184737A Granted JPS57107059A (en) | 1980-12-25 | 1980-12-25 | Semiconductor package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57107059A (index.php) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4417266A (en) * | 1981-08-14 | 1983-11-22 | Amp Incorporated | Power and ground plane structure for chip carrier |
| JPS596563A (ja) * | 1982-07-05 | 1984-01-13 | Nec Corp | 集積回路装置 |
| JPS6038841A (ja) * | 1983-08-12 | 1985-02-28 | Hitachi Ltd | 半導体装置 |
| JPS60148148A (ja) * | 1984-01-13 | 1985-08-05 | Nec Corp | 半導体装置 |
| JPS6122358U (ja) * | 1984-07-12 | 1986-02-08 | 株式会社東芝 | ピングリツドアレイパツケ−ジ |
| JP2978533B2 (ja) * | 1990-06-15 | 1999-11-15 | 株式会社日立製作所 | 半導体集積回路装置 |
| JPH06103721B2 (ja) * | 1990-09-25 | 1994-12-14 | 松下電工株式会社 | 半導体チップキャリア |
| KR100582497B1 (ko) * | 2004-02-24 | 2006-05-23 | 삼성전자주식회사 | 정전기 방전 보호 패턴을 포함하는 인쇄회로기판을 갖는 메모리 카드 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5415663A (en) * | 1974-01-10 | 1979-02-05 | Nec Corp | Semiconductor device |
| JPS5185349A (index.php) * | 1975-01-24 | 1976-07-26 | Hitachi Ltd | |
| JPS5272169A (en) * | 1975-12-12 | 1977-06-16 | Nec Corp | Semiconductor device |
-
1980
- 1980-12-25 JP JP55184737A patent/JPS57107059A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57107059A (en) | 1982-07-03 |
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